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JPS5950190A - Nickel-phosphorus alloy electroplating bath - Google Patents

Nickel-phosphorus alloy electroplating bath

Info

Publication number
JPS5950190A
JPS5950190A JP16275782A JP16275782A JPS5950190A JP S5950190 A JPS5950190 A JP S5950190A JP 16275782 A JP16275782 A JP 16275782A JP 16275782 A JP16275782 A JP 16275782A JP S5950190 A JPS5950190 A JP S5950190A
Authority
JP
Japan
Prior art keywords
nickel
acid
phosphorus
phosphorus alloy
electroplating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16275782A
Other languages
Japanese (ja)
Other versions
JPS6353278B2 (en
Inventor
Mitsuaki Atobe
光朗 跡部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP16275782A priority Critical patent/JPS5950190A/en
Publication of JPS5950190A publication Critical patent/JPS5950190A/en
Publication of JPS6353278B2 publication Critical patent/JPS6353278B2/ja
Granted legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE:To obtain the titled plating bath giving a film having high corrosion resistance and a specular surface with high electrodeposition efficiency by using specified amounts of nickel sulfamate, boric acid, phosphorus acid, phosphoric acid, EDTA and sodium laurylsulfate as essential components. CONSTITUTION:This Ni-P alloy electroplating bath contains 100-700g/l nickel sulfamate, 0'45g/l nickel chloride, 15-50g/l boric acid, 5-100g/l phosphorus acid, 5-100g/l phosphoric acid, 10-100g/l EDTA and 0.01-0.5g/l sodium laurylsulfate. Nickel chloride is used to dissolve an Ni anode, so it is not necessarily required when no Ni anode is used.

Description

【発明の詳細な説明】 本発明は高4食性で高速電着性を有し、しかも鏡面被膜
を産み出+電解ニッケルリン合金メソギ浴に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrolytic nickel-phosphorus alloy mesolithic bath which has high tetrahydric properties, high-speed electrodeposition properties, and produces a mirror-like coating.

従来の′+lI解ニッケルリン合金メ・ツキはリン含有
率が低く、特に耐食性が要望ばれる分野での使用には限
度があった。リン含有率を上げれば析出速度が非常に遅
くfrるためと、゛リン含有率限界が、14〜15qA
であるため一般に析出物のリン含有率は12%以下でカ
1すな。ヌ、外観に訃いTり壬9等が冬〈発1生し、高
崎装飾品には不向きで1r47に水素発生等によるビッ
トだ多91−た、木発す1けかかる欠声をμ′i′すし
たもので、その目的は高耐食性、高電着性、倚面を有す
るIv膜を得るためのニッケルリン合金メッキを力える
ものである。
Conventional '+lI nickel phosphorus alloy metals have a low phosphorus content, which limits their use in fields where corrosion resistance is particularly required. This is because the precipitation rate becomes very slow if the phosphorus content is increased, and the phosphorus content limit is 14 to 15 qA.
Therefore, the phosphorus content of the precipitate is generally 12% or less. NU, 91-year-old trees with poor appearance appear in winter, are unsuitable for Takasaki ornaments, and are caused by hydrogen generation in 1r47. Its purpose is to improve nickel-phosphorus alloy plating to obtain an IV film with high corrosion resistance, high electrodepositivity, and a flat surface.

