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JPS5850457A - Detection of crack - Google Patents

Detection of crack

Info

Publication number
JPS5850457A
JPS5850457A JP14813881A JP14813881A JPS5850457A JP S5850457 A JPS5850457 A JP S5850457A JP 14813881 A JP14813881 A JP 14813881A JP 14813881 A JP14813881 A JP 14813881A JP S5850457 A JPS5850457 A JP S5850457A
Authority
JP
Japan
Prior art keywords
crack
potential difference
ratio
shape
distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14813881A
Other languages
Japanese (ja)
Inventor
Shinji Sakata
信二 坂田
Makoto Hayashi
真琴 林
Yoshimi Sato
善美 佐藤
Tasuku Shimizu
翼 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14813881A priority Critical patent/JPS5850457A/en
Publication of JPS5850457A publication Critical patent/JPS5850457A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20Investigating the presence of flaws

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

PURPOSE:To detect the shape and dimensions of a crack on the surface at a high accuacy by determining the surface length of the crack from the range of 2sigma and the depth thereof from the area ratio thereof and the ratio of potential difference through approximation of the distribution of the potential difference ratio to the normal distribution. CONSTITUTION:Direct current runs between A-A' from a D.C. power source (c) to measure a potential difference at upper and lower positions sandwitching a crack (a) between terminals 1-1', 2-2', 3-3'... and the results are inputted into a crack shape analyzer (f) through a micro voltometer (e) to compute the shape of the crack. In the analysis of the crack shape, the ratio V/V0 is obtained between a potential difference V0 without crack and a potential difference V after a crack develops to prepare a distribution of the potential difference ratio from which the shape and dimensions of the crack are determined. In approximation of the distribution of the potential difference ratio to the normal distribution, the surface length of the crack corresponds to the position of 2sigma (sigma: standard deviation). To determine the depth of the cracking, an equation of the cracking area S is established from a relationship of the ratio betwen the area S of the cracking and the total sectional area S0 thereof with the ratio of potential difference and calculated by substituting the surface length thereof previously obtained.

Description

【発明の詳細な説明】 本発明は、機器や配管に発生したき裂を検出する方法に
関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for detecting cracks occurring in equipment or piping.

従来、電気ポテンシャル法によるき裂検出としては、き
裂の一次元的な寸法(長さ、又は、深さ)のみしか計測
された例は無い。ここまでの検出技術としては、AEや
超音波法などがある。しかし、実機に発生するき裂は2
次元的な広がりを持ったき裂であり、このようなき裂に
対して、形状9寸法を精度良く検出する、測定データ解
析法は示されていないのが現状である。
Conventionally, there has been no example of crack detection using the electric potential method in which only one-dimensional dimension (length or depth) of a crack was measured. Detection techniques used so far include AE and ultrasound methods. However, the number of cracks that occur in the actual machine is 2
This is a crack that has a dimensional spread, and currently there is no measurement data analysis method that can accurately detect the nine dimensions of such a crack.

本発明の目的は機器や配管に発生する表面き裂を電気ポ
テンシャル法を用いて非破壊的に、き裂位置及び形状1
寸法を決定しようとするものである。
The purpose of the present invention is to detect surface cracks occurring in equipment and piping in a non-destructive manner using the electric potential method.
The purpose is to determine the dimensions.

本発明は、計測データの統計処理、具体的には電位差比
分布を正規分布に近似し、2σ(σ:標準偏差)の範囲
から、2次元き裂(表面き裂)の2自由度のうち表面長
さCを決定し、残りの1自由度のき裂深さaをき裂面積
比と電位差比から決定するものである。
The present invention deals with statistical processing of measurement data, specifically, approximating the potential difference distribution to a normal distribution, and calculating from the range of 2σ (σ: standard deviation) one of the two degrees of freedom of a two-dimensional crack (surface crack). The surface length C is determined, and the crack depth a of the remaining one degree of freedom is determined from the crack area ratio and the potential difference ratio.

