Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co LtdfiledCriticalNEC Corp
Priority to JP7161576ApriorityCriticalpatent/JPS52154373A/en
Publication of JPS52154373ApublicationCriticalpatent/JPS52154373A/en
PURPOSE: To produce DHD type pellets easily at a high yield by forming ohmic electrodes with poly-Si and thin metal plating layer on one entire main surface of a wafer thereafter dicing the wafer with laser beam, etc.
COPYRIGHT: (C)1977,JPO&Japio
JP7161576A1976-06-171976-06-17Production of semiconductor device
PendingJPS52154373A
(en)