JPS5983285A - Production of card - Google Patents
Production of cardInfo
- Publication number
- JPS5983285A JPS5983285A JP57193830A JP19383082A JPS5983285A JP S5983285 A JPS5983285 A JP S5983285A JP 57193830 A JP57193830 A JP 57193830A JP 19383082 A JP19383082 A JP 19383082A JP S5983285 A JPS5983285 A JP S5983285A
- Authority
- JP
- Japan
- Prior art keywords
- side member
- card
- adhesive
- rear side
- front side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はＩＣなどの電子部品を内蔵するプラスチックカ
ードの製造方法において、ＩＣなどの電子部品に當温ま
り高い熱や圧力を与えないで製造−４ーる方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing plastic cards incorporating electronic components such as ICs, in which electronic components such as ICs are manufactured without applying high heat or pressure. be.
従来より一般に用いられているキャッシュカード、クレ
ジットカードなどの製造方法は、三層構成で、カード表
裏面のオーバーシート層とそれらに介在するセンターコ
ア層を積層し，必要な場合はそれらの層間に接着剤層を
介在させた上、平圧ブレス板により圧力１００Ｋｇ／ｃ
ｍ３前後をかけ、温度１４０℃前後で熱融着（接着剤を
必要とする場合は、その接着剤に見合った温度）させこ
れらのラミネ−ト後に、オス、メス型を使用して一枚の
カードの形匠拐抜成形を行なっている。しかしＩＣカー
ドの製造方法に用いる場合、この方法ではラミネートの
際の加圧加熱で、ＩＣが破壊されるので以下の様な改良
で製造が行われている。三層以上の層構成により、セン
ターコア層に形成した穴にＩＣを設置し、他のオーバー
シート層などを積層した後に、層間に接着剤層を介在さ
せた上、平圧プレス板により圧力１３〜３５Ｋｇ／ｃｍ
２、温度７０℃〜１２０℃によりラミネート加工し、そ
の後オス、メス型を使用してカードの形に打抜成形して
いる。しかしこの方法でも、ラミネートの際に加わる熱
と圧力がそのままＩＣも受け且つ打抜成形の際の衝撃力
をも受けることになり危険な要素がまだ多い。The conventional manufacturing method for cash cards, credit cards, etc. has a three-layer structure, in which an oversheet layer on the front and back sides of the card and a center core layer interposed between them are laminated, and if necessary, a layer is added between these layers. A pressure of 100 kg/c is applied using a flat press plate with an adhesive layer interposed.
After laminating them, heat-seal them at a temperature of around 140℃ (if an adhesive is required, use a temperature appropriate for the adhesive). We are engaged in the molding of cards. However, when used in a method for manufacturing IC cards, the IC is destroyed by pressure and heating during lamination, so the following improvements have been made in manufacturing. With a layer structure of three or more layers, an IC is installed in a hole formed in the center core layer, and after laminating other oversheet layers, an adhesive layer is interposed between the layers, and a pressure of 13 cm is applied using a flat press plate. ~35Kg/cm
2. It is laminated at a temperature of 70°C to 120°C, and then punched into a card shape using male and female dies. However, even with this method, there are still many dangerous elements since the IC is also subjected to the heat and pressure applied during lamination and is also subjected to impact force during punching.
本発明は、上記の如くの現況に鑑みなされたものであり
、その目的とするところは、ｌＣを含んだカード？加熱
加圧を必要としない接着剤を用いて、各層？ラミネート
する製造方法を用いることにより、ＩＣの加熱加圧によ
る破壊を防止することが出来るようにし、さらに衝撃力
が加わることを避けるため打抜成形を行なわない製造方
法を提供することにある。The present invention was made in view of the above-mentioned current situation, and its purpose is to provide a card containing IC. Each layer using an adhesive that does not require heat and pressure? It is an object of the present invention to provide a manufacturing method in which ICs can be prevented from being destroyed by heating and pressurization by using a manufacturing method involving lamination, and furthermore, in order to avoid the application of impact force, punching is not performed.
