JPS59121226A - Air bearing - Google Patents
Air bearingInfo
- Publication number
- JPS59121226A JPS59121226A JP22838882A JP22838882A JPS59121226A JP S59121226 A JPS59121226 A JP S59121226A JP 22838882 A JP22838882 A JP 22838882A JP 22838882 A JP22838882 A JP 22838882A JP S59121226 A JPS59121226 A JP S59121226A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- transferred
- blow
- side wall
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C29/00—Bearings for parts moving only linearly
- F16C29/02—Sliding-contact bearings
- F16C29/025—Hydrostatic or aerostatic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C32/00—Bearings not otherwise provided for
- F16C32/06—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
- F16C32/0603—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
Abstract
Description
【発明の詳細な説明】
(1)発明の技術分野
本発明はエアヘアリング、詳しくは直進性が改良された
搬送を行うことが可能な高精度エアベアリングに関する
。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to an air hair ring, and more particularly to a high-precision air bearing capable of conveying with improved straightness.
(2)技術の背景
エアベアリングは、現在多方面で使用されている流体に
よる浮上型(無接触型)搬送手段であり、被搬送体を無
接触状態に保ぢそれが傷付けられることを防止するので
、特にウェハやマスクのように、その表面または裏面に
傷が付くことを避ける必要のある物品の搬送に好適であ
る。加えて、エアベアリングは、物品のj絞込を自動化
するにも有益であるので、半導体装置の半導体装置にと
り入れられる伸開にある。(2) Background of the technology Air bearings are a floating type (non-contact type) transportation method using fluid that is currently used in many fields, and it keeps the transported object in a non-contact state and prevents it from being damaged. Therefore, it is particularly suitable for transporting items such as wafers and masks that need to be protected from being scratched on their front or back surfaces. In addition, air bearings are useful for automating the sifting of articles, and are therefore increasingly being incorporated into semiconductor devices.
第1図は従来のエアヘアリングを説明するための図で、
同図fatはその一部斜視図、(blは上記falにお
けるA−A線に沿った断面図で、同図を参照すると、エ
アヘアリングは平坦な搬送路4の両側に側壁5をもつ凹
形断面形状のものであり、前記搬送路4にはガス吹出口
3が規則的に配設されている。当該ガス吹出口3ば同図
(blに示す如<、1般送方向斜め前方にガスが吹き出
すように配設され、図示しない供給装置より供給される
ガスは、これに連結する供給流路3aを通り各吹出口3
から吹き出される。Figure 1 is a diagram to explain the conventional air hair ring.
In the same figure, fat is a partial perspective view, and (bl is a cross-sectional view taken along the line A-A in the above fal. The gas outlet 3 is regularly arranged in the conveyance path 4.The gas outlet 3 is located diagonally forward in the general feeding direction as shown in the same figure (bl). The gas is arranged so that the gas can be blown out, and the gas supplied from a supply device (not shown) passes through the supply channel 3a connected thereto and reaches each outlet 3.
It is blown out from.
上述したガスの吹出しにより例えばウエノ\の如き被搬
送体2は、搬送路4の床面から浮上し、ガスの前方向へ
の圧力により前方に押し出され、被1ift送体はこの
よう、に規則的に設けられたガス吹出口3からの吹出t
ガスの圧力により浮上し、無接触状態でなめらかに搬送
される。Due to the above-mentioned gas blowout, the conveyed object 2, such as Ueno\, rises from the floor of the conveyance path 4, and is pushed forward by the forward pressure of the gas, and the conveyed object 1ift is thus regularly Blowout from the gas blowout port 3 provided at
It floats up due to gas pressure and is transported smoothly without contact.
(3)従来技術と問題点
とごろで、上述した従来のエアベアリングにおいては、
同図fatに実線矢印で示す如く、被搬送体2はジグザ
グ運動をなし、側壁5に接触してその縁部分が破損する
ことが経験されている。その結果、ウェハ等の搬送体の
破損により生じる破片とか粉末が、被搬送体とともに処
理室にまで運ばれ、当該搬送体処理において前記した破
片や15)末が被搬送体に付着し、障害となる問題が生
じている。(3) Regarding conventional technology and problems, in the conventional air bearing mentioned above,
As shown by the solid arrow in fat in the same figure, it has been experienced that the conveyed object 2 makes a zigzag movement and comes into contact with the side wall 5, causing damage to its edge portion. As a result, fragments and powder caused by damage to the carrier such as wafers are carried to the processing chamber together with the carrier, and during the processing of the carrier, the above-mentioned debris and powder (15) adhere to the carrier and cause trouble. A problem has arisen.
