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JPS5954956U - semiconductor package - Google Patents

semiconductor package

Info

Publication number
JPS5954956U
JPS5954956U JP14995782U JP14995782U JPS5954956U JP S5954956 U JPS5954956 U JP S5954956U JP 14995782 U JP14995782 U JP 14995782U JP 14995782 U JP14995782 U JP 14995782U JP S5954956 U JPS5954956 U JP S5954956U
Authority
JP
Japan
Prior art keywords
semiconductor package
tip
length
wiring
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14995782U
Other languages
Japanese (ja)
Inventor
藤吉　実
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP14995782U priority Critical patent/JPS5954956U/en
Publication of JPS5954956U publication Critical patent/JPS5954956U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による半導体パッケージの一実施例にお
いて半導体ＩＣを取着した状態を示す断面図、第２図は
その一部を示す平面図である。 １１・・・絶縁基板、１５・・・半導体ＩＣ１１７゜１
７１・・・金属配線、１９・・・電極リード。FIG. 1 is a cross-sectional view showing a state in which a semiconductor IC is attached in an embodiment of a semiconductor package according to the present invention, and FIG. 2 is a plan view showing a portion thereof. 11... Insulating substrate, 15... Semiconductor IC117゜1
71...Metal wiring, 19...Electrode lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板上に取着される半導体素子の電極を電気的に接
続する多数の金属配線を具備した半導体パッケージにお
いて、前記金属配線のうち標識となるべき金属配線の先
端部の長さを他の金属配線の先端部の長さと不揃いとし
たことを特徴とする半導体パッケージ。In a semiconductor package equipped with a large number of metal wirings that electrically connect the electrodes of a semiconductor element mounted on an insulating substrate, the length of the tip of the metal wiring that is to become a mark is A semiconductor package characterized by the length of the tip of the wiring being uneven.
JP14995782U 1982-09-30 1982-09-30 semiconductor package Pending JPS5954956U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14995782U JPS5954956U (en) 1982-09-30 1982-09-30 semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14995782U JPS5954956U (en) 1982-09-30 1982-09-30 semiconductor package

Publications (1)

Publication Number Publication Date
JPS5954956U true JPS5954956U (en) 1984-04-10

Family

ID=30332723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14995782U Pending JPS5954956U (en) 1982-09-30 1982-09-30 semiconductor package

Country Status (1)

Country Link
JP (1) JPS5954956U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260418U (en) * 1985-10-04 1987-04-15

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279658A (en) * 1975-12-25 1977-07-04 Citizen Watch Co Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279658A (en) * 1975-12-25 1977-07-04 Citizen Watch Co Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260418U (en) * 1985-10-04 1987-04-15

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