JPS5212578B1 - - Google Patents
Info
- Publication number
- JPS5212578B1 JPS5212578B1 JP45073852A JP7385270A JPS5212578B1 JP S5212578 B1 JPS5212578 B1 JP S5212578B1 JP 45073852 A JP45073852 A JP 45073852A JP 7385270 A JP7385270 A JP 7385270A JP S5212578 B1 JPS5212578 B1 JP S5212578B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Relating To Insulation (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45073852A JPS5212578B1 (en) | 1970-08-25 | 1970-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45073852A JPS5212578B1 (en) | 1970-08-25 | 1970-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5212578B1 true JPS5212578B1 (en) | 1977-04-08 |
Family
ID=13530078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45073852A Pending JPS5212578B1 (en) | 1970-08-25 | 1970-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5212578B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160094972A (en) | 2013-12-09 | 2016-08-10 | 히타치가세이가부시끼가이샤 | Mold-release polyimide film, laminated board having mold-release polyimide film having adhesive layer, laminated board, monolayer or multilayer wiring board having mold-release polyimide film having adhesive layer, and method for manufacturing multilayer wiring board |
| KR20160096606A (en) | 2013-12-09 | 2016-08-16 | 히타치가세이가부시끼가이샤 | Mold-release polyimide film with adhesive layer, laminated board having mold-release polyimide film with adhesive layer, laminated board, single-layer or multilayer wiring board having mold-release polyimide film with adhesive layer, and method for producing multilayer wiring board |
-
1970
- 1970-08-25 JP JP45073852A patent/JPS5212578B1/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160094972A (en) | 2013-12-09 | 2016-08-10 | 히타치가세이가부시끼가이샤 | Mold-release polyimide film, laminated board having mold-release polyimide film having adhesive layer, laminated board, monolayer or multilayer wiring board having mold-release polyimide film having adhesive layer, and method for manufacturing multilayer wiring board |
| KR20160096606A (en) | 2013-12-09 | 2016-08-16 | 히타치가세이가부시끼가이샤 | Mold-release polyimide film with adhesive layer, laminated board having mold-release polyimide film with adhesive layer, laminated board, single-layer or multilayer wiring board having mold-release polyimide film with adhesive layer, and method for producing multilayer wiring board |