なお、水浴においてニッケルのIt給Fl トiするニ
ラ’r ルイオンは、高い溶解度ヲ持っスルフアミン酸
二・Iケルを用いた。濃度は100〜700 g/lで
、p+しく tri 、500〜500 a/lである
。 100 g/l DJ ’T−の鳩舎は雪着速度の
低下と、高電流密度付加がbしい、ニッケル陽極の溶角
了を行うためにθ〜45σ/lの塩化ニッケルを用いた
。ニッケル体板を用イf:c イfA合は必1゛シモ必
ip′としlfイ。p n 11 qli剤としてはホ
ウ酸を15〜5oσ/l用いた。H4ヤしくけ40〜5
0 g/lでニッヶルリン皮膜の黒色化を白色化に向か
わせた。ホウ酸50 a/l 辺土でd沈殿がおこる。
Note that sulfamic acid di-I, which has a high solubility, was used as the nickel ion used to supply nickel in the water bath. The concentration is 100-700 g/l, p+tri, 500-500 a/l. The 100 g/l DJ 'T- pigeon house used nickel chloride of θ~45σ/l to reduce the snow accretion rate and to improve the melting angle of the nickel anode, which requires high current density addition. If a nickel body plate is used, if A is used, it must be 1 ゛ must be ip'. As the p n 11 qli agent, boric acid was used at 15 to 5 oσ/l. H4 Yashikake 40~5
At 0 g/l, the blackening of the nickel phosphorus film turned toward whitening. Boric acid 50 a/l d precipitation occurs in the marginal soil.

リンイIト給源としては亜すン酸30〜10ng/l用
い、望ましくけ40−70 !7/l テ安定して皮膜
中のリン含有率が16チ以上得ることが可fiP Ic
 ft ッp、qlKEDTAをj O〜100 g/
l望しく140〜60σ/l添加したこと忙よってビッ
トだいちじるしく減少し、クモリのない斜面光沢が得ら
れたE D T A 100 q7’t bl上添加し
た場合、浴不安定となり沈殿をおこすことがある。ヌ、
ζらにピット防止剤としてラウリル硫酸ナトリウム0、
01〜0.5 (t/l添加した。望ましくけ、01〜
o2σ/lであり05071以上の添加は泡立ちが多す
ぎるため目的にそぐわないリン酸5〜1ooq/l添加
により、リン含有率を増加#せることができた。
As a source of phosphorous acid, use 30-10 ng/l of phosphorous acid, preferably 40-70 ng/l. 7/l It is possible to stably obtain a phosphorus content of 16 or more in the film.
ftp, qlKEDTA j O ~ 100 g/
l Desirably, 140 to 60σ/l was added.Due to busyness, the bit size decreased significantly and a cloud-free sloped gloss was obtained.If added above 100 q7't bl, the bath becomes unstable and precipitation occurs. There is. Nu,
Sodium lauryl sulfate 0 as a pitting preventive agent,
01~0.5 (t/l added. Desirably, 01~0.5
The phosphorus content can be increased by adding 5 to 1 ooq/l of phosphoric acid, which is not suitable for the purpose because the addition of 05071 or more causes too much foaming.

望ましく u 30〜60 g/l fある。1006
71以上の胡′1合、酸性度が強すぎ、メッキする品物
を荒らすことになり、+ftビットも増加する。
Desirably it is 30-60 g/l f. 1006
If the value is 71 or more, the acidity is too strong and will damage the plated item, and the +ft bit will also increase.

以下実M11例によって説明する、 実施例1 シングユウで作られた時開ケース(Ill K、脱脂等
の前処理ヲ行い、スルファミン酸ニッケル450 g/
l塩化二っケル30σ/l、ポリ酸45σ/l、亜リン
lp  4  慣 q/l  、  リ ン R40a
/l  、  F!I) TA  ROry//  。
Example 1 A time-opening case made of Singyu (Ill K, subjected to pretreatment such as degreasing, and containing nickel sulfamate 450 g/
l Nickel chloride 30σ/l, polyacid 45σ/l, phosphorous lp 4 q/l, phosphorus R40a
/l, F! I) TAROry//.

