JPS5858624U

JPS5858624U - Mixed mounting structure

Info

Publication number: JPS5858624U
Application number: JP15184281U
Authority: JP
Inventors: 豊嗣渡辺; 渡辺　紀男
Original assignee: 日本電気株式会社
Priority date: 1981-10-13
Filing date: 1981-10-13
Publication date: 1983-04-20

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来婢術での実装構造を示す斜視図、第２図は
部分的な多端子化の細巾を図示した説明図、第３図ａ　
”　ｃは電子回路パッケージでの多端子の様子を示した
電面図、第一図、第５図はそれぞれ本考案の一実施例を
示した正面図および一部切欠いて示した斜視図、第６図
は本考案の他の実施例を示す概略図である。１・・・・・・裏面配線板、２・・・・・・シャーシ、
３・・面電子回路パッケージ、４・・・・・・集積素子
、ＩＣ類、５・・・・・・多端子化電子回路パッケージ
、６・・・・・・コネクタ、７・・・・・・冷却ブロッ
ク、８，９・・・・・・システムの論理ブロック。Figure 1 is a perspective view showing a conventional mounting structure, Figure 2 is an explanatory diagram illustrating a partial multi-terminal structure, and Figure 3 a.
"c is an electrical plan view showing the state of multi-terminals in an electronic circuit package, FIG. 1 and FIG. Figure 6 is a schematic diagram showing another embodiment of the present invention. 1... Rear wiring board, 2... Chassis,
3... Surface electronic circuit package, 4... Integrated element, ICs, 5... Multi-terminal electronic circuit package, 6... Connector, 7... - Cooling block, 8, 9... Logical block of the system.

Claims

[Scope of utility model registration request]

(1) An electronic circuit package mounted with a functional element such as an integrated circuit is connected to a plurality of these electronic circuit packages via a connector, and the electronic circuit board is connected to a backside wiring board that accommodates wiring connections between the electronic circuit packages. One side of the electronic circuit package is used as the connector area and the package is mounted perpendicularly to the back side wiring board, and the other is the flat mount group where one side of the electronic circuit package is used as the connector area and the package is mounted parallel to the back side wiring board. The electronic circuit package and the backside wiring board are connected using three-dimensional mounting, creating a mixed mounting structure that is currently unique. □(2) Scope of Utility Model Registration In the mixed mounting structure described in claim 1, a cooling means such as a fan or a small duct is installed in the space created in the parallel mounted parts to cool a specific package. Features a mixed mounting structure.