以下に本発明の一実施例を図面を参照しながら説明する
。An embodiment of the present invention will be described below with reference to the drawings.
カード（１）の主な構成は、第１図に示すごとく表側部
材（２）と裏側部材（３）よりなり、各部材とも、それ
ぞれ１層以上の材材を積層して形成される。The main structure of the card (1), as shown in FIG. 1, consists of a front side member (2) and a back side member (3), each of which is formed by laminating one or more layers of materials.
前記裏側部旧（３）の構成については、第２図に示すご
とくバンク中イオーバーシート（９）、センターコア（
８）、サブセンターコア（７）の６層よりなり、加工方
法はまず、ＩＣを収納する為のＩＣ設置穴（４）をセン
ターコア（８）、サブセンターコア（力に、ＩＣの形状
に応じた形にそれぞれ打抜加工しておき、前記ザブセン
ターコア（７）のＩＣ設置穴（４）の大きさを、前記セ
ンターコア（８）の大きさよりも各辺数ミリメートル大
きくしておき、ＩＣが収納されるケースのつばを受けと
める形状にしておき、ケースを固定するために役だてる
。また本実施例における表側部材（２）、裏側部材（３
）の材料は、プラスチックのうちカード口料として一般
的に便用されている硬質塩化ビニールを用いる場合とし
ている。前記センターコア（８）の両面およびサブセン
ターコア（７）のセンターコア（８）に対向する面には
接着剤を塗布して、バックオーバーシート（９）の表面
側にはあらかじめ必要により印刷（６）を施しておき、
さらに印刷（６）上にインキ層保護用のオーバーコート
層を設けた方が良い。Regarding the configuration of the old back side (3), as shown in Figure 2, the bank middle oversheet (9), center core (
8), consists of 6 layers of sub-center core (7), the processing method is to first create an IC installation hole (4) for storing the IC, then insert the center core (8) and sub-center core (to form the shape of the IC). Each is punched into a corresponding shape, and the size of the IC installation hole (4) of the sub center core (7) is made several millimeters larger on each side than the size of the center core (8). It is shaped to receive the brim of the case in which the IC is stored, and is useful for fixing the case.Furthermore, in this embodiment, the front side member (2) and the back side member (3)
) is assumed to be made of hard vinyl chloride, which is commonly used as a card opening among plastics. Adhesive is applied to both sides of the center core (8) and the surface of the sub-center core (7) facing the center core (8), and printing ( 6),
Furthermore, it is better to provide an overcoat layer for protecting the ink layer on the printing (6).
前記接着剤は、熱再活性型接着剤が良好であり、人日本
インキ（株）製のＤタイト１△Ｘ−１５００ＩＫを使用
１オーろのが艮い。また印刷に用いる印刷インキとして
は、インキ層が表面に形成されるため、シルクインギ遣
−が適当であり、例えば塩化ビニル系インキがあげられ
、また、オーバーコ−ト剤としては、塩化ビニル系、塩
化ビニル耐酸ビニル系、エボキノ系、ウレタン系の各ワ
ニスなどを用いるのが良い。The adhesive used is a heat-reactivated adhesive, and D-Tight 1ΔX-1500IK manufactured by Nippon Ink Co., Ltd. is preferably used. Furthermore, since an ink layer is formed on the surface, silk ink is suitable as the printing ink used for printing, such as vinyl chloride ink, and overcoating agents such as vinyl chloride, chloride, It is preferable to use acid-resistant vinyl, evokino, or urethane varnishes.
