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JPS5863153A - Cooler for semiconductor rectifier - Google Patents

Cooler for semiconductor rectifier

Info

Publication number
JPS5863153A
JPS5863153A JP16255781A JP16255781A JPS5863153A JP S5863153 A JPS5863153 A JP S5863153A JP 16255781 A JP16255781 A JP 16255781A JP 16255781 A JP16255781 A JP 16255781A JP S5863153 A JPS5863153 A JP S5863153A
Authority
JP
Japan
Prior art keywords
heat
blocks
tube
heat sink
heat receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16255781A
Other languages
Japanese (ja)
Inventor
Tatsuhiro Ishii
石井 達広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Fuji Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Fuji Electric Manufacturing Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP16255781A priority Critical patent/JPS5863153A/en
Publication of JPS5863153A publication Critical patent/JPS5863153A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To cool many semiconductor elements with a set of coolers and to enable to form the entirety in small size by aligning a plurality of heat sink blocks laterally and flexibly coupling a heat sink tube inserted from the end block side between the blocks. CONSTITUTION:Numerals 1, 1' designate semiconductor rectifiers in the drawing, heat sink blocks 2, 2' contacted with the upper and lower sides of the rectifiers 1, 1' are aligned laterally in parallel with each other, a heat sink tube 3 forming a heat pipe is inserted from the sides of the blocks 2, 2', and the ends 3a of the tube 3 disposed between the blocks 2 and 2' are coupled with bellows 5. In this case, the tube 3 is partly opened in the block 2, part of the heat pipe may be formed at the block 2 itself. A fin 4a forming a heat sink 4 is mounted on the surface of the projection of the tube 3 in the same manner as the conventional one.

Description

【発明の詳細な説明】 本発明はヒートパイプを利用した半導体整流素子の冷却
体に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cooling body for a semiconductor rectifying element using a heat pipe.

かかる従来の冷却体を第1図、第2図について説明しよ
って本発明の目的を明らかにする。
The object of the present invention will be made clear by explaining such a conventional cooling body with reference to FIGS. 1 and 2.

第1図は従来例を示す平面図、第2図は同上正面図で、
図中2は半導体整流素子1の左右又は上下に当接する受
熱ブロックを示し、半導体整流素子1は2個の受熱ブロ
ック2で挾み込まれて所定の加圧力を加えられる。
Figure 1 is a plan view showing a conventional example, Figure 2 is a front view of the same as above,
In the figure, reference numeral 2 indicates a heat receiving block that abuts on the left and right or top and bottom sides of the semiconductor rectifying element 1, and the semiconductor rectifying element 1 is sandwiched between the two heat receiving blocks 2 and a predetermined pressing force is applied to the semiconductor rectifying element 1.

この受熱ブロック2には、ヒートパイプを構成する放熱
管3の端部を左右から挿入し、放熱管3の突出部表面に
は放熱部4を形成するフィン4αを設けている。
The end portions of heat dissipation tubes 3 constituting a heat pipe are inserted into this heat receiving block 2 from the left and right, and fins 4α forming heat dissipation portions 4 are provided on the surface of the protrusion of the heat dissipation tubes 3.

以上の構成からなシ、半導体整流素子1に通電するとそ
の発生熱は受熱ブロック2を介して放熱管3に伝わシ、
ヒートパイプ作用でフィン4αよシ大気中に放熱されて
冷却が行なわれるが、この従来例では下記のごとき欠点
がある。
With the above configuration, when the semiconductor rectifying element 1 is energized, the generated heat is transmitted to the heat dissipation tube 3 via the heat receiving block 2.
Although heat is radiated into the atmosphere through the fins 4α and cooled by the heat pipe action, this conventional example has the following drawbacks.

すなわち、上下2組の冷却体で冷却できる半導体整流素
子1は1組に限られてしまう。
That is, the number of semiconductor rectifier elements 1 that can be cooled by two sets of upper and lower cooling bodies is limited to one set.

本発明の目的はかかる不都合を解消し、1組の冷却体で
数多くの半導体素子を冷却でき、しかも全体を小形に形
成できる半導体整流素子の冷却体を提供することにある
SUMMARY OF THE INVENTION It is an object of the present invention to provide a cooling body for semiconductor rectifying elements that can eliminate such inconveniences, can cool a large number of semiconductor elements with one set of cooling bodies, and can be made compact as a whole.

