JPS59146975U - flexible wiring board - Google Patents
flexible wiring boardInfo
- Publication number
- JPS59146975U JPS59146975U JP4050083U JP4050083U JPS59146975U JP S59146975 U JPS59146975 U JP S59146975U JP 4050083 U JP4050083 U JP 4050083U JP 4050083 U JP4050083 U JP 4050083U JP S59146975 U JPS59146975 U JP S59146975U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- flexible
- insulating substrate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のフレキシブル配線板の断面図、第2図は
補強基板とフレキシブル配線板間に発生したガス残留に
よるフレキシブル基板上の電気部品の不安定接着の状態
を示す要部断面図、第3図は本考案の一実施例に用いる
補強基板の斜視図、第4図は本考案の一実施例のフレキ
シブル配線板の断面図である。
1・・・・・・補強基板、2・・・・・・接着剤ζ3・
・・・・・フレキシブル基板、4・・・・・・導体パタ
ーン、5・・・・・・電気部品、6・・・・・・孔。Figure 1 is a cross-sectional view of a conventional flexible wiring board, Figure 2 is a cross-sectional view of essential parts showing the state of unstable adhesion of electrical components on the flexible board due to residual gas generated between the reinforcing board and the flexible wiring board. FIG. 3 is a perspective view of a reinforcing board used in one embodiment of the present invention, and FIG. 4 is a sectional view of a flexible wiring board in one embodiment of the present invention. 1... Reinforcement board, 2... Adhesive ζ3.
...Flexible board, 4...Conductor pattern, 5...Electrical component, 6...Hole.
Claims (1)
ける導体パターンを設け、かつ前記絶縁基板の他方の面
の所望の箇所に多数の孔を設けた補強基板を接着してな
るフレキシブル配線板。A flexible wiring board formed by bonding a flexible insulating substrate with a conductive pattern on one side for attaching electrical components, and a reinforcing substrate with a number of holes provided at desired locations on the other side of the insulating substrate. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4050083U JPS59146975U (en) | 1983-03-18 | 1983-03-18 | flexible wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4050083U JPS59146975U (en) | 1983-03-18 | 1983-03-18 | flexible wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59146975U true JPS59146975U (en) | 1984-10-01 |
Family
ID=30171123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4050083U Pending JPS59146975U (en) | 1983-03-18 | 1983-03-18 | flexible wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59146975U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS645473U (en) * | 1987-06-27 | 1989-01-12 | ||
KR20200118690A (en) * | 2019-04-08 | 2020-10-16 | 삼성전기주식회사 | Printed circuit board |
-
1983
- 1983-03-18 JP JP4050083U patent/JPS59146975U/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS645473U (en) * | 1987-06-27 | 1989-01-12 | ||
KR20200118690A (en) * | 2019-04-08 | 2020-10-16 | 삼성전기주식회사 | Printed circuit board |
JP2020174168A (en) * | 2019-04-08 | 2020-10-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Printed circuit board |
TWI814840B (en) * | 2019-04-08 | 2023-09-11 | 南韓商三星電機股份有限公司 | Printed circuit board |
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