ううリル硅酔ナトリウム0.1 f7/lがらかるニッ
ケルリン合金メッキ浴に赴いてP J(0,8、浴湯6
o℃、?T!汁、密度6 A/drn2.回転持拌を用
いて10分間で4μ所のメッキを施した。づらに水洗を
行ったのも所定の方法で約0.15μ?nのロジウムメ
ッギをjな。通常ニツケルメッギ十ロジウムメッキの場
合電気化学腐食が起こり、耐食性K II!IGがある
frめ、ニッケルとロジウムのメ・ツギ神膜間にパラジ
ウムのようなh今加メッキを施す。13チ以下のリン含
有率をもっニッケルリン合仝メッキにおいても直接ロジ
ウムメッキにょ秒、人工汗による耐食性試験で満足なデ
ータは得られない。
I went to a nickel phosphorus alloy plating bath containing 0.1 f7/l of sodium chloride and PJ (0.8, bath 6
o℃? T! Soup, density 6 A/drn2. Plating was performed at 4 μm in 10 minutes using a rotary stirrer. I washed it with water using the specified method and it was about 0.15μ? N's rhodium meggi. Normally, electrochemical corrosion occurs in the case of Nickel Meggi 10 rhodium plating, resulting in corrosion resistance K II! When there is an IG, a palladium-like plating is applied between the nickel and rhodium membranes. Even with nickel-phosphorus joint plating with a phosphorus content of 13 or less, satisfactory data cannot be obtained in corrosion resistance tests using direct rhodium plating and artificial sweat.

本方法によるメッキ法の場合、リン含有率が15eI)
以上であり、人工汗による耐食性試r冒でおいてパラジ
ウムをイI用したものより、秀れてぃた。まタヒット、
クモリ等のメッキ異常も寸っf((itい鏡面状態が得
られ、これだけの高含治リンにおいて41°′m/10
分という値が得らiまた。折り曲げ試μ、(Tにより密
〃tゼ1゛を軒側した/I:これも十った〈間PFIけ
なか一1f o7.2目の光り寸き′をお濾憂、白メッ
キλしての高級感がでた。
In the case of plating according to this method, the phosphorus content is 15eI)
As described above, it was superior to the one using palladium in the corrosion resistance test using artificial sweat. Matahit,
Plating abnormalities such as spiders are also minimized ((It is possible to obtain a very mirror-like surface, and with such a high phosphorus content, 41°'m/10
I also get the value of minutes. Bending test μ, (I made the eave side of the tze 1 by T: This was also 100%, and I was sorry for the light size of the 7.2 eyes, white plating λ. It had a very luxurious feel.

実施例2 晴ff1H1給列部品のカナ(素材:炭素階)を脱脂等
ノM tp、 JITIを符かったのち、スルファミン
酸ニッケル400 rt/l、ホウ酸45σ/1.’#
rリン酸50 g/lリン酸50 g/1. 、 F、
DTA40 g/l、ラウリル硝酸ナトリウA 0.2
 q/lからなるニッケルリン合金メッキ浴にオイテ、
PH0,781FAI′f65℃TFt流密度o2A/
dm2.1分間回転攪拌を用いてフラッンユメッキを行
t「っだ。炭素鋼に通常ニツケルメツキを行IIっだ場
合、耐食性に問題があったが今回のニッケルリン皮膜(
リン含有率17チ)を人工汗で試験したところ従来の約
5倍以上の耐食性を示した。
Example 2 A clear ff1H1 supply row part (material: carbon layer) was degreased and subjected to Mtp and JITI, and then treated with nickel sulfamate 400 rt/l and boric acid 45σ/1. '#
r phosphoric acid 50 g/l phosphoric acid 50 g/1. , F,
DTA40 g/l, sodium lauryl nitrate A 0.2
Oite in a nickel phosphorus alloy plating bath consisting of q/l.
PH0,781FAI'f65℃TFt flow density o2A/
dm 2.Franille plating is performed using rotary stirring for 1 minute.When conventional nickel plating is applied to carbon steel, there was a problem with corrosion resistance, but the present nickel phosphorus coating (
When tested using artificial sweat with a phosphorus content of 17%, the corrosion resistance was approximately 5 times higher than that of conventional products.

り、カナのmりもニッケル皮膜の場合と比べて同士して
いること−・わかった。
It was also found that the width of the kana is also the same as in the case of nickel film.

