JPS59157281A - Sputtering device - Google Patents

Abstract

PURPOSE:To provide a titled device which decreases the floor area thereof and forms a sputtered film having good quality by the constitution wherein works are charged into a sputtered film forming part provided with a rotary body segmented radially to plural pieces from a chaging and discharging part perpendicularly underneath said part and are discharged from said forming part. CONSTITUTION:A sputtered film forming part 3 in a sputtering device consisting of a work charging part 1, a discharging part 2 and the sputtered film forming part 3 is formed of a rotating body disposed radially with sputtering vessels 35a-f segmented to six pieces and a case body 5 which support the rotating body and are provided with four sputtering sources 21. The charging part 1 and discharging part 2 which charge and discharge the works to and from said rotating body are provided beneath the above-mentioned case body 5, and the works 10 are charged and discharged in an approximately perpendicular direction in the state of erecting the same in a vertical direction by means of a charging device A and discharging device B consisting of levers 9, 15 turning around the shafts 8, 14 provided respectively to said charging and discharging parts and receiving bases 11 mounted to the tip of the same.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a sputtering apparatus, and more particularly to an improvement in a sputtering apparatus in which workpieces are arranged radially and sputtering can be performed efficiently.

[Technical background of the invention]

Conventionally, in a vacuum chamber, a magnet is placed near a target support member that supports a target, which is the base ivy material, and the target is spun by a plasma discharge generated when the target is energized. A sputtering device is known that generates a sputtered film on the surface of a workpiece placed in a vacuum chamber by sputtering.

However, in the conventional sputtering device mentioned above, a horizontal rotating body is formed to continuously generate the entire suction film on the workpiece, and to downsize the device itself and reduce the installation space. It is configured so that works such as seven silicon wafers are arranged on the circumference. In order to carry the work into and out of the vacuum chamber, the structure is such that a carry-in/out port is provided at one or two locations on either side of the vacuum chamber, and the work is loaded or taken out from there.

[Notes on background technology]

However, in the conventional sputtering equipment described above, the workpiece is placed horizontally in the vacuum chamber, so there is a high possibility that the processing surface of the workpiece, such as a wafer, will be contaminated with the substrate due to dust, etc. It has become an obstacle.

In addition, when the workpieces are transported and processed in a horizontal state, arranging the workpieces on the circumference aims to improve the efficiency of equipment installation, but the space VC is still large. Further improvement was desired.

Furthermore, the workpiece loading and unloading sections are ultimately provided adjacent to the left and right sides of the vacuum chamber, which poses a serious obstacle to reducing the installation area of the device.

Purpose of the Invention] In view of the above-mentioned conventional VC situation, the present invention aims to reduce the installation area of the entire M fit that drains the vacuum chamber and to generate a high-quality sputtered film, thereby eliminating the drawbacks of the conventional VC. It was done for that purpose.

[Summary of the invention]

In order to achieve the above object, the present invention has a structure in which a workpiece loading part and a workpiece unloading part are made to be close to each other or to be used together, and are located below a vacuum chamber which is a sputtered film production part. The rotating bodies in the empty tank are arranged in a substantially vertical plane and in the radial direction, thereby realizing a small installation area and high-quality processing.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention shown in the drawings will be described.

As shown in FIG. 1, the sputtering device of the present invention comprises a workpiece loading section 1, a workpiece unloading section 2.2, and a sputtered film generating section 3. The generating unit 3 is formed of a rotating body 4 and a case body 5 that houses the rotating body 4.

The loading section is located at the bottom together with the unloading section 2, and the case main body 5, which is the suction and ivy film generating section 3, is mounted above both.

The case charging section 1 is shaped like a box 'O', and in order to charge the workpiece to the suzetta film generating section 3, the upper part is opened to form a charging port 6, and this part is used to open the case body. It is connected with 5. The lower part of the box-like interior forms a cavity 7ai for storing a soak.

Inside the charging section 1, a charging device A is provided that transports the workpiece from a receiving position to a charging position. As shown in FIG. 3 as an example of a specific configuration, this charging device A has one end of a lever 9 whose intermediate portion is bent into a valley supported by a lever 8 which serves as a fulcrum in the upper portion and is rotationally driven. , this lever 9 is swingable about the shaft 8.

The shaft 8 marked iIJ and the shaft 40IK- at the other end of the lever 9 have snow rockets) 41 and 42 of the same diameter fixed thereto. 43, 44
When the chino 45 is hung around and the shaft 8 is rotated, the shaft 4
The base of a pedestal J1 for supporting a workpiece 10 is fixed to the shaft 40 at the other end of this lever 9σ, which is raised and lowered without rotating, and this pedestal 11 is held in a horizontal position. Well, it's going up and down.

In addition, the above mechanism can be replaced with a snorocket and a chain, as well as a zori, a belt, a guitar series, etc.

