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JPS5868944A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5868944A
JPS5868944A JP56167219A JP16721981A JPS5868944A JP S5868944 A JPS5868944 A JP S5868944A JP 56167219 A JP56167219 A JP 56167219A JP 16721981 A JP16721981 A JP 16721981A JP S5868944 A JPS5868944 A JP S5868944A
Authority
JP
Japan
Prior art keywords
pellet
tab
solder
layer
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56167219A
Other languages
English (en)
Inventor
Hiromichi Suzuki
博通 鈴木
Susumu Okikawa
進 沖川
Hajime Sato
佐藤　始
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56167219A priority Critical patent/JPS5868944A/ja
Publication of JPS5868944A publication Critical patent/JPS5868944A/ja
Pending legal-status Critical Current

Links

Classifications

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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は金、銀材料の省略化、低コスト化を図りかつ信
頼性の高い半導体装置に関するものである。
従来、半導体ペレットをリードフレームにペレット付ｆ
ｆする場合、リードフレームの半導体ペレット付は部及
びインナーリード部に金めつきを施こしておき、べＧン
トのシリコンとり゛−ドフレームの金、とを加熱（約４
００Ｃ）してスクラブすることによ゛り金−シリコン共
晶構造を作り、ペレ・ツト付けする方法を用い、ペルレ
ット付は後ペレットの電極部とインナーリード部を金線
によって接続する方式が一般的である。
ところが、このような構造では、ペレットと金めっき層
との間に形成される共晶合金が、両者間での面圧の不均
一等が原因となって、ペレット全面に均一に形成されな
いと、所謂部れの悪い箇所が生じ、その境界部に応力集
中が生じてペレットクラックが起こり昌くなり、信頼性
の低いものにな〜てしまう。また、前述の構造では高価
な金属である金をペレット付は及びワイヤボンディング
部やワイヤに多量に用いているためコスト高になってい
る。
したがって、本発明の目的は、信頼性が高く、しかも低
コストの半導体装置を提供することにある。　　　　　
　　　　　　　　　　　　　　°゛このような目的を達
成するために本発明による半導体装置は、リードフレー
ムのベレット付１部及びインナーリード部にＡＪをめっ
きあるいは蒸着によりもうけたものと、ペレット裏面に
同じようにＡ！なめっきあるいは蒸着によりもうけたも
のを、Ａ４が良く濡れるはんだで溶着しかつペレットの
電極部とインナーリード部をＡ！ワイヤで接続してなる
構造を特徴とするものである。
以下本発明の実施例を図面に基づいて説明する。
第１図は本発明の半導体装置の縦断面図であり、銅系、
鉄系金属の板材を所定のパターンに打抜き成形成いはエ
ツチングして形成したリードフレーム１は牛導体ペレッ
ト５をボンディングするタブ２及びインナーリード３に
Ａ１をめっきあるいは蒸着で形成しており、さらにアウ
ターリード４からなっている。そして前記タブ２には、
シリコンからなる牛導体ベレット５の裏面にＡ１層８を
めっき又は蒸着でもうけたものをＡＪに対して濡れの良
いはんだ７により加熱溶融して溶着し、かつペレット５
とインナーリード３上にもうけたＡノ層６間をＡ！ワイ
ヤ９にて接続している。更に、これ等ペレット５やイン
ナーリード３はレジン１０にて封止され、レジンモール
ド製パッケージが完成されている。
次に上記構造の牛導体装置の製造方法を第２図乃至第５
図を用いて説明する。
先ず、所定のパターンに形成した銅系、鉄系リードフレ
ームｌのタブ２及びインナーリード３にＡＪをめ、５ぎ
あるいは蒸着により形成する。６一方シリコンを主体と
した牛導体ベレット５はその裏面（ボンディング面）に
第３図に示すとと＜Ａ１層８をめっきあるいは蒸着によ
り形成してお（。
そしてリードフレーム１のタブ２をヒーター（図示せず
）上で窒素雰囲気を使用しかつＡ４とよく濡れるはんだ
７を用いて溶融温度迄加熱することにより数秒で溶融し
、前記ペレット５を揺動こすり（スクラブ）により溶着
し、ペレット裏面のＭ層８とタブ２のＡ１層６とはばん
だ７により一体化し、再び冷却固イｉしたときにペレッ
ト５をタブ２に固着する。その後、ペレット５とインナ
ーリード３をＡＪワイヤ９で接続し、レジン１０で封止
することにより第”１ｗＪに示した牛導体装置が完成さ
れるのである。従って、以上のようにして製造された牛
導体装置によれば、ボイドの少ない高信頼度のペレット
はんだ付け（低温ボンディング）が可能になり、しかも
金、銀等の高価な貴金属めっ墜の必要性もなくなり、大
巾な原価低減につながる。
なお、本発明はレジンモールド型の半導体装置に限定さ
れるものではなく、他の型式の半導体装置も含むもので
ある。
以上説明したように、本発明によれば、信頼性が高く、
しかも極めて低コストの半導体装置を得ることができる
。
【図面の簡単な説明】
第１図は本発明の半導体装置の一実施例を示す断面図、
第２図はリードフレーム上の金属めっき層を示す部分断
面図、第３図は牛導体ペレットの裏面構造の一例を示す
断面図、第４図乃至第５図は本発明の半導体装置の製造
工程を順次示す図である。 １・・・リードフレーム、２・・・タブ、３・・・イン
ナーリード、４・・・アウターリード、５・・・半導体
ペレット、６・・・ＡＪ３層、７・・・はんだ、８・・
・Ａ１層、９・・・Ａ！線、１０・・・レジン。

Claims (1)

    【特許請求の範囲】
  1. ペレット付は部及びインナーリード部にアルミニウム層
    を形成したリードフレームと、ペレット付は面にアルミ
    ニウム層を形成した半導体ペレットと、前記両アルミニ
    ウム層を結合するはんだ層と、前記半導体ペレットの電
    極部と前記インナーリード部とを電気的に接続するアル
    ミニウムワイヤとを具備してなる半導体装置。
JP56167219A 1981-10-21 1981-10-21 半導体装置 Pending JPS5868944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56167219A JPS5868944A (ja) 1981-10-21 1981-10-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56167219A JPS5868944A (ja) 1981-10-21 1981-10-21 半導体装置

Publications (1)

Publication Number Publication Date
JPS5868944A true JPS5868944A (ja) 1983-04-25

Family

ID=15845638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56167219A Pending JPS5868944A (ja) 1981-10-21 1981-10-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS5868944A (ja)

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