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JPS5994571A - Terminal for soldering - Google Patents

Terminal for soldering

Info

Publication number
JPS5994571A
JPS5994571A JP20303582A JP20303582A JPS5994571A JP S5994571 A JPS5994571 A JP S5994571A JP 20303582 A JP20303582 A JP 20303582A JP 20303582 A JP20303582 A JP 20303582A JP S5994571 A JPS5994571 A JP S5994571A
Authority
JP
Japan
Prior art keywords
plating
soldering
terminal
layer
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20303582A
Other languages
Japanese (ja)
Inventor
Shigeo Shioiri
塩入 重雄
Kazuyuki Futaki
和之 二木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP20303582A priority Critical patent/JPS5994571A/en
Publication of JPS5994571A publication Critical patent/JPS5994571A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001Interlayers, transition pieces for metallurgical bonding of workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To provide a terminal which is inexpensive, is highly resistant to corrosion and has good wettability with solder by plating a thin film of Pd, via an Ni plating layer, on the soldering surface. CONSTITUTION:Ni is first deposited at about 1-2mu is an underlying surface on a terminal part 3 for soldering, thereby forming an Ni layer 4. A thin film of a Pd plating layer 5 is deposited at 0.01-0.10mu, more preferably 0.02-0.06mu on the surface of the layer 4. The conditions of an electrolyte for Pd plating in the stage of the above-mentioned deposition and for forming the same are set at about 0.5-1.0g/l Pd (metal), about 8.5-9.0pH (40 deg.C), about 35-45 deg.C temp. of plating soln., about 5-10A/dm<2> current density and about 4-5s/0.05mu time.

Description

【発明の詳細な説明】 (a)発明の技術分野 本発明は電子部品の半田付は用端子に関する。[Detailed description of the invention] (a) Technical field of the invention The present invention relates to terminals for soldering electronic components.

(b)技術の背景 装置組立の布線接続とか或いはプリント基板回路に実装
する電子部品と前記回路との電気的接続に於ては、半田
を用いない巻付は接続・圧着接続等の接続方法もあるが
、一般的には半田付は用端子を用いてなすことが多い。
(b) Background of the technology For wiring connections in device assembly or electrical connections between electronic components mounted on printed circuit board circuits and said circuits, connection methods such as winding connections and crimping connections that do not use solder are used. Although there are some, soldering is generally done using terminals.

この場合、端子盤とかコネクタとかの接続部品であると
一般の部品端子であるとを間はず、接続にあづかる部品
端子は9表面の耐酸性、耐蝕性に優れ、特に部品貯蔵の
少なくとも6力月程度の長期保存に何等変質のないこと
が要請される。
In this case, it is important to distinguish between connecting parts such as terminal boards and connectors and general component terminals, and the component terminals used for connection have excellent acid resistance and corrosion resistance on the surface, and are especially suitable for storage of parts. It is required that there should be no deterioration during long-term storage of about a month.

本発明は、係る半田付は用部品端子の要請に基づき、耐
蝕性に優れ且つ半田濡れ性の良い端子めっき方法を提示
するものである。
The present invention is based on the demand for component terminals for soldering, and proposes a terminal plating method that has excellent corrosion resistance and good solder wettability.

(C)従来技術の問題点 成形の端子素材は9通常、銅とか黄銅、或いはコネクタ
等ではばね性の有る燐青銅、洋白、ベリリウム銅等が用
い、これを所望形状に成形して端子体を製作する。
(C) Problems with conventional technology The terminal material for forming is usually copper or brass, or for connectors etc., phosphor bronze, nickel silver, beryllium copper, etc., which have spring properties, are used, and this is formed into the desired shape to form the terminal body. Manufacture.

而して、端子体は前記の耐蝕性等の機能を満足する表面
処理として、錫めっき、半田めっき、及び金めつきがさ
れる。
The terminal body is subjected to surface treatments such as tin plating, solder plating, and gold plating to satisfy the functions such as corrosion resistance.