本発明の実施例として、第1図に示す表面き裂を有する
平板を考える。同図に本発明の装置図を同時に示す。直
流電源装置より図中のAへ′間に直流電流を流し、き裂
をはさんだ、」二、下の位置での電位差を端子■−■′
、■−■′、■−■′・・・間で計測し、微小電圧計を
介してき製形状解析装置(マイクロコンピュータ)に入
りき裂形状を演算する。演算結果をCRT画面や他の表
示方法によシ表示し、オンラインでき裂進展をモニター
することができる。
As an example of the present invention, consider a flat plate having surface cracks as shown in FIG. The figure also shows a diagram of the apparatus of the present invention. A DC current is applied from the DC power supply to A in the figure between '' and the crack is sandwiched between them.
, ■-■', ■-■'... The crack shape is measured via a microvoltmeter and then entered into a fabrication shape analysis device (microcomputer) to calculate the crack shape. The calculation results can be displayed on a CRT screen or other display methods, and crack growth can be monitored online.

計測された電位差比分布からのき製形状解析法は、以下
のようにして行う。
The method of analyzing the woodworking shape from the measured potential difference ratio distribution is performed as follows.

第2図にき裂が無い状態での電位差V。とき裂が成長し
た後の電位差Vとの比V/Voのき裂中夫からの分布図
を示すが、この電位差比分布よりき裂形状及び寸法を決
定する。
Figure 2 shows the potential difference V when there is no crack. A distribution diagram of the ratio V/Vo to the potential difference V after the crack grows is shown from the crack core, and the crack shape and size are determined from this potential difference ratio distribution.

き裂形状は、一般にはき裂の表面長さCとき裂深さaに
よって決定される。故に、最初にき製表、′、・ 面長さCを決定し、次に深さaを決定する。Cは、第2
図の下半分に示しだ、き裂形状と対応させると良くわか
るが、表面でのき裂端部での電位差比はV/Vo=1.
oとはならない。すなわち、図中のa= Q、 Q r
ran (表面長さCの位置に対応する)の破線と交じ
わる位置がき裂の表面長さCに対応する。この関係を模
式的に示しだものが第3図である。同図のa−0,0咽
の位置捷での距離り、かき裂の表面長さCに等しい。
The crack shape is generally determined by the crack surface length C and the crack depth a. Therefore, first determine the surface length C, and then determine the depth a. C is the second
As shown in the lower half of the figure, it can be clearly seen that the potential difference ratio at the crack edge on the surface is V/Vo=1.
It is not o. In other words, a=Q, Q r in the figure
The position where ran (corresponding to the position of the surface length C) intersects with the broken line corresponds to the surface length C of the crack. FIG. 3 schematically shows this relationship. The distance at the position of a-0,0 in the figure is equal to the surface length C of the crack.

L、=に のLlの位置は、電位差比分布を正規分布に近似すると
2σの位置であり、かつ電位差比分布が、v/vo−1
,oとなる位置tでの距離(Ll+L2 )を2:1に
分ける位置でもある。
The position of Ll in L, = is the position of 2σ when the potential difference ratio distribution is approximated to a normal distribution, and the potential difference ratio distribution is v/vo-1
, o, and the distance (Ll+L2) at position t is divided 2:1.

この方法により、き裂表面長さCを決定してやれば、残
りはき裂深さaを求めれば良い。
Once the crack surface length C is determined by this method, the rest is to find the crack depth a.

今、き裂の占める面積Sと全断面積S。との比と電位差
比の、関tljを第4図に示す。この関係より測定され
た電位差比からき裂面積Sを決定する。
Now, the area occupied by the crack S and the total cross-sectional area S. FIG. 4 shows the relationship tlj between the ratio of tlj and the potential difference ratio. From this relationship, the crack area S is determined from the measured potential difference ratio.

