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JPS5929424A - Semiconductor wafer manufacturing apparatus - Google Patents

Semiconductor wafer manufacturing apparatus

Info

Publication number
JPS5929424A
JPS5929424A JP13961982A JP13961982A JPS5929424A JP S5929424 A JPS5929424 A JP S5929424A JP 13961982 A JP13961982 A JP 13961982A JP 13961982 A JP13961982 A JP 13961982A JP S5929424 A JPS5929424 A JP S5929424A
Authority
JP
Japan
Prior art keywords
liquid
quantitative
tanks
tank
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13961982A
Other languages
Japanese (ja)
Inventor
Hideo Ito
秀雄 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13961982A priority Critical patent/JPS5929424A/en
Publication of JPS5929424A publication Critical patent/JPS5929424A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)

Abstract

PURPOSE:To mechanize and automatize a chemical compounding operation, by a method wherein quantitative tanks whose quantitative level can be adjusted are provided in number equal to that of chemicals to be compounded, and the chemicals are automatically quantitatively compounded and fed to an etching bath. CONSTITUTION:From storage tanks 14, 19 for respectively storing a chemical liquid A 13 and a chemical liquid B 18, the liquids are fed to quantitative tanks 22, 23 by means of liquid feed pumps 24, 25 for a predetermined period of time. The chemical liquids 13, 18 overflowing the quantitative tanks 22, 23 are returned to the storage tanks 14, 19, respectively. A fixed quantity of the chemical liquid A 13 is stored in the quantitative tank 22, and a fixed quantity of the chemical liquid B 18 is stored in the quantitative tank 23. To feed the liquid to an etching bath 1, an A-liquid feed solenoid valve 26 and a B-liquid feed solenoid valve 27 are independently actuated to feed the liquids A, B to the etching bath 1 from the quantitative tanks 22, 23 through pipings 32, 33, respectively. These liquid A, B are quantitatively compounded in the etching bath 1. When the quantitative level in each of the of the quantitative tanks 22, 23 is to be adjusted associated nuts 40 are loosened to vertically move overflow pipings 30, 31 for adjusting the positions of the respective open ends of the pipings, thereby to vary the heights of the overflow surfaces.

Description

【発明の詳細な説明】 り)をエツチング処理する半導体製造装置において、と
くに任意に薬品の定量レベルを調整できる定量タンクを
複数個備えていることにより、エツチング槽への給液時
[2種類以上の薬品(酸、アルカリ々ど)を自動的に定
量調合できるようにした半導体ウニ・・一製造装置に関
するものである。
[Detailed Description of the Invention] In a semiconductor manufacturing apparatus that performs an etching process, it is possible to use a plurality of quantitative tanks in which the quantitative level of chemicals can be arbitrarily adjusted. This article relates to a semiconductor sea urchin manufacturing device that is capable of automatically dispensing a fixed amount of chemicals (acids, alkalines, etc.).

ウェハーのエツチング処理工程は、薬品(酸、アルカリ
など)により、ウエノ・一をエツチングした後、純水に
よりウニ・・一に付着した薬品を水洗及び乾燥する工程
である。
The wafer etching process is a process in which the wafer is etched with a chemical (acid, alkali, etc.), and then the chemicals adhering to the sea urchin are washed away with pure water and dried.