例えば、前記路めっきは安価であり、めっき加工性は良
いが耐蝕性に問題がある。又半田めっき7は、良好な半
田濡れ性を得る為には厚さ5〜10ミクロン〔μm〕程
度の厚膜めっきをかける必要があるがめっきに長時間を
要し量産性に乏しい。
For example, the road plating is inexpensive and has good plating workability, but has a problem with corrosion resistance. Further, in the solder plating 7, in order to obtain good solder wettability, it is necessary to apply a thick film plating with a thickness of about 5 to 10 microns (μm), but the plating takes a long time and is poor in mass productivity.

更に金めつきの場合は、下地に例えば1〜2 (μm〕
のニッケルめっきをかけた後、厚さ0.05 (μm〕
程度の薄膜めっきをなす。金めつきの場合はこの薄膜め
っきでも充分な半田濡れ性が得られるが 近時の価格暴
騰により端子成形コストが高くなることが問題である。
Furthermore, in the case of gold plating, for example, 1 to 2 (μm)
After applying nickel plating, the thickness is 0.05 (μm)
A thin film plating is formed. In the case of gold plating, sufficient solder wettability can be obtained with this thin film plating, but the problem is that the cost of forming terminals has increased due to the recent sharp rise in prices.

(d)発明の目的 本発明は、前記の問題点を解消し、従来の前記金と同等
の半田濡れ性の端子面を安価且つ量産性良く得るように
することである。
(d) Object of the Invention The object of the present invention is to solve the above-mentioned problems and to obtain a terminal surface with solder wettability equivalent to that of the conventional gold at low cost and with good mass production.

(e)発明の構成 前記の目的は、少なくとも半田付は表面に薄膜のパラジ
ウムめっきが施されている半田付は用端子の提供により
達成される。
(e) Structure of the Invention The above object is achieved by providing a terminal for at least soldering, the surface of which is plated with a thin palladium film.

(f)発明の実施例 以下2本発明の一実施例をコネクタに適用する端子表面
処理に就き詳細に説明する。
(f) Embodiments of the Invention Two embodiments of the present invention will be described in detail with regard to terminal surface treatment applied to connectors.

第1図は、マルチワイヤケーブル接続用コネクタの端子
を示す斜視図、第2図はこれに用いる接続子形状を示す
斜視図、及び第3図は本発明にかかる半田付は用端子部
分の断面図である。
FIG. 1 is a perspective view showing a terminal of a connector for multi-wire cable connection, FIG. 2 is a perspective view showing the shape of a connector used therein, and FIG. 3 is a cross-section of a terminal portion for soldering according to the present invention. It is a diagram.

図中、1は絶縁筺体、2は筺体に組込むフラットケーブ
ル4を圧着方式で接続する半田付は用端子を構成する接
続子、3は接続子2と同一体に成形される前記半田付は
用端子部分で、ここは図示にない該コネクタ実装をなす
プリント基板の接続孔に挿入され基板回路と半田付けさ
れる部分となる。前記の接続子2は第2図に示される。
In the figure, 1 is an insulated housing, 2 is a soldered connector that connects a flat cable 4 to be assembled into the housing by crimping, and 3 is a soldered connector that is molded into the same body as the connector 2. This terminal portion is inserted into a connection hole of a printed circuit board (not shown) on which the connector is mounted and is soldered to the circuit board. The aforementioned connector 2 is shown in FIG.

第2図の(イ)は、基本的機械加工が終った接続子2を
、同図(ロ)図は、接続子2の連続的プレス成形になる
めっき前状態を示している。
FIG. 2A shows the connector 2 after basic machining, and FIG.

接続子2は、導電性の良い帯状のばね素材(燐青銅等)
から(ロ)図示の様に連続性を維持して成形される。
Connector 2 is a band-shaped spring material with good conductivity (phosphor bronze, etc.)
From (b), it is molded while maintaining continuity as shown in the figure.