The pedestal 11 supports the workpiece 10 at both ends of its upper part, and when the lever 9 moves upward from the downward position (the position shown by the solid line in FIG. Charging port 6'f: It is designed to be charged through. After the workpiece 10 loaded into the case body 5 is attached to the rotating body 4, the lever 9 returns to the loading section 1,
The opening is sealed by the pulp 12. On the other hand, the take-out part 2 of the workpiece 10 is located at a position almost symmetrical to the loading part 1 with respect to the center V of the case body 5 (/) mentioned in 1Qii. It is box-shaped and has the same size as Iribe 1.
In order to take out the work lO that was in the Su-Matsuta film generating section 3, the upper part 1 is formed in an open take-out port 13, and is connected to the case main body 5 at this part. The lower part of the box-shaped interior is a point 7b for taking out the workpiece on which the soot and ivy film has been formed.

Further, in the take-out port 13, there is provided a take-out device B which is opposite to the charging device A in the charging section 1. This take-out device B has a shaft 1 which is a fulcrum provided in the upper part.
4, and on this shaft 14, one end of a lever 15 whose middle part is bent into a valley is supported.
is a oscillating scale centered on the shaft 14. A pedestal 11 of the same size as the charging device A is provided at the other end 15a of the lever 15, and its base is connected to the other end 15a of the lever 15.
5a's shaft 1.4K is fixed.

The workpiece 10 is supported at both ends of the upper part of the pedestal 11. Note that this lever 15 is raised from the lower position to the upper position by a drive f+Ib mechanism configured similarly to the charging device A in the charging section IK, and accordingly, the case of the S-7 film generating section 3 is raised. The work 10 removed from the main body 5 is supported by the pedestal 1 and lowered into the take-out section 2, where it is removed. At this time, the pedestal 11 has a mechanism to maintain a horizontal state even if it moves from the upper position to the upper direction/spear (this is exactly the same as in the case of charging device A (7)).

The case body 5 has a thin cylindrical shape, as shown in FIG. It is fixed in place. Further, a fixed shaft 18 is provided at the center of the rear plate 17 to support the rotating body 4 and allow it to rotate.

A front lid 19, whose central portion is turned outward and curved into a convex shape, is connected to the front surface of the case body 5 by a bolt rib or other means.

In the front cover 19, there are several sputter sources 21 radially extending from the outside into the case body 5, including a target 9 which is a sputtering material, a target support member, a magnet, etc. ) It's dazzling, this (7), X
The VC is set so that the T4 sputter source 21 generates a 10 V sputter on the workpiece.

The rotating body 4 is disc-shaped and has a wide bearing part 4 in the center thereof, which is fitted onto the fixed shaft 18, and is capable of rotating by 0 J around the fixed shaft 18.

In addition, the rotating body 4 has a plurality of holes (b1 holes in the embodiment) drilled radially from the center and at corresponding distances, and the bearing case portion is attached to these six holes, and the bearing U is lowered in a circular shape. ing. The chuck 2!5 holding the workpiece 10 is rotatably lowered by this bearing.

The chuck 25 consists of an outer cylinder 27 into which a plain bearing 26 is fitted, a shaft, and a spring Z9, as shown in detail in FIG.
and a pawl 30, and the /gift 28 is fitted into the outer cylinder 29 so as to be able to move within the flat bearing 26 after FliJ.

The spring 29 is fitted onto the shaft 28, and one end is held by the head of the rear end of the shaft row, and the other end is held by the side wall of the small diameter portion in the outer cylinder 27.

In addition, the 11" end of the shaft is provided with a multi-number lever σ] pawl, which is the same axis as the shaft, L, and up.
Hydraulic pressure pump pumped on the back side of the face plate 17, 3
1 rerondo, the light leakage of 31a extends and touches the head of shirt) 28 1'Jt: Then, if the shaft moves forward,
29 compresses, and as a result, 30 expands and releases payment 7q:j.

The tip of the broken rod moves back and separates from the head, and as a result, the V springs 29 are restored, and when the shaft moves backward by σ, the pawls 30 are moved closer to each other and tightened.

Therefore, the outer surface Vc of the central part of the workpiece 10 has a smaller diameter than the temporary workpiece 10 7j・Outside M of the rod 32:, li, , the rod 31a of the hydraulic cylinder 31 (1) Due to the retreat, the claws 3G also touch each other. This is to bring them close together and tighten them.

In addition, the mounting part of each chuck of the rotating body 4 is connected to the partition 3.
3 and a plurality of pieces depending on the cover (in the example, 6 il<
11) 1 solid sputtering tank: '>5a, 35b
, 35c +35d, 35e, 35f are the first
In the figure, they are formed in order of first to sixth clockwise from the lower left. Each gas tank 35a, 35b, 35c
, 35d , 35e , :35i are cases 75 (chuck 25V) with 11 sides each fed from charging section 1.
The gear 36 attached to the rear VC of the chuck 5 and the motor 37 provided on the side of the rear plate 17 are directly connected and rotate at the same time! ! , 38, so that when the heater 37 is rotated, the work piece O held by the chuck 25 rotates on its own axis.

Note that the valley source 21 (see above) of Ail 19 is connected to the two lower white sides of each sputter arm of the rotating body 4 (35b).
, 35c.

35e and 35f, and the center is located above or below the center of the suzesota tank, or the workpiece crab rotates on its own axis as described above, so the suze generated on the surface of the workpiece is The ivy film is designed to avoid unevenness.