第1図は、ウエノ・一にエツチング、水洗及び乾燥の処
理を行なう場合の工程図を示すものであり、ウェハーの
処理工程について説明する。寸ず、ウェハー3を半導体
ウニ・・一用キャリア(以下キャリアという)2に支持
させて、該キャリア2をエツチング液4が入っているエ
ツチング槽1内に入れてエツチングを行ない、終了後上
記キャリア2を水洗槽5内に入れて給配管8からの純水
6で水洗を行なう。水洗終了後上記キャリアを取り出し
、ウェハー遠心乾燥機9にセットしてモータ10でター
ンテーブル11を回転させ、その遠心力でウェハー6を
乾燥させるのである。まだ7は水洗槽5の排水管である
。ところでエツチング液4は、エツチングする膜質によ
っては、2種類以上の薬品を定量調合して使用すること
が多く、従来は作業者があらかじめメスシリンダー等を
使い2種類以上の薬品を調合して置き、この調合された
ものをエツチング槽へ給液して使用していた。この薬品
を調合する作業は非常に危険な作業であり、作業者は安
全保護具(安全メガネ、ゴム手袋など)を身につけて作
業を行なっていた。又、一度に多量の薬品の調合及び保
管は困難であるから、そのつと作業者により薬品調合の
作業をくり返し行なっていた。
FIG. 1 shows a process diagram for performing etching, washing and drying on a wafer, and the wafer processing steps will be explained. Immediately, the wafer 3 is supported on a semiconductor urchin carrier (hereinafter referred to as carrier) 2, and the carrier 2 is placed in the etching bath 1 containing the etching solution 4 to perform etching. 2 is placed in a washing tank 5 and washed with pure water 6 from a supply pipe 8. After washing with water, the carrier is taken out and set in the wafer centrifugal dryer 9, and the turntable 11 is rotated by the motor 10, and the wafer 6 is dried by the centrifugal force. 7 is the drain pipe of the washing tank 5. By the way, the etching solution 4 is often used by mixing two or more types of chemicals in fixed quantities depending on the quality of the film to be etched. Conventionally, an operator mixes two or more types of chemicals in advance using a graduated cylinder, etc. This prepared solution was used by supplying it to an etching tank. The work of mixing this chemical is extremely dangerous, and workers must wear safety protective equipment (safety glasses, rubber gloves, etc.) during the work. Furthermore, since it is difficult to mix and store large amounts of chemicals at once, the work of mixing chemicals has to be repeated by workers.

本発明は前記問題点を解消するもので、ウエノ・−を酸
、アルカリ等の薬品でエツチング処理するウェハー製造
装置において、任意に薬品の定量レベルが調整可能な定
量タンクを、調合する薬品数と同数備え、自動的にエツ
チング槽へ定量調合及び給液を行なうようにしたことを
特徴とするものである。
The present invention solves the above-mentioned problems, and is used in a wafer manufacturing apparatus that etches urethane with chemicals such as acid and alkali. The device is characterized in that it is equipped with the same number of etching tanks and automatically performs quantitative preparation and supply of liquid to the etching tank.

以下、本発明の実施例を第2図によって説明する。Hereinafter, embodiments of the present invention will be described with reference to FIG.

第2図に示すように、ウェハー3をエツチング処理する
半導体ウニ・・−製造装置において、定量調合すべき薬
品を内部に収容する複数(実施例では2台)の定量タン
ク22.25を備え、各タンク22.23に余剰分排液
用オーバーフロー管3o・31をそれぞれ設置し、各タ
ンク22.25をそれぞれ開閉制御弁としての電磁弁2
6.27と配管62.53とを介してエツチング槽1に
配管する。また、各オーバーフロー管3o、siをそれ
ぞれ貯液タンク14.19に配管し、各貯液夕/り14
,19を配管28.29及び給液ポツプ24.25を介
して定量タンク22.25にそれぞれ結合する。−1だ
、各貯液タンク14.19にはそれぞれ薬品容器12.
17が備えられており、その両者間はそれぞれ配管16
゜21で配管されており、各薬品容器12.17には薬
品圧送管15,20が配管されている。
As shown in FIG. 2, a semiconductor urchin manufacturing apparatus for etching a wafer 3 is equipped with a plurality of (two in the embodiment) quantitative tanks 22 and 25 that house chemicals to be quantitatively prepared. Overflow pipes 3o and 31 for draining excess liquid are installed in each tank 22.23, and each tank 22.25 is connected to a solenoid valve 2 as an opening/closing control valve.
6.27 and piping 62.53 to the etching tank 1. In addition, each overflow pipe 3o, si is connected to the liquid storage tank 14.19, and each overflow pipe 3o, si is connected to the liquid storage tank 14.
, 19 are connected to a metering tank 22.25 via piping 28.29 and a liquid supply pop 24.25, respectively. -1, each storage tank 14.19 has a chemical container 12.
17, and a pipe 16 is provided between the two.
21, and drug pressure feed pipes 15, 20 are piped to each drug container 12,17.