即ち、 (ロ)図示状態の接続子2はその下方部分3が
対象とする半田付けの表面処理部分である。
(b) The lower portion 3 of the connector 2 in the illustrated state is the surface-treated portion for soldering.

次いで、この半田付は表面処理の本発明実施例を第3図
を参照して述べる。
Next, an embodiment of the soldering and surface treatment of the present invention will be described with reference to FIG.

前記成形の接続子2の半田付は用端子部分3はめっき下
地としてニッケルを1〜2 〔μm〕被着する。このニ
ッケル層4は以後のめつき金属であるパラジウム(Pd
)の密着性を良くする為である。
The soldering terminal portion 3 of the molded connector 2 is coated with 1 to 2 μm of nickel as a plating base. This nickel layer 4 is coated with palladium (Pd), which is the plating metal that will be used later.
) to improve adhesion.

ニッケル層4の表面には薄膜のパラジウムめつきN5を
0.01〜0.10 (/jm )好ましくは0.02
〜0゜06〔μm〕被着する。
The surface of the nickel layer 4 is plated with a thin film of palladium N5 of 0.01 to 0.10 (/jm), preferably 0.02
~0°06 [μm] deposited.

Pdめっきの電解液組成とその生成条件は。What is the electrolyte composition of Pd plating and its production conditions?

Pd(金M)   io、5〜1.0g/j2pH(4
層0℃);8.5〜9.0 めっき液温度 ;35〜45℃ 電流密度   :5〜10  A/dn?時   間 
   ;  4〜5 slo、05μmである。
Pd (gold M) io, 5-1.0 g/j2pH (4
layer 0°C); 8.5-9.0 Plating solution temperature; 35-45°C Current density: 5-10 A/dn? time
; 4-5 slo, 05 μm.

即ち、電解液槽温度40℃に於て、4〜5秒間パラジウ
ム(Pd)析出をすれば1層厚さ約0.05〔μm〕の
めっき薄膜が端子面に生成される。
That is, if palladium (Pd) is deposited for 4 to 5 seconds at an electrolyte bath temperature of 40 DEG C., a plating thin film having a thickness of about 0.05 [mu]m per layer is formed on the terminal surface.

然し乍ら、Pdは膜厚が大きくなると自身の圧力と半田
付は時の熱の関係から下地面との密着性が低下する為、
めっき厚さは0.1〔μm〕以下が良<、0.1層μm
〕以下の厚さでも半田濡れ性は良好である。
However, as Pd becomes thicker, its adhesion to the underlying surface decreases due to the relationship between its own pressure and the heat generated during soldering.
The plating thickness should be less than 0.1 [μm], 0.1 layer μm
] Good solder wettability even at thicknesses below.

尚、パラジウムめっき層5の最小薄さは半田付は時の熱
による剥離等の関係から少なくとも0.01〔μm〕は
必要である。
Note that the minimum thickness of the palladium plating layer 5 must be at least 0.01 [μm] in view of peeling due to heat during soldering.

前記の端子表面めっきが終った一連の接続子は。A series of connectors with the terminal surface plating described above.

後工程に於て絶縁筐体とのコネクタ組立てとなる。In the post-process, the connector will be assembled with the insulating casing.

次に前記処理のコネクタ端子について、その半田付は性
を検証する劣化試験の結果を記す。
Next, the results of a deterioration test to verify the solderability of the connector terminals treated as described above will be described.

対象の端子は、PdめっきByさ0.02と0.06 
(μm〕の二種類準備された。
The target terminals are Pd plating By 0.02 and 0.06
(μm) Two types were prepared.

試験に用いた劣化条件は1次の通り。The deterioration conditions used in the test were as follows.

条件1100℃のダンプヒー) (100%湿度)。Conditions: 1100°C dump heat) (100% humidity).