実施例 メッキ浴訂1成として、スルファミン酸ニッケル350
 (1/l、1λ4化二・ソウ′ル30σ/lボウ酸4
5σ/l、亜リン酸50 q/)、リンp 4’ Ot
y/l、ラウリル宿酔プート リ ラムO,n 5 (
1/1. 、  ET’lT A  2047/)を用
い、浴?Xn A5℃、電流密rif2八/d??+2
、メッキ時間10分および陰極として黄鉗板の条ヂ1下
としてメツ咋を行い、厚み10μVの←面光沢の被覆物
を得た。
As an example plating bath version 1, nickel sulfamate 350
(1/l, 1λ4 di-soul 30σ/l boric acid 4
5σ/l, phosphorous acid 50 q/), phosphorus p 4' Ot
y/l, lauryl hangover putri ram O,n 5 (
1/1. , ET'lT A 2047/). Xn A5℃, current density rif28/d? ? +2
Plating was carried out for 10 minutes and with one strip of a yellow plate serving as a cathode, to obtain a coating having a thickness of 10 μV and a glossy surface.

皮膜中のリン含有率Vi+6.!lで人工汗による耐食
性、硝酸等による耐薬品性、折り曲げ試験による密着性
は浪好でネ・うた。
Phosphorus content in the film Vi+6. ! Corrosion resistance due to artificial sweat, chemical resistance due to nitric acid, and adhesion during bending tests were confirmed.

実施例4 スルファミン酸ニッケル450 n/l 、tD 什ニ
ック”k 30 q/l、 ホウfie 45 g/l
 、 !Iliリン酸40 q/l。
Example 4 Nickel sulfamate 450 n/l, tD nickel 30 q/l, nickel sulfamate 45 g/l
, ! Ili phosphate 40 q/l.

lj :/nt 4 o g/l、  br+TA30
  g/l 、  ラウリル舊F Fナトリウム0.1
0/lからなるニッケルリン合金浴(pno、8)Kニ
ッケル板と固棒とし、Fi銅製の時計ケースを除権とし
て配宿し、浴温6o’c雷流密度4A/d??+2の売
件下に10分間時n1ケースに箱クメッキを行った。シ
らに通常の方法により金メッキを3μln施した。得ら
ノ]た析着物けcjイ而面沢を有し、スジ目の光1°あ
いを落とし高級感かでf、。
lj:/nt 4 o g/l, br+TA30
g/l, sodium lauryl FF 0.1
A nickel phosphorus alloy bath consisting of 0/l (pno, 8) K nickel plate and solid rod, a Fi copper watch case placed as a relief, bath temperature 6 o'c lightning current density 4 A/d? ? Box coating was performed on the n1 case for 10 minutes under +2 sales. The plate was plated with 3 μl of gold using a conventional method. It has a beautiful shine on the surface, reduces the brightness of the streaks by 1°, and has a luxurious feel.

耐食性もニッケル使用の場合の4〜5 (7:旬十向十
L f。、二の時のニッケ)1. IJン合金皮膜の厚
みU2μ?nで(I↑り曲げ耐験による密着性もp好で
1.、−Iた、辺土)tl、べてきたように本イと明に
よるメIキ浴により、lr′、Iに面1介ゼ11、血1
薬品性を卯望する分野、責合iff / ツキの下付は
用としての皮膜を要望する分!l!F (例ンげ装飾(
11(品)竹幅広い用袢が考えられ実用上、イ1用lr
発明である。
Corrosion resistance is also 4 to 5 when using nickel (7: ShunjukojuL f., 2nd time nickel) 1. Thickness of IJ alloy film U2μ? At n (I ↑ the adhesion was 1., -I ta, hedo) tl. Kaise 11, blood 1
Fields that desire chemical properties, liability if / Tsuki's subscripts request a film for use! l! F (example decoration)
11 (item) Bamboo can be used for a wide range of purposes, and in practical terms, it is suitable for I1.
It is an invention.

