JPS59137174A - Preliminary soldering method - Google Patents
Preliminary soldering methodInfo
- Publication number
- JPS59137174A JPS59137174A JP1091683A JP1091683A JPS59137174A JP S59137174 A JPS59137174 A JP S59137174A JP 1091683 A JP1091683 A JP 1091683A JP 1091683 A JP1091683 A JP 1091683A JP S59137174 A JPS59137174 A JP S59137174A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- soldering
- solder
- contact
- preliminary soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（ａ） 発明の技術分野
本発明は予備半田付は方法に係り、特に半田接続を行う
べき微細な導体の特定部分に、容易に予備半田を施す方
法に関するものである。[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a method for pre-soldering, and in particular to a method for easily applying pre-solder to a specific part of a minute conductor to be soldered. .
（ｂ） 技術の背景
一般に回路部品あるいは素子部品等を基板上の接続導体
個所に半田付けする場合、それぞれの半田接続個所に予
め予備半田を施して、上記半田付けを容易に、かつ確実
に行う方法が広く用いられている。(b) Background of the Technology Generally, when circuit components or element components are soldered to connection conductor locations on a board, preliminary soldering is applied to each solder connection location in advance to facilitate and ensure the soldering. The method is widely used.
（Ｃ） 従来技術と問題点
例えば冷却型の多素子赤外線検知器を組立るような場合
には、円筒上の絶縁基体上に微小なピッチ間隔で配設さ
れた導電膜力）らなるリード配線パターンの各端部に、
例えばビームリードを半田付けにより接続する必要があ
り、その一方法として、該ビームリードの各微細な半田
接続ｈＩＳ分に予めフラックスを用いずに予備半田を薄
く施すことが要求されている。しかし、そのような予備
半田付けは従来力・ら用いられている半田ごてによる方
法、あるいは半田浸積法等では充分満足のいく予備半田
付けは困絵であり、容易に実施できる千９１ｄ十Ｈ」付
は方法が要望されている。(C) Prior art and problems For example, when assembling a cooled multi-element infrared detector, lead wiring consisting of conductive films arranged at minute pitches on a cylindrical insulating substrate is used. At each end of the pattern,
For example, it is necessary to connect beam leads by soldering, and one method for this is to apply a thin layer of preliminary solder to each minute solder connection hIS of the beam lead without using flux. However, it is difficult to perform such pre-soldering using the conventional method using a soldering iron or the solder immersion method, and it is difficult to achieve a sufficiently satisfactory pre-soldering using the conventional method using a soldering iron. Methods marked with "H" are requested.
（ｄ） 発明の目的
本発明は上記従来の実情を克服するため、予備半田を施
すべき導体表面に、半田部材を直接当接して、その両者
間の接触電気抵抗による発生熱によって前記半田部材を
溶融し、フラックスを用いることなく容易に予備半田を
施すようにした新規な予備半田付は方法を提供すること
を目的とするものである。(d) Purpose of the Invention In order to overcome the above-mentioned conventional situation, the present invention brings a solder member directly into contact with the surface of the conductor to which preliminary soldering is to be applied, and uses the heat generated by the electrical contact resistance between the two to solder the solder member. It is an object of the present invention to provide a novel pre-soldering method which facilitates the application of pre-soldering without melting and using flux.
（ｅ） 発明の構成
そしてこの目的は本発明によれば、導体の所定部分に予
備半田を付着する方法であって、上記導体の一端に、パ
ルス電流電源部の一方の電極を接続すると共に、その他
方の′電極を半田部材に接続し、前記導体の所定部分に
半田部材を当接せしめたタイミングによってパルス電流
を通電し、予備半田を施すようにしたことを特徴とする
予備半田付は方法を提供することによって達成される。(e) Structure and object of the invention According to the invention, there is provided a method for attaching preliminary solder to a predetermined portion of a conductor, the method comprising: connecting one electrode of a pulsed current power source to one end of the conductor; A preliminary soldering method characterized in that the other electrode is connected to a solder member, and a pulse current is applied at a timing when the solder member is brought into contact with a predetermined portion of the conductor to perform preliminary soldering. This is achieved by providing
（ｆ） 発明の実施例
以下図面を用いて本発明の方法の実施例についてｇ’ｐ
細に説明する。(f) Examples of the invention The following describes examples of the method of the invention using the drawings.