1時間 条件■ 温度40℃、相対湿度90%下で72時間条件
■ 乾燥温度150”c下で16時間前記の各条件を経
た試験サンプルは、 JIS等の規定による端子表面の
半田付は濡れ性について評価したところ全数良結果であ
ることが確認されている。
1 hour condition■ 72 hour condition at a temperature of 40℃ and relative humidity of 90%■ Test sample that has gone through each of the above conditions for 16 hours at a drying temperature of 150"C. When evaluated, it was confirmed that all the results were good.

(g)発明の幼果 前記詳細に説明した本発明の半田付は用端子によれば、
高価な全資源の節減がされ性能的にも全く同等な端子が
安IIIIi (約1/3〜1/2)に実現される。係
る観点から本発明の実用的価値は大きい。
(g) Young fruit of the invention According to the soldering terminal of the invention described in detail above,
All expensive resources are saved, and a terminal with exactly the same performance can be realized at a lower cost (approximately 1/3 to 1/2). From this point of view, the present invention has great practical value.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はマルチワイヤケーブル接続用コネクタの端子を
示す斜視図、第2図はこれに用いる接続子形状を示す斜
視図である。及び第3図は本発明に係る半田付は用端子
を示す断面図である。 第2z
FIG. 1 is a perspective view showing a terminal of a multi-wire cable connector, and FIG. 2 is a perspective view showing the shape of a connector used therein. and FIG. 3 is a sectional view showing a terminal for soldering according to the present invention. 2nd z

Claims (3)

【特許請求の範囲】[Claims] (1)少なくとも半田付は表面に薄膜のパラジウムめっ
きが施されていることを特徴とする半田付は用端子。
(1) A terminal for soldering, characterized in that at least the soldering surface is coated with a thin film of palladium plating.
(2)前記薄膜は0.01〜0.10(μm〕好ましく
は0.02〜0.06 (μm〕の厚さであることを特
徴とした前記特許請求の範囲第1項記載の半田付は用端
子。
(2) The soldering according to claim 1, wherein the thin film has a thickness of 0.01 to 0.10 (μm), preferably 0.02 to 0.06 (μm). is for terminal.
(3)前記パラジウムめっき薄膜はニンケルめっき層を
介して前記半田付は用表面に形成されていることを特徴
とした前記特許請求の範囲第1項記載の半田付は用端子
(3) The soldering terminal according to claim 1, wherein the palladium plating thin film is formed on the soldering surface via a nickel plating layer.
JP20303582A 1982-11-19 1982-11-19 Terminal for soldering Pending JPS5994571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20303582A JPS5994571A (en) 1982-11-19 1982-11-19 Terminal for soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20303582A JPS5994571A (en) 1982-11-19 1982-11-19 Terminal for soldering

Publications (1)

Publication Number Publication Date
JPS5994571A true JPS5994571A (en) 1984-05-31

Family

ID=16467265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20303582A Pending JPS5994571A (en) 1982-11-19 1982-11-19 Terminal for soldering

Country Status (1)

Country Link
JP (1) JPS5994571A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1060420C (en) * 1997-04-18 2001-01-10 清华大学 End electrode of sheet element capable of restoring performance after electroplating, and mfg. method thereof
CN102489807A (en) * 2011-11-28 2012-06-13 苏州工业园区隆盛电器成套设备制造有限公司 Copper-copper brazing process for transformers for rail vehicles

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130496A (en) * 1981-02-06 1982-08-12 Seikoo Keiyo Kogyo Kk Printed board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130496A (en) * 1981-02-06 1982-08-12 Seikoo Keiyo Kogyo Kk Printed board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1060420C (en) * 1997-04-18 2001-01-10 清华大学 End electrode of sheet element capable of restoring performance after electroplating, and mfg. method thereof
CN102489807A (en) * 2011-11-28 2012-06-13 苏州工业园区隆盛电器成套设备制造有限公司 Copper-copper brazing process for transformers for rail vehicles

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