さらに、各定量タンク22.23には定量レベル調整機
構を設置する。すなわち、第3図に示すように、定量タ
ンク22.23の底部にリテーナ4゜を固着1−1該リ
テーナ40を貫通させてオーバーフロー管50をタンク
22内に挿入し、ナツト41で締め付けてリテーナ40
にオーバーフロ/173 。
Furthermore, each metering tank 22,23 is provided with a metering level adjustment mechanism. That is, as shown in FIG. 3, a retainer 4° is fixed to the bottom of the metering tank 22, 23. 1-1 The overflow pipe 50 is inserted into the tank 22 through the retainer 40, and the retainer is tightened with a nut 41. 40
Overflow/173.

を保持させその管開口端を定量レベルの液面位置に配置
させる。尚、他方の定量タンク23にも同様に定量レベ
ル調整機構が設置される。
and place the open end of the tube at the level of the liquid at the quantitative level. Note that a quantitative level adjustment mechanism is similarly installed in the other quantitative tank 23.

第2図に示すように実施例において、薬品A液16が入
っている薬品容器12より、あらかじめA液貯液タンク
14に給液しておく。又薬品B液18も同様にB液貯液
タンク19に給液しておく、A液とB液との各貯液タン
ク14.19より、給液ポンプ24.25によりA液定
量タンク22に一定時間給液を行なう。各定量タンク2
2.25内でオーバーフローした薬品液13.18は各
オーバーフロー配管30.31より、各貯液タンク14
.19へ戻し、定量の薬品A液13をA液定量タンク2
2内に、同様に定量薬品B液18をB液定量タンク23
にそれぞれ貯溜させる。エツチング槽1への給液はA液
給液電磁弁26及びB液給液電磁弁27をそれぞれ動作
させて、定量タンク22からA液を配管32で、また定
量タンク26からB液を配管66でエツチング槽1へ給
液し、それらエツチング槽1内で定量調合させるのであ
る。
As shown in FIG. 2, in the embodiment, a liquid A storage tank 14 is previously supplied with liquid A from a chemical container 12 containing liquid A 16. Similarly, the chemical B liquid 18 is also supplied to the B liquid storage tank 19. From each liquid storage tank 14.19 for liquid A and B liquid, the liquid is supplied to the liquid A metering tank 22 by a liquid supply pump 24.25. Supply liquid for a certain period of time. Each quantitative tank 2
The chemical liquid 13.18 that overflowed in 2.25 is transferred from each overflow pipe 30.31 to each liquid storage tank 14.
.. 19, and add a fixed amount of chemical A liquid 13 to A liquid metering tank 2.
In the same way, the quantitative chemical B liquid 18 is placed in the B liquid quantitative tank 23.
Store them in each. To supply liquid to the etching tank 1, the A liquid supply solenoid valve 26 and the B liquid supply solenoid valve 27 are operated respectively, and A liquid is supplied from the metering tank 22 through the piping 32, and B liquid is supplied from the metering tank 26 through the piping 66. The liquid is supplied to the etching tank 1, and a fixed amount is prepared in the etching tank 1.

次に定量タンク22.23の定量レベルを調整する場合
は、ナツト40を緩めてオーバーフロー配管30.31
を上下させ、その管開口端の位置を調整してオーバーフ
ロー面の高さを変身−ることにより行なう。
Next, when adjusting the metering level in the metering tank 22.23, loosen the nut 40 and tighten the overflow pipe 30.31.
This is done by raising and lowering the pipe and adjusting the position of the opening end of the pipe to change the height of the overflow surface.

したがって、本発明は従来作業者が保護具を着用して行
なっていた作業を自動操作により行なえるため、安全に
作業を行なえるものであり、しかも省力化を図ることが
できる。また、自動操作により給液および定量を行なう
ことができるだめ、薬品の調合における作業ミスの低減
を図ることができる。寸だ、各定量タンクの定量レベル
を任意に調整することにより、各薬品の調合比を任意に
選択できるのである。
Therefore, according to the present invention, the work that was conventionally performed by an operator wearing protective equipment can be performed automatically, so that the work can be performed safely and labor-saving can be achieved. Furthermore, since liquid supply and quantitative determination can be performed automatically, it is possible to reduce operational errors in compounding chemicals. By arbitrarily adjusting the quantitative level in each quantitative metering tank, the mixing ratio of each chemical can be arbitrarily selected.

