[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS5950444U - Power IC mounting structure - Google Patents

Power IC mounting structure

Info

Publication number
JPS5950444U
JPS5950444U JP14551982U JP14551982U JPS5950444U JP S5950444 U JPS5950444 U JP S5950444U JP 14551982 U JP14551982 U JP 14551982U JP 14551982 U JP14551982 U JP 14551982U JP S5950444 U JPS5950444 U JP S5950444U
Authority
JP
Japan
Prior art keywords
power
heat sink
mounting structure
sub
sub heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14551982U
Other languages
Japanese (ja)
Inventor
浅賀　力
秋葉　圭司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Faurecia Clarion Electronics Co Ltd
Original Assignee
Clarion Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clarion Co Ltd filed Critical Clarion Co Ltd
Priority to JP14551982U priority Critical patent/JPS5950444U/en
Publication of JPS5950444U publication Critical patent/JPS5950444U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ、　　ｂは共に従来例を示す斜視図、第２図ａ
１第３図ａ、　　ｂおよび第２図すはいずれも本考案実
施例を示す斜視図および断面図である。 １・・・プリント基板、２・・・パワーＩＣ，３・・・
放熱板、４．　４ａ、　　４ｂ・・・ネジ、７・・・サ
ブ放熱板、８ａ。 ８ｂ・・・差込用ツメ、ｉｏａ、１０ｂ・・・支持用ツ
メ。Figures 1a and b are both perspective views showing the conventional example, and Figure 2a is a perspective view of the conventional example.
1. Figures 3a and 3b and Figure 2 are both a perspective view and a sectional view showing an embodiment of the present invention. 1... Printed circuit board, 2... Power IC, 3...
Heat sink, 4. 4a, 4b...Screw, 7...Sub heat sink, 8a. 8b...Insertion claw, ioa, 10b...Supporting claw.

Claims (1)

【実用新案登録請求の範囲】 １　パワーＩＣとサブ放熱板とがパワーＩＣがサブ放熱
板によってその取り付は高さが規制されるように配置さ
れて共にプリント基板に半田付けされ、上記パワーＩＣ
がサブ放熱板および別に用意された放熱板間に挟持され
るように構成してなることを特徴とするパワーＩＣ取付
構造。 ２　上記パワーＩＣの取り付は高さがサブ放熱板に設け
られたツメによって規制されてなることを特徴とする実
用新案登録請求の範囲第１項記載のパワーＩＣ取付構造
。 ３　上記パワーＩＣがネジによってサブ放熱板と放熱板
間に挾持されてなることを特徴とする実用新案登録請求
の範囲第１項又は第２項記載のパワーＩＣ取付構造。[Claims for Utility Model Registration] 1. A power IC and a sub heat sink are arranged such that the mounting height of the power IC is regulated by the sub heat sink and are both soldered to a printed circuit board,
A power IC mounting structure characterized in that the power IC is sandwiched between a sub heat sink and a separately prepared heat sink. 2. The power IC mounting structure according to claim 1, wherein the mounting height of the power IC is regulated by a tab provided on a sub-radiation plate. 3. The power IC mounting structure according to claim 1 or 2, wherein the power IC is held between a sub heat sink and a heat sink by screws.
JP14551982U 1982-09-24 1982-09-24 Power IC mounting structure Pending JPS5950444U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14551982U JPS5950444U (en) 1982-09-24 1982-09-24 Power IC mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14551982U JPS5950444U (en) 1982-09-24 1982-09-24 Power IC mounting structure

Publications (1)

Publication Number Publication Date
JPS5950444U true JPS5950444U (en) 1984-04-03

Family

ID=30324185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14551982U Pending JPS5950444U (en) 1982-09-24 1982-09-24 Power IC mounting structure

Country Status (1)

Country Link
JP (1) JPS5950444U (en)

Similar Documents

Publication Publication Date Title
JPS5950444U (en) Power IC mounting structure
JPS60121665U (en) printed wiring board
JPS6127391U (en) Heat dissipation structure of input/output unit
JPS6057154U (en) flexible printed board
JPS5834744U (en) Power diode mounting structure
JPS6159392U (en)
JPS5897845U (en) Power IC mounting structure
JPS5996775U (en) Printed circuit board connection device
JPS5937742U (en) Heat dissipation structure
JPS60124264U (en) motor fan
JPS5829893U (en) Cooler for printed board
JPS5944051U (en) semiconductor equipment
JPS58138394U (en) Mounting structure of heat sink on printed circuit board
JPS59135645U (en) Mounting structure of heat sink and power transistor
JPS58127780U (en) speaker holder
JPS59127270U (en) printed circuit board equipment
JPS6027449U (en) Transistor heat dissipation device
JPS60118249U (en) Semiconductor mounting equipment
JPS6085849U (en) Heat sink mounting device
JPS6262490U (en)
JPS611892U (en) Heat sink structure
JPS60174296U (en) Mounting structure of heat sink
JPS5936232U (en) Electrical component
JPS5827947U (en) Hybrid integrated circuit device
JPS60106345U (en) Heat sink for semiconductor devices