JPS59104566U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS59104566U JPS59104566U JP19767682U JP19767682U JPS59104566U JP S59104566 U JPS59104566 U JP S59104566U JP 19767682 U JP19767682 U JP 19767682U JP 19767682 U JP19767682 U JP 19767682U JP S59104566 U JPS59104566 U JP S59104566U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electronic component
- component mounting
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は印刷配線板に、フラットパック型電子部品を取
付けた状態を示す平面図、第２図は第１図のフラットパ
ック型電子部品接続用ランド及び導通穴（部品取付は穴
）を共用しているランド部のｘ−ｘ’で切った断面図を
示す。第３図は第２図の１部を拡大したもので、ａはデ
ィップソルダ等によるはんだ付前を示し、ｂははんだ付
後を示す。第４図ａは、本考案の一実施例を示す第２図
Ａ部に相当する断面図、ｂはその平面図を示す。
第５図ａ、 ｂはそれぞれ、本考案の他の実施例を示
す第２図Ａ部に相当する断面図である。第６図は本考案
の応用例で、第４図しに相当する平面図である。
３・・・・・・フラットパック型電子部品のリード、４
・・・・・・フラットパック型電子部品接続用ランド及
び導通穴（部品取付は穴）を共用しているランド部、５
′・・・・・・フラットパック型電子部品リードとラン
ドを接続するはんだ合金層、７．８・・・・・・はんだ
付抵抗層。Figure 1 is a plan view showing flat pack electronic components attached to a printed wiring board, and Figure 2 shares the flat pack electronic component connection lands and conductive holes (holes for component mounting) in Figure 1. A sectional view taken along line xx' of the land portion shown in FIG. FIG. 3 is an enlarged view of a part of FIG. 2, where a shows the state before soldering by dip soldering or the like, and b shows the state after soldering. FIG. 4a is a sectional view corresponding to part A in FIG. 2 showing an embodiment of the present invention, and FIG. 4b is a plan view thereof. FIGS. 5a and 5b are sectional views corresponding to section A in FIG. 2 showing other embodiments of the present invention. FIG. 6 shows an application example of the present invention, and is a plan view corresponding to FIG. 4. 3...Flat pack type electronic component leads, 4
・・・・・・Land portion that shares the flat pack type electronic component connection land and the conduction hole (the hole for component mounting), 5
′...Solder alloy layer connecting the flat pack type electronic component lead and land, 7.8... Soldered resistance layer.
Claims (1)
を有する電子部品と印刷配線板上に配置された前記電子
部品接続用ラシド及び導通穴又は部品取付穴を共用して
いるランド部に、はんだ合金層を介して接続する印刷配
線板において、ディップソルダ等によるはんだ付時の熱
伝導等により前記はんだ合金層のフィレットの形状変化
及び流れ等を防止するためのはんだ付抵抗層を前記共用
ランド部の前記電子部品取付は部及び導通穴又は部品取
付穴の間に形成することを特徴とする印刷配線板。an electronic component having a plurality of leads arranged on the same plane at predetermined adjacent intervals, and a land portion that shares the electronic component connection rashid and conduction hole or component mounting hole arranged on the printed wiring board; In a printed wiring board that is connected via a solder alloy layer, a soldering resistance layer is attached to the common land to prevent the shape change and flow of the fillet of the solder alloy layer due to heat conduction during soldering using dip solder or the like. A printed wiring board characterized in that the electronic component mounting portion of the portion is formed between the portion and the conductive hole or the component mounting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19767682U JPS59104566U (en) | 1982-12-29 | 1982-12-29 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19767682U JPS59104566U (en) | 1982-12-29 | 1982-12-29 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59104566U true JPS59104566U (en) | 1984-07-13 |
Family
ID=30423134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19767682U Pending JPS59104566U (en) | 1982-12-29 | 1982-12-29 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59104566U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5381960A (en) * | 1976-12-27 | 1978-07-19 | Fujitsu Ltd | Printed board |
| JPS5486766A (en) * | 1977-12-22 | 1979-07-10 | Tokyo Shibaura Electric Co | Ic substrate |
-
1982
- 1982-12-29 JP JP19767682U patent/JPS59104566U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5381960A (en) * | 1976-12-27 | 1978-07-19 | Fujitsu Ltd | Printed board |
| JPS5486766A (en) * | 1977-12-22 | 1979-07-10 | Tokyo Shibaura Electric Co | Ic substrate |
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