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JPS52113197A - Liquid crystal unit - Google Patents

Liquid crystal unit

Info

Publication number
JPS52113197A
JPS52113197A JP2974076A JP2974076A JPS52113197A JP S52113197 A JPS52113197 A JP S52113197A JP 2974076 A JP2974076 A JP 2974076A JP 2974076 A JP2974076 A JP 2974076A JP S52113197 A JPS52113197 A JP S52113197A
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal unit
unifying
save
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2974076A
Other languages
Japanese (ja)
Inventor
Kanemitsu Kubota
Kiyoaki Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Epson Corp
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK, Epson Corp filed Critical Seiko Epson Corp
Priority to JP2974076A priority Critical patent/JPS52113197A/en
Publication of JPS52113197A publication Critical patent/JPS52113197A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE:To save the process and to decrease man-hours and cost, by unifying IC chip with the display unit thru the mixture of metalic powder and organic adhesives, in the electrode plate.
JP2974076A 1976-03-18 1976-03-18 Liquid crystal unit Pending JPS52113197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2974076A JPS52113197A (en) 1976-03-18 1976-03-18 Liquid crystal unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2974076A JPS52113197A (en) 1976-03-18 1976-03-18 Liquid crystal unit

Publications (1)

Publication Number Publication Date
JPS52113197A true JPS52113197A (en) 1977-09-22

Family

ID=12284491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2974076A Pending JPS52113197A (en) 1976-03-18 1976-03-18 Liquid crystal unit

Country Status (1)

Country Link
JP (1) JPS52113197A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5845520U (en) * 1981-09-18 1983-03-26 シャープ株式会社 liquid crystal display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5845520U (en) * 1981-09-18 1983-03-26 シャープ株式会社 liquid crystal display device

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