JPS599568U - Electronic component mounting structure - Google Patents
Electronic component mounting structureInfo
- Publication number
- JPS599568U JPS599568U JP10403682U JP10403682U JPS599568U JP S599568 U JPS599568 U JP S599568U JP 10403682 U JP10403682 U JP 10403682U JP 10403682 U JP10403682 U JP 10403682U JP S599568 U JPS599568 U JP S599568U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting structure
- component mounting
- wiring board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のリードレス電子部品の実装構造断面図、
第２図は本考案によるリードレス電子部品の実装構造の
一実施例を示す断面図である。
１・・・印刷配線板の絶縁体部、２・・・導電性の印刷
部、３・・・リードレス電子部品、４・・・半田、５・
・・スルーホール、６・・・貫通孔。Figure 1 is a cross-sectional view of the mounting structure of a conventional leadless electronic component.
FIG. 2 is a sectional view showing an embodiment of a leadless electronic component mounting structure according to the present invention. DESCRIPTION OF SYMBOLS 1... Insulator part of printed wiring board, 2... Conductive printed part, 3... Leadless electronic component, 4... Solder, 5...
...Through hole, 6...Through hole.
Claims (1)
ス電子部品を挿入し、両面印刷配線板に対しリードレス
電子部品の軸方向が略直角になるように位置付けし、両
端部を両面印刷配線板の両パターンと電気的に接続する
ようにした電子部品の実装構造。A through-hole is provided in the double-sided printed wiring board, a leadless electronic component is inserted into the through-hole, and the leadless electronic component is positioned so that the axial direction of the leadless electronic component is approximately perpendicular to the double-sided printed wiring board, and both ends are printed on both sides. A mounting structure for electronic components that is electrically connected to both patterns on a wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10403682U JPS599568U (en) | 1982-07-09 | 1982-07-09 | Electronic component mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10403682U JPS599568U (en) | 1982-07-09 | 1982-07-09 | Electronic component mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS599568U true JPS599568U (en) | 1984-01-21 |
Family
ID=30244457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10403682U Pending JPS599568U (en) | 1982-07-09 | 1982-07-09 | Electronic component mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS599568U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288498A (en) * | 1985-06-14 | 1986-12-18 | 株式会社村田製作所 | Electronic component-built-in multilayer ceramic substrate |
-
1982
- 1982-07-09 JP JP10403682U patent/JPS599568U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288498A (en) * | 1985-06-14 | 1986-12-18 | 株式会社村田製作所 | Electronic component-built-in multilayer ceramic substrate |
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