次に前記の６つの層を積層して、カードの裏側部材（３
）を成形する際、加熱加圧の方法を用いる場合、ＩＣ設
置用の四部が加熱加圧により変形することを防ぐため、
充填物をはめ合わせ、また充填物カバツクオーバーシー
ト（９）、センターコア（８）、ザブセンターコア（７
）に接着しないようにイろために、接着剤で接着するこ
とのできない合成樹脂フィルム等（この場合は極薄のポ
リエステルフィルム）をあてがい、第３図のように積層
することにより加熱加圧プレスにおいてＴＣ設置穴が変
形することがなく、且つ全体に均一な加圧力が作用し極
めて良好なカード表面状態を得ることができろ。Next, the six layers described above are laminated, and the back side of the card (3
), when using the heating and pressing method, to prevent the four parts for IC installation from deforming due to heating and pressing.
Fit the filling, and filler cover cover sheet (9), center core (8), sub center core (7).
) to avoid adhesion, apply a synthetic resin film, etc. that cannot be bonded with adhesive (in this case, an ultra-thin polyester film), and stack the layers as shown in Figure 3, using a hot pressure press. In this case, the TC installation hole will not be deformed, and a uniform pressing force will be applied to the entire surface, so that an extremely good card surface condition can be obtained.
前記ポリエステルフィルムは東し株式会社製ルミラーを
用い、また前記充填物は、センターコア（８）ザブセン
ターコア（７）を打ち抜きした際の打ち抜き部を用いる
のが形状及び厚みを周囲と同一にするために良い。なお
、第３図においては、ポリエステルフィルムの厚さによ
る浮き上がりを無視して図示してあるが、使用するフィ
ルムは厚さ３０μｍであり、その分の厚さの増加は無視
し得る。次に加熱加圧プレスの条件は、接着剤の再活性
反応に適合し、所望の接着強度を得るに足る値であり。Lumirror manufactured by Toshi Co., Ltd. is used as the polyester film, and the punched portion of the center core (8) and the subcenter core (7) are used as the filler so that the shape and thickness are the same as those of the surrounding area. Good for. In addition, in FIG. 3, the lifting due to the thickness of the polyester film is ignored, but the film used has a thickness of 30 μm, and the increase in thickness can be ignored. Next, the conditions of the hot press are suitable for the reactivation reaction of the adhesive and are sufficient to obtain the desired adhesive strength.
且つ■Ｃ設置穴（４）を変形させることのない条件でも
あるように、２４Ｋｇ／ｃｍ２の圧力、８０℃の温度の
下で５分間プレスするようにするのが良い。それは例え
ば温度を１００℃に上昇させて行なった場合、ＩＣ設置
穴は熱により、各辺１ミリメートル程度に広がってしま
い、充填物を入れることに、１、ろ変形防止の１」的が
失なわれることになるからである。またこの条件でプレ
スする際、圧力が２４Ｋｇ／ｃｍ２というように、一般
のカードをラミネーションする際の約１／４の圧力でし
がない為、プレス板と接触するカード表面ｖｃは、あば
た（カード表面とプレス板との間に空気層が残留するこ
とによりカード表面に形成される数十ミクロンの深さの
四部）が発生しやすくなるので、サンドマット加工をし
たポリエステルフィルム等のマット面を対面させて、カ
ード表面をマット加工するのが良い。In addition, it is preferable to press for 5 minutes at a pressure of 24 kg/cm 2 and a temperature of 80° C. so that the C installation hole (4) is not deformed. For example, if the temperature is raised to 100℃, the IC installation hole will expand to about 1 mm on each side due to the heat, and the purpose of filling the hole will be lost. This is because you will be killed. In addition, when pressing under these conditions, the pressure is 24 kg/cm2, which is about 1/4 of the pressure used when laminating ordinary cards, so the card surface VC that comes into contact with the press plate is pocked (the card surface and If an air layer remains between the card and the press plate, it is easy to form a crack (a few tens of microns deep) on the surface of the card. , it is better to give the card surface a matte finish.