しかしてこの目的は本発明によれば、半導体整波素子に
当接する受熱ブロックにヒートパイプを構成する放熱管
を挿入して冷却体を構成するものにおいて、受熱ブロッ
クは横方向に複数個並べ、最端の受熱ブロック側面から
挿入した放熱管は各受熱ブロック間で可撓的に連結する
ことにより達成される。
However, according to the present invention, the purpose of the lever is to configure a cooling body by inserting a heat dissipation tube constituting a heat pipe into a heat receiving block that is in contact with a semiconductor wave rectifying element, in which a plurality of heat receiving blocks are arranged in a horizontal direction, This is achieved by flexibly connecting the heat dissipation tubes inserted from the side surfaces of the heat receiving blocks at the ends.

以下、図面について本発明の実施ρりを詳iに説明する
Hereinafter, the implementation of the present invention will be explained in detail with reference to the drawings.

第3図は本発明の冷却体の実施例を示す平面図、第4図
は同上正面図で、上記従来例の第1図、第2図と同一構
成要素には同一参照番号を付したものである。
FIG. 3 is a plan view showing an embodiment of the cooling body of the present invention, and FIG. 4 is a front view of the same, in which the same components as in FIGS. 1 and 2 of the above-mentioned conventional example are given the same reference numbers. It is.

図中1,1′は半導体整流素子を示し、この半導体整流
素子1,1′の上下に当接する受熱ブロック2.2′は
横方向に平行に並べ、各受熱ブロック22′の側面から
ヒートパイプを構成する放熱管3を挿入貫通し、受熱ブ
ロック2,2′間に位置する上記放熱管3の端部3α相
互をベローズ5で連結し放され、受熱ブロック2自体に
ヒートパイプの一部を構成させるようにしてもよい。
In the figure, reference numerals 1 and 1' indicate semiconductor rectifying elements, and heat receiving blocks 2 and 2' that abut on the upper and lower sides of the semiconductor rectifying elements 1 and 1' are arranged horizontally in parallel, and heat pipes are connected to the sides of each heat receiving block 22'. A part of the heat pipe is inserted into the heat receiving block 2 itself, and the ends 3α of the heat dissipating pipe 3 located between the heat receiving blocks 2 and 2' are connected by a bellows 5 and released. It may be configured.

また、放熱管3の突出部表面には従来例と同じく放熱部
4を形成するフィン4aを取(=1ける。
Further, on the surface of the protruding portion of the heat dissipation tube 3, fins 4a forming the heat dissipation portion 4 are provided (=1) as in the conventional example.

なお、半導体整流素子1,1′が異電位の場合は、上記
放熱管3の端部3aとベローズ5との接合部は例えばセ
ラミック等の絶縁性の材料を用いて絶縁する必要がある
が、並列接続、逆並列結線のように同電位の場合はかか
る絶縁対策は不要である。
Note that if the semiconductor rectifying elements 1 and 1' have different potentials, the joint between the end 3a of the heat sink 3 and the bellows 5 needs to be insulated using an insulating material such as ceramic. In the case of the same potential, such as parallel connection or anti-parallel connection, such insulation measures are not required.

また、上記のごとく半導体整流素子1,1′が同電位の
場合は、放熱管3のnf l、j、9 [Iを利用して
ベローズ5を省略することもできる。
Furthermore, when the semiconductor rectifying elements 1 and 1' are at the same potential as described above, the bellows 5 can be omitted by utilizing nfl,j,9 [I of the heat sink 3.

さらに、他の実施例として受熱ブロックを6個以上横方
向に平行に並べることも可能である。
Furthermore, as another embodiment, it is also possible to arrange six or more heat receiving blocks in parallel in the lateral direction.

次に使用法及び作用について説明すると、受熱ブロック
2,2′のそれぞれに半導体整流素子1゜1′を取付け
、この半導体整流素子1,1′に通電するとその発生熱
は受熱ブロック2,2′を介して放熱管3に伝わシ、ヒ
ートパイプ作用でフィン4αよシ大気中に放熱されて冷
却が行なわれる。
Next, to explain the usage and operation, a semiconductor rectifying element 1°1' is attached to each of the heat receiving blocks 2, 2', and when the semiconductor rectifying elements 1, 1' are energized, the generated heat is transferred to the heat receiving blocks 2, 2'. The heat is transmitted to the heat dissipation tube 3 through the heat pipe and is radiated into the atmosphere through the fins 4α for cooling.

この際、半導体整流素子1,1′はそれぞれ上下に配し
た受熱ブロック2,2′間で加圧されるが、上記ベロー
ズ50可撓性を利用して均一に加圧できる。
At this time, the semiconductor rectifying elements 1 and 1' are pressurized between the heat receiving blocks 2 and 2' disposed above and below, respectively, and the flexibility of the bellows 50 allows uniform pressure to be applied.

