JPS5952665U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS5952665U JPS5952665U JP14672182U JP14672182U JPS5952665U JP S5952665 U JPS5952665 U JP S5952665U JP 14672182 U JP14672182 U JP 14672182U JP 14672182 U JP14672182 U JP 14672182U JP S5952665 U JPS5952665 U JP S5952665U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- abstract
- substrate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例、第２図は本考案の一実施例、第３図は
本考案の他の実施例を示し、それぞれ図においてａは樹
脂封止前の混成集積回路の斜視図、ｂは樹脂封止後の混
成集積回路の一部切り欠き平面図、Ｃは混成集積回路の
一部断面図を示す。
１、 ８． １０・・・基板、２・・・電子部品、３・
・・端子リード、４・・・樹脂、９・・・スリット、１
１・・・孔。FIG. 1 shows a conventional example, FIG. 2 shows an embodiment of the present invention, and FIG. 3 shows another embodiment of the present invention. In each figure, a is a perspective view of the hybrid integrated circuit before resin encapsulation, and b C shows a partially cutaway plan view of the hybrid integrated circuit after resin sealing, and C shows a partially sectional view of the hybrid integrated circuit. 1, 8. 10... Board, 2... Electronic component, 3.
...Terminal lead, 4...Resin, 9...Slit, 1
1...hole.
Claims (1)
より被覆してなるものにおいて、前記基板の、電子部品
の電極間に位置する部分にスリットまたは孔を設けたこ
とを特徴とする混成集積回路。A hybrid assembly in which electronic components are mounted on a substrate on which wiring conductors are formed and covered with resin, characterized in that a slit or hole is provided in a portion of the substrate located between the electrodes of the electronic component. circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14672182U JPS5952665U (en) | 1982-09-28 | 1982-09-28 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14672182U JPS5952665U (en) | 1982-09-28 | 1982-09-28 | hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5952665U true JPS5952665U (en) | 1984-04-06 |
Family
ID=30326503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14672182U Pending JPS5952665U (en) | 1982-09-28 | 1982-09-28 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5952665U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011204426A (en) * | 2010-03-25 | 2011-10-13 | Panasonic Corp | Power supply for driving magnetron |
-
1982
- 1982-09-28 JP JP14672182U patent/JPS5952665U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011204426A (en) * | 2010-03-25 | 2011-10-13 | Panasonic Corp | Power supply for driving magnetron |
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