JPS5972752U - diamond heat sink - Google Patents
diamond heat sinkInfo
- Publication number
- JPS5972752U JPS5972752U JP16910282U JP16910282U JPS5972752U JP S5972752 U JPS5972752 U JP S5972752U JP 16910282 U JP16910282 U JP 16910282U JP 16910282 U JP16910282 U JP 16910282U JP S5972752 U JPS5972752 U JP S5972752U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- diamond heat
- diamond
- rounded
- corner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂは、素材のダイヤモンド形状を示した
断面図および上面図。第２図は、メタライズをほどこし
たヒ〜 トシンクの断面図。第３図は、本ヒートシンク
を使った実装部の断面図。
１・・・・・・ダイヤモンド、２・・・・・・ダイヤモ
ンド斜研磨部、３・・・・・・丸味をつけた角部、４・
・・・・・ソルダーメタル、５・・・・・・上面導電メ
タル、６・・・・・・下面導電メタル、７・・・・・・
レーザーダイオードチップ、８・・・・・・ＡｕＳｎソ
ルダー、９・・・・・・側面メタライズ、１０・・・・
・・低融点メタル、１１・・・・・・ステム。Figures 1a and 1b are a sectional view and a top view showing the diamond shape of the material. Figure 2 is a cross-sectional view of a metalized heat sink. FIG. 3 is a cross-sectional view of the mounting section using this heat sink. 1...Diamond, 2...Diamond beveled part, 3...Rounded corner, 4...
...Solder metal, 5...Top conductive metal, 6...Bottom conductive metal, 7...
Laser diode chip, 8...AuSn solder, 9...Side metalization, 10...
...Low melting point metal, 11...Stem.
Claims (1)
のうち少なくとも１面のなす角に丸味をつけ、上下２面
と前記丸味をつけた角と側面とにメタライズをほどこし
たことを特徴とするダイヤモンドヒーｌ〜シンク。The corner formed by the opposing upper and lower sides of the tire block and at least one of the four surrounding surfaces is rounded, and metallization is applied to the upper and lower two surfaces, the rounded corner, and the side surface. Diamond Heel ~ Sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16910282U JPS5972752U (en) | 1982-11-08 | 1982-11-08 | diamond heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16910282U JPS5972752U (en) | 1982-11-08 | 1982-11-08 | diamond heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5972752U true JPS5972752U (en) | 1984-05-17 |
Family
ID=30369514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16910282U Pending JPS5972752U (en) | 1982-11-08 | 1982-11-08 | diamond heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5972752U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311923A (en) * | 2003-03-27 | 2004-11-04 | Mitsubishi Electric Corp | Package for optical semiconductor element |
| JP2013004571A (en) * | 2011-06-13 | 2013-01-07 | Hamamatsu Photonics Kk | Semiconductor laser device |
| JP2017152551A (en) * | 2016-02-25 | 2017-08-31 | 株式会社フジクラ | Semiconductor laser module and manufacturing method for the same |
| JP2020502034A (en) * | 2016-12-22 | 2020-01-23 | エレメント シックス テクノロジーズ リミテッド | Synthetic diamond plate |
-
1982
- 1982-11-08 JP JP16910282U patent/JPS5972752U/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311923A (en) * | 2003-03-27 | 2004-11-04 | Mitsubishi Electric Corp | Package for optical semiconductor element |
| JP4550386B2 (en) * | 2003-03-27 | 2010-09-22 | 三菱電機株式会社 | Package for optical semiconductor devices |
| JP2013004571A (en) * | 2011-06-13 | 2013-01-07 | Hamamatsu Photonics Kk | Semiconductor laser device |
| JP2017152551A (en) * | 2016-02-25 | 2017-08-31 | 株式会社フジクラ | Semiconductor laser module and manufacturing method for the same |
| WO2017145987A1 (en) * | 2016-02-25 | 2017-08-31 | 株式会社フジクラ | Semiconductor laser module and method for manufacturing same |
| CN108701959A (en) * | 2016-02-25 | 2018-10-23 | 株式会社藤仓 | Semiconductor laser module and its manufacturing method |
| EP3422497A4 (en) * | 2016-02-25 | 2020-01-01 | Fujikura Ltd. | Semiconductor laser module and method for manufacturing same |
| US10748836B2 (en) | 2016-02-25 | 2020-08-18 | Fujikura Ltd. | Semiconductor laser module and method for manufacturing the same |
| JP2020502034A (en) * | 2016-12-22 | 2020-01-23 | エレメント シックス テクノロジーズ リミテッド | Synthetic diamond plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5972752U (en) | diamond heat sink | |
| JPS6316457U (en) | ||
| JPS58122472U (en) | laser diode array | |
| JPS60106370U (en) | Mounting structure of external lead terminal | |
| JPH02759U (en) | ||
| JPS62204365U (en) | ||
| JPS60195163U (en) | plate solder | |
| JPS5889946U (en) | semiconductor equipment | |
| JPS6066040U (en) | heat sink | |
| JPS6413146U (en) | ||
| JPS60166173U (en) | semiconductor light emitting device | |
| JPH01157424U (en) | ||
| JPS59107157U (en) | GaAs semiconductor device | |
| JPS6096831U (en) | semiconductor chip | |
| JPS5967938U (en) | Base structure for ceramic package | |
| JPS606235U (en) | Case for microwave hybrid integrated circuit | |
| JPH01104735U (en) | ||
| JPS58133939U (en) | Heat sink for semiconductor parts | |
| JPS59125835U (en) | semiconductor equipment | |
| JPS6130252U (en) | semiconductor equipment | |
| JPS5837152U (en) | semiconductor equipment | |
| JPS60103860U (en) | semiconductor laser equipment | |
| JPS6013762U (en) | semiconductor laser | |
| JPS58196843U (en) | semiconductor equipment | |
| JPS5991742U (en) | Package for semiconductors |