(4)発明の目的
本発明は、上記従来の問題に鑑み、直線性の良い搬送を
行いうる高精度エアベアリングを提供することを目的と
する。(4) Purpose of the Invention In view of the above-mentioned conventional problems, an object of the present invention is to provide a high-precision air bearing that can perform conveyance with good linearity.
(5)発明の構成
そしてこの目的は本発明によれば、搬送路床面にガス吹
出口を配設し、該搬送路両側に側壁が設けられたエアベ
アリングにおいて、前記側壁の搬送路側の壁面にガス吹
出口を配設してなることを特徴とするエアベアリングを
提供することによって達成される。(5) Structure and object of the invention According to the present invention, in an air bearing in which a gas outlet is disposed on the conveying road floor surface and side walls are provided on both sides of the conveying path, the wall surface of the side wall on the conveying path side This is achieved by providing an air bearing characterized by having a gas outlet disposed in the air bearing.
(6)発明の実′h6例 以下図面によって本発明実施例を詳説する。(6) 6 examples of actual inventions Embodiments of the present invention will be explained in detail below with reference to the drawings.
第2図(alは本発明実施例の斜視図、同図fb)は同
図(alのB−B線に沿う断面図で、被搬送体12の搬
送方向は紙面に対し垂直な方向である。FIG. 2 (al is a perspective view of the embodiment of the present invention, and FIG. 2 fb is a cross-sectional view taken along line B-B in FIG. .
同図を参照すると、エアへアリング11には搬送路床面
のガス吹出口13に加えて、両側の側壁15の搬送通路
側の側面にもガス吹出口16を設け、当該吹出口16か
らカスを被IM、送体12の側面に向かって吹き出させ
ることにより、被搬送体12の側壁15への接触を防止
する。すなわち、被搬送体12が第1図(alに見て右
の側壁15に近ずくと、右の吹出口16からのカスによ
ってそれは反対側(左側の側壁の方向)に押しやられ、
次に左の側壁15に近ずくと、前とは逆に反対の方向(
右側の側壁の方向)に押しやられ、かくして被搬送体は
従来技術の場合に類似の方法でジグザグ運動を繰返しは
するが、決して側壁15につき当ることはない。なお被
搬送体12の持上げおよび搬送は従来通り床面14に配
設された吹出口13からの吹出しガスにより行われる。Referring to the same figure, in addition to the gas outlet 13 on the conveyance road floor surface, the air steering ring 11 is provided with a gas outlet 16 on the sides of the side walls 15 on both sides facing the conveyance path. By blowing out the IM toward the side surface of the conveyed body 12, the conveyed body 12 is prevented from coming into contact with the side wall 15. That is, when the conveyed object 12 approaches the right side wall 15 as seen in FIG.
Next, when approaching the left side wall 15, in the opposite direction from the front (
The conveyed object thus repeats the zigzag movement in a similar manner as in the prior art, but never hits the side wall 15. Note that lifting and conveying of the conveyed object 12 is performed by blowing gas from an outlet 13 disposed on the floor surface 14 as in the conventional manner.
かかる吹出口16からの吹出しガスの供給は、搬送路1
4に配設されている吹出口13へのガス供給系とは別の
供給系を設けると、ガス制御が容易になされうる。その
ような別個のガス供給系(図示せず)は、被搬送体12
の側壁15への接触防止を確実に行うため、ガス供給に
加えて被搬送体の種類に対応して吹出しガス量の調節を
も行うものとする。すなわち側壁15に対面する側面の
面積が小さい(ずなわぢ厚さが薄い)被搬送体の場合に
は、ガス量を多くして被搬送体の側面へ加える圧力を大
きくし、逆に側面積が大きい場合には上記よりかはガス
量を少なくして被搬送体が側壁15に触れることのない
ようにし、それによって効果的な直進性をもった搬送を
行う。The supply of the blowing gas from the blowing outlet 16 is carried out through the conveyance path 1.
