JPS5060421A - - Google Patents
Info
- Publication number
- JPS5060421A JPS5060421A JP10892573A JP10892573A JPS5060421A JP S5060421 A JPS5060421 A JP S5060421A JP 10892573 A JP10892573 A JP 10892573A JP 10892573 A JP10892573 A JP 10892573A JP S5060421 A JPS5060421 A JP S5060421A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10892573A JPS5060421A (de) | 1973-09-29 | 1973-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10892573A JPS5060421A (de) | 1973-09-29 | 1973-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5060421A true JPS5060421A (de) | 1975-05-24 |
Family
ID=14497118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10892573A Pending JPS5060421A (de) | 1973-09-29 | 1973-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5060421A (de) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5346418A (en) * | 1976-10-08 | 1978-04-26 | Seiko Epson Corp | Low melting point alloy |
| JPS60135548A (ja) * | 1983-12-22 | 1985-07-18 | Tokuriki Honten Co Ltd | 歯科用金属材料 |
| JPS60135549A (ja) * | 1983-12-22 | 1985-07-18 | Tokuriki Honten Co Ltd | 歯科用金属材料 |
| JPS6167747A (ja) * | 1984-09-07 | 1986-04-07 | Tokuriki Honten Co Ltd | 歯科用金属練成充填材 |
| JPS6167744A (ja) * | 1984-09-07 | 1986-04-07 | Tokuriki Honten Co Ltd | 歯科用金属練成充填材 |
| JPS63153235A (ja) * | 1987-11-06 | 1988-06-25 | Tokuriki Honten Co Ltd | 歯科用金属練成充填材 |
| US5352542A (en) * | 1992-09-02 | 1994-10-04 | Degussa Aktiengesellschaft | Use of silver alloys as cadium-free brazing solder |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5017092A (de) * | 1973-06-20 | 1975-02-22 |
-
1973
- 1973-09-29 JP JP10892573A patent/JPS5060421A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5017092A (de) * | 1973-06-20 | 1975-02-22 |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5346418A (en) * | 1976-10-08 | 1978-04-26 | Seiko Epson Corp | Low melting point alloy |
| JPS5714425B2 (de) * | 1976-10-08 | 1982-03-24 | ||
| JPS633016B2 (de) * | 1983-12-22 | 1988-01-21 | Tokuriki Honten Kk | |
| JPS60135549A (ja) * | 1983-12-22 | 1985-07-18 | Tokuriki Honten Co Ltd | 歯科用金属材料 |
| JPS60135548A (ja) * | 1983-12-22 | 1985-07-18 | Tokuriki Honten Co Ltd | 歯科用金属材料 |
| JPS633015B2 (de) * | 1983-12-22 | 1988-01-21 | Tokuriki Honten Kk | |
| JPS6167747A (ja) * | 1984-09-07 | 1986-04-07 | Tokuriki Honten Co Ltd | 歯科用金属練成充填材 |
| JPS6167744A (ja) * | 1984-09-07 | 1986-04-07 | Tokuriki Honten Co Ltd | 歯科用金属練成充填材 |
| JPH0253503B2 (de) * | 1984-09-07 | 1990-11-16 | Tokuriki Honten Kk | |
| JPH0253504B2 (de) * | 1984-09-07 | 1990-11-16 | Tokuriki Honten Kk | |
| JPS63153235A (ja) * | 1987-11-06 | 1988-06-25 | Tokuriki Honten Co Ltd | 歯科用金属練成充填材 |
| JPH0469216B2 (de) * | 1987-11-06 | 1992-11-05 | Tokuriki Honten Kk | |
| US5352542A (en) * | 1992-09-02 | 1994-10-04 | Degussa Aktiengesellschaft | Use of silver alloys as cadium-free brazing solder |