このようにしてラミネ−トされたカード裏側部穴（３）
のＩＣ設置穴（４）より充填物をとりのぞくことにより
第１図に示すような形状で所望のＩＣ設置穴（４）が得
られ、またカートの仕上り状態になるように、オス、メ
ス型を使用してＩＣ設置穴（４）や印刷の位置を正確に
保持して打ち抜き、カードの裏側部材（３）を完成させ
る。Hole on the back side of the card laminated in this way (3)
By removing the filling material from the IC installation hole (4), you can obtain the desired IC installation hole (4) in the shape shown in Figure 1. Also, insert the male and female molds so that the cart is finished. The card is punched out while accurately holding the IC installation hole (4) and the printing position to complete the back side member (3) of the card.
次にカードの表側部材（２）の製造法を以下に述べる。Next, a method for manufacturing the front side member (2) of the card will be described below.
まず、表面に必要に応じて印刷（６）を行ない、さらに
は、必要に応じ前記オーバーコート剤を塗布し、また第
４図に示すように必要に応じて所定の位置に磁気テープ
（１１）を接着し、この後、磁気テープを埋込むため、
また、裏側部ηに３）と同一表面状態にするために前記
裏側部材（３）と同様にマント加工したポリエステルフ
ィルムのマット面な表側部材（２）表面に対向させてプ
レスするがカード表面部材（２）の厚さがうすいため、
温度１４０℃、圧力１６０Ｋｇ／ｃｍ２、時間５分間の
条件で加熱加圧によるプレス加工をする。次に、ＩＣの
外部接続端子にあたる部分に、ＩＣ端子穴（５）を打抜
加工する。そして、後に表側部材（２）と裏側部材（３
）を接着する際接着液がはみ出すため、カードの外周端
部分を体裁良く整えるため、カードの表側部材（２）の
縁を仕上りより、第５図に示す様に大きめにしておき、
（本実施例では３ミリメートルほど）その後、仕上りの
寸法に断裁することにより仕上りの外形を完成させるも
のである。そして出来上がった両部材がカードとしての
表裏見当が合うようにする為に、表側部材（２）の裏側
部材（３）に接する面に目印用のマーク（トンボ）を書
き入れる。First, print (6) is performed on the surface as necessary, and then the overcoat agent is applied as necessary, and as shown in FIG. and then embed the magnetic tape,
In addition, in order to make the back side part η the same surface state as 3), press the front side member (2), which is a matte surface of a polyester film that has been coated in the same way as the back side member (3), to face the surface of the card front member. Because the thickness of (2) is thin,
Pressing is carried out by heating and pressing at a temperature of 140°C, a pressure of 160 kg/cm2, and a time of 5 minutes. Next, an IC terminal hole (5) is punched in a portion corresponding to an external connection terminal of the IC. Then, later, the front side member (2) and the back side member (3)
) When gluing the card, the adhesive liquid will spill out, so in order to make the outer edge of the card look nice, the edge of the front side member (2) of the card should be made larger than the final finish, as shown in Figure 5.
Thereafter, the finished outer shape is completed by cutting to the finished size (about 3 mm in this embodiment). Then, in order to ensure that the front and back sides of the two completed members are aligned as cards, marks (register marks) are written on the surface of the front member (2) that contacts the back member (3).
以上のようにしてそれぞれの部材を準備し、裏他部材（
３）のＩＣ設置穴（４）にＩＣを設置し、且つカード表
裏の位置合せを行ない、接着剤を対向する両面に塗布し
接着する。接着剤は、常温で作用し、かつＩＣに悪影響
するような加圧をしなくても接着できる溶剤系接着剤で
、たとえば２−ブタンを主剤とする筒中プラスチック株
式会社製サンロイド・セメント＃１０００Ｄを使用する
のが良く、他に２液反応型接着剤でも可能である。Prepare each member as described above, and prepare the other parts on the back (
Install the IC in the IC installation hole (4) of 3), align the front and back of the card, and apply adhesive to both opposing sides to adhere. The adhesive is a solvent-based adhesive that works at room temperature and can be bonded without applying pressure that would adversely affect the IC. It is best to use a two-component reactive adhesive.