If a supply system separate from the gas supply system to the outlet 13 disposed at 4 is provided, gas control can be easily performed. Such a separate gas supply system (not shown)
In order to reliably prevent the object from coming into contact with the side wall 15, in addition to the gas supply, the amount of blown gas is also adjusted depending on the type of object to be transported. In other words, in the case of a transported object whose side surface facing the side wall 15 has a small area (thin thickness), the amount of gas is increased to increase the pressure applied to the side surface of the transported object, and conversely, the side surface area is increased. If the amount is large, the amount of gas is reduced to prevent the object to be transported from touching the side wall 15, thereby achieving effective linear transport.
上述したガス量の調節は、被搬送体の種類に応じ、レギ
ュレータ等(図示せず)を用いた通常の技術で達成され
る。更に、ガス吹出口16の位置とか寸法も、被搬送体
の種類に対応して適宜設定する。The above-mentioned adjustment of the gas amount can be achieved by a normal technique using a regulator or the like (not shown) depending on the type of object to be transported. Furthermore, the position and dimensions of the gas outlet 16 are also set appropriately depending on the type of object to be transported.
なお上述したガス供給システム以外に、1つのガス供給
系によりガス供給を行うことも可能であり、この場合に
はガス供給量の調整が前記した場合に比べ複雑な機構を
必要とするが、そうであったとしてもガス量の調節は通
常の技術で行うごとが可能である。In addition to the gas supply system described above, it is also possible to supply gas with a single gas supply system, and in this case, adjusting the gas supply amount requires a more complicated mechanism than in the case described above. Even so, the gas amount can be adjusted using normal techniques.
(7)発明の勿J果
以上、詳細に説明した如く、本発明によれば、被搬送体
が側壁に触れることのない直進性の改良されたエアベア
リングを提供することかできるため、半導体装置製造工
程において例えばウェハもしくはマスクなどをBi (
Mなしに搬送することができ、ウェハの粉末とか破片等
が処理室にウェハと共に運び込まれることが防止される
ので、半導体装置の信頼性と生産性の向上に効果大であ
る。(7) Consequences of the Invention As explained in detail above, according to the present invention, it is possible to provide an air bearing with improved straightness in which the conveyed object does not touch the side wall. In the manufacturing process, for example, wafers or masks are coated with Bi (
Since the wafer can be transported without M, and wafer powder and debris are prevented from being carried into the processing chamber together with the wafer, it is highly effective in improving the reliability and productivity of semiconductor devices.
第り図は従来のエアベアリングを説明するための図で、
同図+a+はその要部斜視図、同図(b)はその断面図
、第2図(alは本発明実施例要部の斜視図、同図(b
+は同図(alの13−B線に沿う断面図である。
1.11− エアベアリング、2.12−被搬送体、3
.13.16−ガス吹出口3a・−ガス供給管、4.1
4−搬送路床面5.15−側壁
第1図
第2図Figure 2 is a diagram to explain a conventional air bearing.
Figure +a+ is a perspective view of the main part, Figure (b) is a sectional view thereof, Figure 2 (al is a perspective view of the main part of the embodiment of the present invention, Figure (b) is a perspective view of the main part,
+ is a sectional view taken along line 13-B in the same figure (al). 1.11- air bearing, 2.12- conveyed object, 3
.. 13.16-Gas outlet 3a--Gas supply pipe, 4.1
4-Conveyance road surface 5.15-Side wall Fig. 1 Fig. 2
Claims (1)
側に側壁が設けられたエアヘアリングであって、前記側
壁の搬送路側の壁面に複数のガス吹出口を配設してなる
ことを特徴とするエアベアリング。An air hair ring having a plurality of gas outlets on a conveyance path surface and side walls provided on both sides of the conveyance path, the plurality of gas outlets being arranged on the wall surface of the side wall on the side of the conveyance path. Air bearings are characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22838882A JPS59121226A (en) | 1982-12-27 | 1982-12-27 | Air bearing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22838882A JPS59121226A (en) | 1982-12-27 | 1982-12-27 | Air bearing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59121226A true JPS59121226A (en) | 1984-07-13 |
Family