Explain in detail.
図面は本発明に係る予備半田付は方法の一実施肩を示す
概略説明図である。The drawing is a schematic explanatory view showing one implementation of the preliminary soldering method according to the present invention.
３、一本発明の方法は、図示の如く、予備半田を施すべ
き例えばビームリード等のリード導体ｌの一端に、パル
ス電流電源３の一方の電極端子３ｂを接続する。またそ
の他方の電極端子３ａを例えば金（Ａｕ ）−錫（Ｓｎ
）、または金（Ａｌｌ）−ゲルマニウム（Ｇｅ）等の低
融点合金からなる棒状の半田部材２に図示しないクリッ
プ等で電気的に接続する。3.1 In the method of the present invention, as shown in the figure, one electrode terminal 3b of the pulsed current power source 3 is connected to one end of a lead conductor l, such as a beam lead, to which preliminary soldering is to be applied. The other electrode terminal 3a is made of, for example, gold (Au)-tin (Sn).
), or a rod-shaped solder member 2 made of a low melting point alloy such as gold (All)-germanium (Ge) using a clip (not shown) or the like.
しかる後前記リード導体１を例えば絶縁性支持台４上に
載置した状態で該リード４体１の所定部分に前記半田部
材２を当接せしめ、該当接面を摺動する。そのタイミン
グで両者間に所定のパルス電流を通電することにより両
者間の接触抵抗によって局部的に発生するジュール熱に
より前記半田部材２の当接部分が溶融し、前記リード導
体ｌの所定部分に予備半田を、フラックスを用いること
なく、容易に施すことが可能となる。この場合、半田部
材２の先端部が溶融しているので、予備半田が終れば容
易に半田部材２を引きはなすことができる。Thereafter, with the lead conductor 1 placed on, for example, an insulating support base 4, the solder member 2 is brought into contact with a predetermined portion of the lead 4 body 1 and slid on the corresponding contact surface. By passing a predetermined pulse current between the two at that timing, the abutting portion of the solder member 2 is melted by Joule heat generated locally due to the contact resistance between the two, and a predetermined portion of the lead conductor l is heated. It becomes possible to easily apply solder without using flux. In this case, since the tip of the solder member 2 is melted, the solder member 2 can be easily pulled off once the preliminary soldering is finished.
なお上記した実施例では半田部材としてＡｕ −８ｎ、
あるいはＡｕ−Ｑｅ等の低融点合金を用いた場合の例に
ついて説明したが、本発明はこれに限定されるものでは
なく、例えばＰｂ−８ｎなどの各種低融点軟質半田を用
いて実施できることはいうまでもない。またフラックス
入りの半田部材を用いて予備半田を施すことも可能であ
る。In addition, in the above-mentioned embodiment, Au-8n,
Alternatively, an example in which a low melting point alloy such as Au-Qe is used has been described, but the present invention is not limited thereto, and can be implemented using various low melting point soft solders such as Pb-8n. Not even. It is also possible to perform preliminary soldering using a flux-cored solder member.