このようにして接着剤が固化した後、第５図に示すよう
に、あらかじめ大きめにしておいたカード表側部（２）
の余分な部分を、すでに仕上りの状態のカードの表側部
材（３）の外周にそって断裁し、第６図に示すようにカ
ードを成形する。After the adhesive has hardened in this way, as shown in Figure 5, the front side of the card (2), which has been made larger in advance,
The extra portion is cut along the outer periphery of the front side member (3) of the already finished card, and the card is formed as shown in FIG.
本発明は以上のごときであるので以下のごとき効果を生
じる。すなわらラミネートの際の加熱加圧によるＩＣの
破壊を防ぐため、加熱加圧を必要としない溶剤系接着剤
や２液反応型接着剤を用いることにより、ＩＣに全く圧
力と熱を加えろことがなく、また裏側部材（３）をあら
かじめ最終製品の大きさに成形しておいて最終のカード
外形成形として表側部材（２）の外周部の余分な部分を
断裁することにより、ＩＣに衝撃力をあたえることがな
くなることにより、本発明におけるカード製造法はカー
ド製造段階におげろ不良率を低（おさえることが出来極
めて有用なもθ）である０、また裏側Ｆ？Ｂ月をセンタ
ーコア、サブセンターコア、バックオーバーシートの６
層を加熱加圧ラミネーションしているので、カードとし
て必要な剛性を持たせることが出来る。Since the present invention is as described above, it produces the following effects. In other words, in order to prevent ICs from being destroyed by heat and pressure during lamination, it is possible to apply no pressure and heat to the IC by using solvent-based adhesives or two-component reactive adhesives that do not require heat and pressure. In addition, by forming the back side member (3) in advance to the size of the final product and cutting off the excess portion of the outer periphery of the front side member (2) as the final card external shape, there is no impact on the IC. By eliminating the need to apply force, the card manufacturing method of the present invention can reduce the defective rate at the card manufacturing stage (which is extremely useful). B month with center core, sub-center core, back over seat 6
Since the layers are laminated under heat and pressure, the card can have the necessary rigidity.
第１図はカードの表側部材、及び裏側部材の各断面図、
第２図はセンターコア、サブセンターコア、及びアンダ
ーシートの各断面図、第３図は、カードの裏側部材に充
填物を入れた所の断面図、第４図はカードの表側部材に
端子穴、磁気テープを設けた所の断面図、第５図はカー
ド裏側部材にＩＣを入れ表側部材を設けた所の断面図、
第６図は完成したカードの外観図。
（１）・・・カード （２）・・・表側部材
（３）・・・表側部材 （４）・・・ＩＣ設置
穴（５）・・・端子穴 （６）・・・印刷（
７）・・・サブセンターコア （８）・・・センターコ
ア（９）・・・バックオーバーシート（１０）・・・充
填物（１１）・・・磁気テープ （１２）・・・Ｉ
Ｃ特許出願人
凸版印刷株式会社
代表者鈴木相人
第Ｊ、図 第２図Figure 1 is a cross-sectional view of the front side member and back side member of the card,
Figure 2 is a cross-sectional view of the center core, sub-center core, and undersheet. Figure 3 is a cross-sectional view of the back side of the card filled with filling. Figure 4 is a terminal hole in the front side of the card. , a cross-sectional view of the place where the magnetic tape is installed, FIG. 5 is a cross-sectional view of the place where the IC is inserted into the card back side member and the front side member is installed,
Figure 6 is an external view of the completed card. (1)...Card (2)...Front side member (3)...Front side member (4)...IC installation hole (5)...Terminal hole (6)...Printing (
7)...Sub center core (8)...Center core (9)...Back over sheet (10)...Filling (11)...Magnetic tape (12)...I
C Patent Applicant Toppan Printing Co., Ltd. Representative Aito Suzuki No. J, Figure 2
Claims (1)
裏側部材と、ＩＣ端子用穴を設け裏側部材より少し大き
目にした表側部材とを用い、前記裏側部材の凹部にＩＣ
を設けたのち、前記裏側部利と前記表側部イＡを加熱加
圧を必要とりない接着剤を用いて接着し、その後前記表
側部材の余分な外周部を前記裏側部材に合わせて断裁す
ることによるＩＣカードのカード製造法。The four parts for IC installation are made of a back side member with the same external shape as the final product, and a front side member that is slightly larger than the back side member with holes for IC terminals, and the IC is placed in the recess of the back side member.