In addition, since the VC is configured to rotate the gear 39 provided on the partition 933 of the rotary body 4 via the gear so that the drive device (not shown) is assisted, the rotary body integrated with this i-wheel 39 4 can be rotated around the fixed shaft 18 and can be rotated intermittently.

Next, the effect will be explained. The unprocessed first circular workpiece 10 stored in the loading section IK is stored in the receiver mH at the lowest position of the table L/par 9.

When the drive device is activated to raise the lever 9 from the lowest position, the saucer 11 remains in a horizontal position and the lever 9
The sputtering tank 35a is automatically charged from the vacuum port 6 into the first sputtering tank 35a.

Here, the chuck, which was waiting to extend the rond by operating the hydraulic cylinder 31 and press the spring 29 to release the holder 32 of the workpiece 1o, is moved by the return force of the spring 29 as the rond of the hydraulic cylinder 31 contracts. by holder 3
2 is held by a plurality of claws 30.

Thereafter, the first workpiece 1o is moved by the rotating body 4 to
35
Come to position t).

In this state, the second workpiece 1o is loaded into the first sputtering tank 35a, and the first workpiece 1o
Similarly to 0, the holder 32 is held by the chuck 25.

The sputtering source 2 facing the sputtering tank with the first workpiece 1oid and m2 weighing 1g in the second Snokkuta tank 35b
From 11.ζ, a film of soot and ivy is formed on the surface.

Moreover, as mentioned above, since the 1llc work 10 rotates on its own axis due to the rotation of the motor 37, the film must be uniformly formed so as not to be too dense.

When the formation of the sputter and ivy film at the position of the second sputter 4135b is completed, the first workpiece 10 is moved to the position of the third sputter and ivy @35c by the rotation of the rotating body 4. Also, the second work 10V Go, the second A' ivy tachibana 35b] position i?1-Vc is moved, and the third new work is charged into the first squirrel/mother ivy tank 35a. be done.

In this way, the rotating body 4 rotates in the Il [Q order, sputtered films are laminated each time, and the first workpiece is placed in the fifth base vine tank 35e after the process is completed. When the production of a sputtered film of a predetermined thickness is completed and the workpiece 10 is moved to the position of the sixth sputtering tank 351, the saucer 11 is raised from the straw removal part 2 by the swinging of the lever 15, and the workpiece 10 is Nayak 5 holding holder 32
However, when the rond of the hydraulic cylinder 31 is released, the workpiece 10 is supported only by the receiving tray 1 of the 7th part 15 of the take-out section 2.1. The lever 15 driven by the drive device descends into the takeout section 2 .

The works 10 that have been processed in this manner are sequentially taken out of the apparatus.

In this embodiment, a case has been described in which there are six suction/vine mother tanks and four suction/vine sources, but as shown in FIG. There may be 51 rotating sputter tanks 43 housed in the case 42, and 4 sputter sources 44, so that workpieces can be loaded and unloaded alternately.

Further, although the present embodiment has been described with reference to the above two cases, it is not limited thereto, and it is not to the extent that changes can be made as appropriate within the scope of the gist of the present invention.

〔Effect of the invention〕

The suction ring device of the present invention is configured as described above,
The workpiece loading and unloading sections are all located below the sputtered film generation section, and the workpiece is moved and conveyed between the loading and unloading sections and the film generation section while standing vertically. The entire fruiting device is installed &! The area can be made extremely narrow, the workpiece itself is processed in a vertical position during sputtering, which significantly reduces the adhesion of dust, etc. to the processing surface, and the loading/unloading mechanism to the film generation section is entirely vertical. By installing it in the direction of film generation part F, charging and
The take-out mechanism has been made extremely compact and simple, and the practical effects are extremely significant.

[Brief explanation of the drawing]

Fig. 1 is a front sectional view showing an embodiment of the suction ring device i according to the present invention, Fig. 2 is a sectional view of the side of the first Fig. 3, and Fig. 3 is a charging device of the workpiece charging section. FIG. 4 is an enlarged sectional view of the same chuck, and FIG. 5 is a front side view showing another embodiment of the sputtering apparatus of the present invention. DESCRIPTION OF SYMBOLS 1...Charging part, 2...Ejecting part, 3...Summary film generation part, 4...Rotating body, 5...Case body, 21.
...su・gutsuta source, 35 a, (...su・gutsuta tank, 40... charging section, ■... unloading section, lI3...
・Pi, empty tank, 44... Suzotsuta source, A... charging device, 8... unloading device. Applicant's agent Kiyoshi Inomata Figure 1 7a 7b 弗2

Claims (1)

[Claims] A sputtering device comprising a workpiece loading section, an unloading section, and a sputtered film generating section, comprising: a rotating body in which a sputtered film generating section is divided into a plurality of parts and arranged in a radial direction;
A case body that fully supports the rotary body, and a charging ridge portion for loading and unloading the work from the loading portion to the rotary body of the case body is located below the case body, and the loading and unloading of the work is facilitated. A suction ring device characterized in that it is configured to perform the suction in a substantially vertical direction.