Jy1士 出願人 株式金側 詐訪精工舎 伏理人 弁理士 最上 務 445−Jy1shi Applicant Stock money side Shobo Seikosha Fushirito Patent Attorney Mogami 445-

Claims (1)

【特許請求の範囲】[Claims] 電解ニッケルリン合金メッキ浴において、スルファミン
酸ニッケル100〜7(IQ g/)、塩化ニッケル0
〜45 g/l、ホウ酸15〜50g/l、亜リン酸5
〜ion g/l 、  リン酸5〜100 g/1.
、EDTA10〜100a/l 、ラウリル硫酸ナトリ
ウム 0.01〜0.5 (t/lからなることを特徴
とする電解ニッケルリン合金メッキ浴。
In an electrolytic nickel phosphorus alloy plating bath, nickel sulfamate 100-7 (IQ g/), nickel chloride 0
~45 g/l, boric acid 15-50 g/l, phosphorous acid 5
~ion g/l, phosphoric acid 5-100 g/1.
, EDTA 10 to 100 a/l, and sodium lauryl sulfate 0.01 to 0.5 (t/l).
JP16275782A 1982-09-17 1982-09-17 Nickel-phosphorus alloy electroplating bath Granted JPS5950190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16275782A JPS5950190A (en) 1982-09-17 1982-09-17 Nickel-phosphorus alloy electroplating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16275782A JPS5950190A (en) 1982-09-17 1982-09-17 Nickel-phosphorus alloy electroplating bath

Publications (2)

Publication Number Publication Date
JPS5950190A true JPS5950190A (en) 1984-03-23
JPS6353278B2 JPS6353278B2 (en) 1988-10-21

Family

ID=15760659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16275782A Granted JPS5950190A (en) 1982-09-17 1982-09-17 Nickel-phosphorus alloy electroplating bath

Country Status (1)

Country Link
JP (1) JPS5950190A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4767509A (en) * 1983-02-04 1988-08-30 Burlington Industries, Inc. Nickel-phosphorus electroplating and bath therefor
US4801947A (en) * 1987-06-25 1989-01-31 Burlington Industries, Inc. Electrodeposition-produced orifice plate of amorphous metal
US5032464A (en) * 1986-10-27 1991-07-16 Burlington Industries, Inc. Electrodeposited amorphous ductile alloys of nickel and phosphorus
US7794578B2 (en) * 2002-11-26 2010-09-14 The Furukawa Electric Co., Ltd. Method for preparing a circuit board material having a conductive base and a resistance layer
JP2013249526A (en) * 2012-06-04 2013-12-12 Nomura Plating Co Ltd Metal material
TWI628314B (en) * 2012-09-18 2018-07-01 野村鍍金股份有限公司 Mold, forming roll and peeled electroformed product

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4767509A (en) * 1983-02-04 1988-08-30 Burlington Industries, Inc. Nickel-phosphorus electroplating and bath therefor
US5032464A (en) * 1986-10-27 1991-07-16 Burlington Industries, Inc. Electrodeposited amorphous ductile alloys of nickel and phosphorus
US4801947A (en) * 1987-06-25 1989-01-31 Burlington Industries, Inc. Electrodeposition-produced orifice plate of amorphous metal
US7794578B2 (en) * 2002-11-26 2010-09-14 The Furukawa Electric Co., Ltd. Method for preparing a circuit board material having a conductive base and a resistance layer
JP2013249526A (en) * 2012-06-04 2013-12-12 Nomura Plating Co Ltd Metal material
WO2013183348A1 (en) * 2012-06-04 2013-12-12 株式会社野村鍍金 Metallic material
TWI628314B (en) * 2012-09-18 2018-07-01 野村鍍金股份有限公司 Mold, forming roll and peeled electroformed product

Also Published As

Publication number Publication date
JPS6353278B2 (en) 1988-10-21

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