また、半導体整流素子1,1′相互を特に逆並列結線し
た場合は、一方の素子1が通電中の時に他方の素子1′
は体重中ということになるが、かかる場合でも2つの放
熱部4はヒートパイプ作用で等測的に動作し、熱抵抗を
小さくして効率的に冷却することができる。
In addition, when the semiconductor rectifying elements 1 and 1' are connected in antiparallel to each other, when one element 1 is energized, the other element 1'
Even in such a case, the two heat radiating parts 4 operate isometrically due to the heat pipe action, reducing thermal resistance and efficiently cooling the body.

以上述べたように本発明の半導体整流素子の冷却体は、
半導体整流素子に当接する受熱ブロックにヒートパイプ
を構成する放熱管を挿入して冷却体を構成するものにお
いて、受熱ブロックは横方向に複数個並べ、最端の受熱
ブロック側面から挿入した放熱管は各受熱ブロック間で
可撓的に連結するようにしたので、1組の冷却体で数多
くの半導体整流素子を冷却でき、また全体を小形に形成
して安価に作成することができるものである。
As described above, the cooling body of the semiconductor rectifier of the present invention is
In the case where a cooling body is constructed by inserting a heat dissipation tube constituting a heat pipe into a heat receiving block that is in contact with a semiconductor rectifying element, a plurality of heat receiving blocks are arranged horizontally, and the heat dissipation tube inserted from the side of the endmost heat receiving block is Since each heat receiving block is flexibly connected, a large number of semiconductor rectifying elements can be cooled with one set of cooling bodies, and the whole can be made compact and manufactured at low cost.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の半導体整流素子の冷却体の平面図、第2
図は同上正面図、第6図は本発明の冷却体の実施例を示
す平面図、第4図は同」二重面図である。 1.1′・・・・・・半導体整流素子 2.2′・・・・・・受熱ブロック  ;1・・・・・
・放熱管3a・・・・・・端部  4・・・・・・放熱
部4α・・・・・・フィン 5・・・・・・ベローズ出
願人  富士電機製造株式会社 牙1図 4C 第3図
Figure 1 is a plan view of the cooling body of a conventional semiconductor rectifier;
The figure is a front view of the same as above, FIG. 6 is a plan view showing an embodiment of the cooling body of the present invention, and FIG. 4 is a double side view of the same. 1.1'...Semiconductor rectifying element 2.2'...Heat receiving block ;1...
- Heat dissipation tube 3a... End 4... Heat dissipation part 4α... Fin 5... Bellows Applicant Fuji Electric Manufacturing Co., Ltd. Fang 1 Figure 4C 3rd figure

Claims (1)

【特許請求の範囲】[Claims] (1)  半導体整流素子に当接する受熱ブロックにヒ
ートパイプを構成する放熱管を挿入して冷却体を構成す
るものにおいて、受熱ブロックは横方向に複数個並べ、
最端の受熱ブロック側面から挿入した放熱管は各受熱ブ
ロック間で可撓的に連結するようにしたことを特徴とす
る半導体整流素子の冷却体。 (2〕  可撓的連結はベローズを介して行なうもので
ある特許請求の範囲第1項記載の半導体整流素子の冷却
体。
(1) In a cooling body constructed by inserting a heat dissipation tube constituting a heat pipe into a heat receiving block that contacts a semiconductor rectifying element, a plurality of heat receiving blocks are arranged horizontally,
1. A cooling body for a semiconductor rectifying element, characterized in that a heat dissipation tube inserted from the side surface of the endmost heat receiving block is flexibly connected between each heat receiving block. (2) A cooling body for a semiconductor rectifying element according to claim 1, wherein the flexible connection is performed through a bellows.
JP16255781A 1981-10-12 1981-10-12 Cooler for semiconductor rectifier Pending JPS5863153A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16255781A JPS5863153A (en) 1981-10-12 1981-10-12 Cooler for semiconductor rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16255781A JPS5863153A (en) 1981-10-12 1981-10-12 Cooler for semiconductor rectifier

Publications (1)

Publication Number Publication Date
JPS5863153A true JPS5863153A (en) 1983-04-14

Family

ID=15756846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16255781A Pending JPS5863153A (en) 1981-10-12 1981-10-12 Cooler for semiconductor rectifier

Country Status (1)

Country Link
JP (1) JPS5863153A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0441572A2 (en) * 1990-02-07 1991-08-14 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0441572A2 (en) * 1990-02-07 1991-08-14 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property

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