（ｇ） 発明の効果
以上の説明から明らかなように、本発明に係る予備半田
付は方法によれば、半田付けすべき導体の所定部分に当
接した半田部材との接触電気抵抗によって局部的に生ず
るジュール熱により、フラックスを用いることなく容易
に予１１ｉｆｔ半田を施すことが可能となる。さらに本
予備半田付は方法によれば、半田付けすべき微細な導体
の所定部分に予備半田を薄く施すことが容易であり、細
幅のＩＪ−ドフレムの端部に予備半田を施すのに極めて
有利である。その他接続導体の全体を加熱することなく
局部的に予備半田を施す場合に適用してすぐれた効果を
奏するものである。(g) Effects of the Invention As is clear from the above explanation, the pre-soldering method according to the present invention has the effect of reducing localized electrical resistance due to the contact electrical resistance of the solder member that is in contact with a predetermined portion of the conductor to be soldered. Due to the Joule heat generated, it is possible to easily perform pre-11ft soldering without using flux. Furthermore, according to this pre-soldering method, it is easy to apply a thin layer of pre-solder to a predetermined portion of a minute conductor to be soldered, and it is extremely suitable for applying pre-solder to the end of a narrow IJ-doframe. It's advantageous. In addition, it can be applied to locally apply preliminary soldering to the connecting conductor without heating the entire connection conductor, and has an excellent effect.
図面は本発明に係る予備半田付は方法の一実施略
例を説明する概桝説明図である。
図面において、ｌはリード導体、２は半田部材３はパル
ス電流電源、３ａ、８ｂは電極端子、４は絶縁性支持台
を示す。The drawing is a schematic diagram illustrating an embodiment of the preliminary soldering method according to the present invention. In the drawings, 1 is a lead conductor, 2 is a solder member 3 is a pulse current power source, 3a and 8b are electrode terminals, and 4 is an insulating support base.
Claims (1)
記導体の一端にパルス電流電源部の一方の電極を接続す
ると共に、その他方の電極を半田部材に接続し、前記導
体の所定部分に半田部材を当接せしめたタイミングによ
ってパルス電流を通電し、予備半田を施すようにしたこ
とを特徴とする予備半田付は方法。A method of attaching preliminary solder to a predetermined portion of a conductor, in which one electrode of a pulse current power source is connected to one end of the conductor, the other electrode is connected to a solder member, and the pre-solder is attached to a predetermined portion of the conductor. A pre-soldering method characterized in that a pulse current is applied at the timing when the solder parts are brought into contact to perform pre-soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1091683A JPS59137174A (en) | 1983-01-25 | 1983-01-25 | Preliminary soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1091683A JPS59137174A (en) | 1983-01-25 | 1983-01-25 | Preliminary soldering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59137174A true JPS59137174A (en) | 1984-08-07 |
Family
ID=11763577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1091683A Pending JPS59137174A (en) | 1983-01-25 | 1983-01-25 | Preliminary soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59137174A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5436483A (en) * | 1983-12-26 | 1995-07-25 | Hitachi, Ltd. | Semiconductor integrated circuit device having a first MISFET of an output buffer circuit and a second MISFET of an internal circuit |
| US5610089A (en) * | 1983-12-26 | 1997-03-11 | Hitachi, Ltd. | Method of fabrication of semiconductor integrated circuit device |
| WO2013083295A1 (en) * | 2012-02-01 | 2013-06-13 | Isabellenhütte Heusler Gmbh & Co. Kg | Soldering method and corresponding soldering device |
-
1983
- 1983-01-25 JP JP1091683A patent/JPS59137174A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5436483A (en) * | 1983-12-26 | 1995-07-25 | Hitachi, Ltd. | Semiconductor integrated circuit device having a first MISFET of an output buffer circuit and a second MISFET of an internal circuit |
| US5436484A (en) * | 1983-12-26 | 1995-07-25 | Hitachi, Ltd. | Semiconductor integrated circuit device having input protective elements and internal circuits |
| US5610089A (en) * | 1983-12-26 | 1997-03-11 | Hitachi, Ltd. | Method of fabrication of semiconductor integrated circuit device |
| WO2013083295A1 (en) * | 2012-02-01 | 2013-06-13 | Isabellenhütte Heusler Gmbh & Co. Kg | Soldering method and corresponding soldering device |
| CN104160793A (en) * | 2012-02-01 | 2014-11-19 | 伊莎贝尔努特·霍伊斯勒两合公司 | Soldering method and corresponding soldering device |
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