JPS5150466A - Handamakuno keiseihoho - Google Patents
Handamakuno keiseihohoInfo
- Publication number
- JPS5150466A JPS5150466A JP12434174A JP12434174A JPS5150466A JP S5150466 A JPS5150466 A JP S5150466A JP 12434174 A JP12434174 A JP 12434174A JP 12434174 A JP12434174 A JP 12434174A JP S5150466 A JPS5150466 A JP S5150466A
- Authority
- JP
- Japan
- Prior art keywords
- keiseihoho
- handamakuno
- handamakuno keiseihoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12434174A JPS5150466A (en) | 1974-10-30 | 1974-10-30 | Handamakuno keiseihoho |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12434174A JPS5150466A (en) | 1974-10-30 | 1974-10-30 | Handamakuno keiseihoho |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5150466A true JPS5150466A (en) | 1976-05-04 |
Family
ID=14882946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12434174A Pending JPS5150466A (en) | 1974-10-30 | 1974-10-30 | Handamakuno keiseihoho |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5150466A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS594197A (en) * | 1982-06-30 | 1984-01-10 | 東光株式会社 | Method of soldering to electrode |
JPS59138396A (en) * | 1983-01-28 | 1984-08-08 | 富士通株式会社 | Method of preliminarily soldering chip carrier |
JPS60101937A (en) * | 1983-11-07 | 1985-06-06 | Sony Corp | Manufacture of semiconductor device |
JPS60182797A (en) * | 1984-02-29 | 1985-09-18 | 富士通株式会社 | Method of mounting component |
JPS6345891A (en) * | 1986-08-12 | 1988-02-26 | 飯村 恵次 | Carrier film and method for transcripting solder |
JPH01189942A (en) * | 1988-01-26 | 1989-07-31 | Fujitsu Ltd | Forming method for solder bump |
JPH042139A (en) * | 1990-04-18 | 1992-01-07 | Ibiden Co Ltd | Solder supply plate |
JP2010069364A (en) * | 2008-09-16 | 2010-04-02 | Toshiba Corp | Solid-liquid separation apparatus |
-
1974
- 1974-10-30 JP JP12434174A patent/JPS5150466A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS594197A (en) * | 1982-06-30 | 1984-01-10 | 東光株式会社 | Method of soldering to electrode |
JPS59138396A (en) * | 1983-01-28 | 1984-08-08 | 富士通株式会社 | Method of preliminarily soldering chip carrier |
JPH0373157B2 (en) * | 1983-01-28 | 1991-11-20 | Fujitsu Ltd | |
JPS60101937A (en) * | 1983-11-07 | 1985-06-06 | Sony Corp | Manufacture of semiconductor device |
JPS60182797A (en) * | 1984-02-29 | 1985-09-18 | 富士通株式会社 | Method of mounting component |
JPS6345891A (en) * | 1986-08-12 | 1988-02-26 | 飯村 恵次 | Carrier film and method for transcripting solder |
JPH01189942A (en) * | 1988-01-26 | 1989-07-31 | Fujitsu Ltd | Forming method for solder bump |
JPH042139A (en) * | 1990-04-18 | 1992-01-07 | Ibiden Co Ltd | Solder supply plate |
JP2010069364A (en) * | 2008-09-16 | 2010-04-02 | Toshiba Corp | Solid-liquid separation apparatus |
US8252179B2 (en) | 2008-09-16 | 2012-08-28 | Kabushiki Kaisha Toshiba | Solid-liquid separator |
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