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JPS5916138U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5916138U
JPS5916138U JP11181582U JP11181582U JPS5916138U JP S5916138 U JPS5916138 U JP S5916138U JP 11181582 U JP11181582 U JP 11181582U JP 11181582 U JP11181582 U JP 11181582U JP S5916138 U JPS5916138 U JP S5916138U
Authority
JP
Japan
Prior art keywords
electrode wiring
semiconductor equipment
sealing resin
wiring board
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11181582U
Other languages
English (en)
Inventor
福西　寛隆
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP11181582U priority Critical patent/JPS5916138U/ja
Publication of JPS5916138U publication Critical patent/JPS5916138U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　　ｂはそれぞれ従来の樹脂封止型半導体装
置の断面図および平面図、第２図ａ、　　ｂはそれぞれ
本考案の一実施例の断面図および平面図である。 １・・・・・・金属ベース、２・・・・・・半導体素子
、３゜１３・・・・・・リード端子、４・・・・・・金
属細線、５・・・・・・封止樹脂体、６・・・・・・電
極配線板、６ａ・・・・・・電極配線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を内部に包蔵した封止樹脂体と、前記半導体
    素子の電極と金属細線で接続された電極配線を有し一部
    分が前記封止樹脂体の外部に露出された電極配線板と、
    この電極配線板と前記露出部で接続されたリード端子と
    を含むことを特徴とする半導体装置。
JP11181582U 1982-07-23 1982-07-23 半導体装置 Pending JPS5916138U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11181582U JPS5916138U (ja) 1982-07-23 1982-07-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11181582U JPS5916138U (ja) 1982-07-23 1982-07-23 半導体装置

Publications (1)

Publication Number Publication Date
JPS5916138U true JPS5916138U (ja) 1984-01-31

Family

ID=30259459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11181582U Pending JPS5916138U (ja) 1982-07-23 1982-07-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS5916138U (ja)

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