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JPS59123337U - Resin composition tablet for semiconductor encapsulation - Google Patents

Resin composition tablet for semiconductor encapsulation

Info

Publication number
JPS59123337U
JPS59123337U JP1782183U JP1782183U JPS59123337U JP S59123337 U JPS59123337 U JP S59123337U JP 1782183 U JP1782183 U JP 1782183U JP 1782183 U JP1782183 U JP 1782183U JP S59123337 U JPS59123337 U JP S59123337U
Authority
JP
Japan
Prior art keywords
resin composition
semiconductor encapsulation
composition tablet
tablet
convex curved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1782183U
Other languages
Japanese (ja)
Other versions
JPS6311722Y2 (en
Inventor
井上　保夫
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to JP1782183U priority Critical patent/JPS59123337U/en
Publication of JPS59123337U publication Critical patent/JPS59123337U/en
Application granted granted Critical
Publication of JPS6311722Y2 publication Critical patent/JPS6311722Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａ並びに第１図Ｂは本考案に係るタブレットを示
す側面図並びに上面図、第２図Ａ並びに第２図Ｂは本考
案タブレットの成形方法を示す説明図、第３図は本考案
の別実施例を示す側面図である。 図において、１は周囲平坦面、２は凸曲面、３は湾曲面
である。1A and 1B are a side view and a top view showing a tablet according to the present invention, FIGS. 2A and 2B are explanatory diagrams showing a method of molding the tablet according to the present invention, and FIG. It is a side view which shows another Example. In the figure, 1 is a peripheral flat surface, 2 is a convex curved surface, and 3 is a curved surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 粉末状樹脂組成物を円柱状に圧縮成形せるタブレットに
おいて、円柱状タブレットの上下面を周囲平坦面の凸曲
面とし、上下面の少くとも一方における上記平坦面と凸
曲面の境界面を湾曲面としたことを特徴とする半導体封
止用樹脂組成物タブ、　レット。In a tablet in which a powdered resin composition is compression molded into a cylindrical shape, the upper and lower surfaces of the cylindrical tablet are made convex curved surfaces of the surrounding flat surface, and the boundary surface between the flat surface and the convex curved surface on at least one of the top and bottom surfaces is a curved surface. A resin composition tab for semiconductor encapsulation, which is characterized by:
JP1782183U 1983-02-08 1983-02-08 Resin composition tablet for semiconductor encapsulation Granted JPS59123337U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1782183U JPS59123337U (en) 1983-02-08 1983-02-08 Resin composition tablet for semiconductor encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1782183U JPS59123337U (en) 1983-02-08 1983-02-08 Resin composition tablet for semiconductor encapsulation

Publications (2)

Publication Number Publication Date
JPS59123337U true JPS59123337U (en) 1984-08-20
JPS6311722Y2 JPS6311722Y2 (en) 1988-04-05

Family

ID=30149047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1782183U Granted JPS59123337U (en) 1983-02-08 1983-02-08 Resin composition tablet for semiconductor encapsulation

Country Status (1)

Country Link
JP (1) JPS59123337U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008302611A (en) * 2007-06-08 2008-12-18 Sumitomo Heavy Ind Ltd Resin sealing device and resin sealing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857904A (en) * 1981-10-02 1983-04-06 飯田工業株式会社 Controller for multiple-spindle planer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857904A (en) * 1981-10-02 1983-04-06 飯田工業株式会社 Controller for multiple-spindle planer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008302611A (en) * 2007-06-08 2008-12-18 Sumitomo Heavy Ind Ltd Resin sealing device and resin sealing method

Also Published As

Publication number Publication date
JPS6311722Y2 (en) 1988-04-05

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