After that, the back side part A and the front side part A are bonded together using an adhesive that does not require heat and pressure, and then the excess outer peripheral part of the front side member is cut to match the back side member. Card manufacturing method for IC cards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57193830A JPS5983285A (en) | 1982-11-04 | 1982-11-04 | Production of card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57193830A JPS5983285A (en) | 1982-11-04 | 1982-11-04 | Production of card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5983285A true JPS5983285A (en) | 1984-05-14 |
Family
ID=16314447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57193830A Pending JPS5983285A (en) | 1982-11-04 | 1982-11-04 | Production of card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5983285A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6087074U (en) * | 1983-11-21 | 1985-06-15 | 関東物産株式会社 | IC built-in card |
| JPS62201296A (en) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Integrated circuit card and manufacture thereof |
| JPS62201295A (en) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Integrated circuit card and manufacture thereof |
| JPH01152098A (en) * | 1988-09-08 | 1989-06-14 | Dainippon Printing Co Ltd | Card base material for ic card |
| FR2660092A1 (en) * | 1990-03-26 | 1991-09-27 | Ryoden Kasei Kk | METHOD FOR MANUFACTURING INTEGRATED CIRCUIT BOARD |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5562591A (en) * | 1978-10-30 | 1980-05-12 | Fujitsu Ltd | Memory card |
| JPS5626451A (en) * | 1979-05-17 | 1981-03-14 | Gao Ges Automation Org | Identification card having ic chip and method of manufacturing same |
| JPS5752977A (en) * | 1980-08-07 | 1982-03-29 | Gao Ges Automation Org | Identifying card and method of producing same |
| JPS5812082A (en) * | 1981-04-14 | 1983-01-24 | ガ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ− | Data carrier for identification card or the like |
| JPS5892597A (en) * | 1981-11-28 | 1983-06-01 | 大日本印刷株式会社 | Manufacture of identification card |
| JPS5944067B2 (en) * | 1977-04-26 | 1984-10-26 | 日立マクセル株式会社 | reciprocating electric razor |
-
1982
- 1982-11-04 JP JP57193830A patent/JPS5983285A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5944067B2 (en) * | 1977-04-26 | 1984-10-26 | 日立マクセル株式会社 | reciprocating electric razor |
| JPS5562591A (en) * | 1978-10-30 | 1980-05-12 | Fujitsu Ltd | Memory card |
| JPS5626451A (en) * | 1979-05-17 | 1981-03-14 | Gao Ges Automation Org | Identification card having ic chip and method of manufacturing same |
| JPS5752977A (en) * | 1980-08-07 | 1982-03-29 | Gao Ges Automation Org | Identifying card and method of producing same |
| JPS5812082A (en) * | 1981-04-14 | 1983-01-24 | ガ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ− | Data carrier for identification card or the like |
| JPS5892597A (en) * | 1981-11-28 | 1983-06-01 | 大日本印刷株式会社 | Manufacture of identification card |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6087074U (en) * | 1983-11-21 | 1985-06-15 | 関東物産株式会社 | IC built-in card |
| JPS62201296A (en) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Integrated circuit card and manufacture thereof |
| JPS62201295A (en) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Integrated circuit card and manufacture thereof |
| JPH01152098A (en) * | 1988-09-08 | 1989-06-14 | Dainippon Printing Co Ltd | Card base material for ic card |
| FR2660092A1 (en) * | 1990-03-26 | 1991-09-27 | Ryoden Kasei Kk | METHOD FOR MANUFACTURING INTEGRATED CIRCUIT BOARD |
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