以上のように本発明によれば、薬品調合作業を機械化し
て自動化を図)ることかできる効果を有するものである
As described above, according to the present invention, it is possible to mechanize and automate the drug compounding work.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、ウェハーにエツチング、水洗、乾燥処理を行
なう工程を示す概略図、第2図は本発明の実施例におけ
るエツチング槽への各薬品の定量混合を行なう配管系統
図、第3図は定量タンクの断面図である。 1・・・エツチング槽、6・・・半導体ウニ・・−14
・・・エツチング液、13・・・薬品A液、14・・・
貯液タンク、18・・・薬品B液、22・・・定量タン
ク、25−゛°定量タンク、26・・・電磁弁、27・
・・電磁弁、30・・・オーバーフロー配管、61・・
・オーバーフロー配管。 特許出願人  日本電気株式会社 第1図
Fig. 1 is a schematic diagram showing the steps of etching, rinsing, and drying a wafer, Fig. 2 is a piping system diagram for quantitatively mixing each chemical into the etching tank in an embodiment of the present invention, and Fig. 3 is FIG. 3 is a sectional view of a metering tank. 1... Etching tank, 6... Semiconductor sea urchin...-14
...Etching liquid, 13...Chemical A solution, 14...
Liquid storage tank, 18... Chemical B liquid, 22... Metering tank, 25-゛° quantitative tank, 26... Solenoid valve, 27...
...Solenoid valve, 30...Overflow piping, 61...
・Overflow piping. Patent applicant: NEC Corporation Figure 1

Claims (1)

【特許請求の範囲】[Claims] (1)半導体ウェハーをエツチング処理する半導体ウェ
ハー製造装置において、定量調合すべき薬品を内部に収
容する複数の定量タンクを備え、各タンクに余剰の薬品
を排液させるオーバーフロー管を設置し、開閉用制御弁
を備えた配管を介して前記複数の定量タンクをエツチン
グ槽に配管したことを特徴とする半導体ウェハー製造装
置。。
(1) Semiconductor wafer manufacturing equipment that etches semiconductor wafers is equipped with multiple quantitative tanks that contain chemicals to be mixed in a fixed amount, and each tank is equipped with an overflow pipe for draining excess chemicals. A semiconductor wafer manufacturing apparatus characterized in that the plurality of metering tanks are connected to an etching tank via piping equipped with a control valve. .
JP13961982A 1982-08-11 1982-08-11 Semiconductor wafer manufacturing apparatus Pending JPS5929424A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13961982A JPS5929424A (en) 1982-08-11 1982-08-11 Semiconductor wafer manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13961982A JPS5929424A (en) 1982-08-11 1982-08-11 Semiconductor wafer manufacturing apparatus

Publications (1)

Publication Number Publication Date
JPS5929424A true JPS5929424A (en) 1984-02-16

Family

ID=15249502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13961982A Pending JPS5929424A (en) 1982-08-11 1982-08-11 Semiconductor wafer manufacturing apparatus

Country Status (1)

Country Link
JP (1) JPS5929424A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0563625A2 (en) * 1992-04-03 1993-10-06 International Business Machines Corporation Immersion scanning system for fabricating porous silicon films and devices
JP2002204941A (en) * 2001-01-15 2002-07-23 Tamagawa Machinery Co Ltd Chemical solution producer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5057180A (en) * 1973-09-18 1975-05-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5057180A (en) * 1973-09-18 1975-05-19

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0563625A2 (en) * 1992-04-03 1993-10-06 International Business Machines Corporation Immersion scanning system for fabricating porous silicon films and devices
EP0563625A3 (en) * 1992-04-03 1994-05-25 Ibm Immersion scanning system for fabricating porous silicon films and devices
JP2002204941A (en) * 2001-01-15 2002-07-23 Tamagawa Machinery Co Ltd Chemical solution producer

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