ID=16875681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22838882A Pending JPS59121226A (en) | 1982-12-27 | 1982-12-27 | Air bearing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59121226A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007084266A (en) * | 2005-09-21 | 2007-04-05 | Akira Uehara | Article carrying machine |
KR100716025B1 (en) * | 1998-11-25 | 2007-05-08 | 가부시키가이샤 와코무 덴소 | Storage unit and storage apparatus of plate-type substrate |
ITMI20101024A1 (en) * | 2010-06-09 | 2011-12-10 | Off Mec Di Prec E G3 Di Gamba Walter | DEVICE AND METHOD FOR THE PRECISELY POSITIONING OF A MINIATURIZED PIECE IN A POSITIONING SEAT |
WO2012072266A1 (en) * | 2010-12-03 | 2012-06-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device and method for handling workpieces |
WO2013178786A2 (en) * | 2012-06-01 | 2013-12-05 | Dtg International Gmbh | Apparatus for and method of aligning and transporting workpieces |
US9575092B2 (en) | 2013-04-22 | 2017-02-21 | Stmicroelectronics S.R.L. | Vibrating device for positioning a miniaturized piece in a testing accommodation, and positioning method |
-
1982
- 1982-12-27 JP JP22838882A patent/JPS59121226A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100716025B1 (en) * | 1998-11-25 | 2007-05-08 | 가부시키가이샤 와코무 덴소 | Storage unit and storage apparatus of plate-type substrate |
JP2007084266A (en) * | 2005-09-21 | 2007-04-05 | Akira Uehara | Article carrying machine |
JP4736035B2 (en) * | 2005-09-21 | 2011-07-27 | 旻 上原 | Object transporter |
ITMI20101024A1 (en) * | 2010-06-09 | 2011-12-10 | Off Mec Di Prec E G3 Di Gamba Walter | DEVICE AND METHOD FOR THE PRECISELY POSITIONING OF A MINIATURIZED PIECE IN A POSITIONING SEAT |
WO2012072266A1 (en) * | 2010-12-03 | 2012-06-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device and method for handling workpieces |
WO2013178786A2 (en) * | 2012-06-01 | 2013-12-05 | Dtg International Gmbh | Apparatus for and method of aligning and transporting workpieces |
WO2013178786A3 (en) * | 2012-06-01 | 2014-03-06 | Dtg International Gmbh | Apparatus for and method of aligning and transporting workpieces |
US9575092B2 (en) | 2013-04-22 | 2017-02-21 | Stmicroelectronics S.R.L. | Vibrating device for positioning a miniaturized piece in a testing accommodation, and positioning method |
US10254332B2 (en) | 2013-04-22 | 2019-04-09 | Stmicroelectronics S.R.L. | Vibrating device for positioning a miniaturized piece in a testing accommodation, and positioning method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100567496B1 (en) | Carriers for thin disc shaped goods | |
JPS59121226A (en) | Air bearing | |
TW201708087A (en) | Substrate levitation and transportation device capable of precisely maintaining a flatness extent to perform transportation even for a wide-width substrate with a relatively large size in the cross-sectional direction | |
JP2000100896A (en) | Method and device for carrying wafer | |
JP2782516B2 (en) | Non-contact web transfer device | |
US4087133A (en) | Transport system for disc-shaped work-pieces | |
JPH07176593A (en) | Conveyer | |
JPS62128539A (en) | Conveyor for wafer | |
JPS6186311A (en) | Plate-like material transfer device | |
JPH04275449A (en) | Magnetic transfer apparatus | |
JPH028121A (en) | Wafer conveyor | |
JPS5957448A (en) | Manufacturing apparatus for semiconductor device | |
JP2000072252A (en) | Impact type air flow carrying device | |
JPS6374816A (en) | Transportation device | |
TWI714472B (en) | Wafer carrier transfer system | |
JPS6293922A (en) | Processing device | |
JPH06181249A (en) | Substrate conveying equipment | |
JPH05190645A (en) | Semiconductor substrate transfer mechanism | |
JPS6357451A (en) | Plate-like material conveying device | |
JPS63267178A (en) | Noncontact type conveyor | |
JPH06193746A (en) | Gate valve | |
JPH04186652A (en) | Carry system for clean room | |
JPH0248016Y2 (en) | ||
JPH04313212A (en) | Conveyance apparatus for semiconductor wafer | |
JPS62171820A (en) | Conveying device for work and the like |