き裂形状を楕円と仮定すれば、その面積は、S−πaC であるから、き裂深さaは a=S/πC によって算出される。Assuming that the crack shape is an ellipse, its area is S−πaC Therefore, the crack depth a is a=S/πC Calculated by

機器や配管に発生した表面き裂に対して、その形状及び
寸法を精度良く検出することができる。
The shape and dimensions of surface cracks occurring in equipment or piping can be detected with high accuracy.

また、機器のオンライン寿命診断用として利用でき機器
の健全性を常時、監視することができる。
It can also be used for online lifespan diagnosis of equipment, and the health of the equipment can be constantly monitored.

また、ここで用いる電気ポテンシャル法は、他の非破壊
検査技術より安定した出力と、簡単な装置によって計測
可能であり経済性もすぐれている。
Furthermore, the electric potential method used here has a more stable output than other non-destructive testing techniques, can be measured with a simple device, and is highly economical.

本発明によれば、き裂の寸法及び形状を精度よく検出で
きる。
According to the present invention, the size and shape of a crack can be detected with high accuracy.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、直流ポテンシャルによる計測の系統図、第2
図は、電位差比分布を示す図、第3図は、電位差比分布
におけるき裂表面長さCの位置を示す図、第4図は、き
装面積比と電位差比の関係を示す図である。 A、A’・・・電流入力位電、■、■′・・・■′・・
・電位検出端子。 代理人 弁理士 高橋明夫 メ 1 図 峯 3 図 さ装甲f(か5漠1)唄已鳩うま−と゛の距離 L第 
ダ 図
Figure 1 is a system diagram of measurement using DC potential.
The figure shows the potential difference ratio distribution, Figure 3 shows the position of the crack surface length C in the potential difference ratio distribution, and Figure 4 shows the relationship between the covered area ratio and the potential difference ratio. . A, A'...Current input potential, ■, ■'...■'...
・Potential detection terminal. Agent Patent Attorney Akio Takahashi Me 1 Figure 3 Figure Saarmor f (Ka5ku 1) Utami Hato Uma - Distance L No.
da figure

Claims (1)

【特許請求の範囲】 1、被測定物である金属構造物に直流電流を流し任意間
隔に設けた測定端子間の電位差に基づいてき裂を検出す
る方法において、計測開始時の電位差を基準電位差とし
、その後、所定時間間隔で連続的に計測した電位差を前
記基準電位差で割算することにより電位差比を求め、そ
の値が1より大きい計測端子間をき裂の発生、あるいは
き裂進展場所と決定し、前記電位差比の統計的処理によ
りき裂の表面長さを決定し、き裂を楕円、あるいは、半
楕円形と近似することにより決まるき裂面積比と電位差
比の関係からき裂深さを決定することによってき製形状
を検出するき裂検出方法。 2、特許請求の範囲第1項において、前記電位差比分布
の標準偏差σの2倍の位置をき製表部長さとすることを
特徴とするき裂検出方法。
[Claims] 1. In a method of detecting a crack based on a potential difference between measuring terminals arranged at arbitrary intervals by passing a direct current through a metal structure as an object to be measured, the potential difference at the start of measurement is used as a reference potential difference. Then, the potential difference ratio is obtained by dividing the potential difference continuously measured at a predetermined time interval by the reference potential difference, and the area between the measurement terminals where the value is greater than 1 is determined to be a crack occurrence or crack propagation location. Then, the surface length of the crack is determined by statistical processing of the potential difference ratio, and the crack depth is determined from the relationship between the crack area ratio and the potential difference ratio, which is determined by approximating the crack to an ellipse or semi-ellipse. A crack detection method that detects the forged shape by determining. 2. The crack detection method according to claim 1, characterized in that a position twice the standard deviation σ of the potential difference ratio distribution is set as the surface length.
JP14813881A 1981-09-19 1981-09-19 Detection of crack Pending JPS5850457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14813881A JPS5850457A (en) 1981-09-19 1981-09-19 Detection of crack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14813881A JPS5850457A (en) 1981-09-19 1981-09-19 Detection of crack

Publications (1)

Publication Number Publication Date
JPS5850457A true JPS5850457A (en) 1983-03-24

Family

ID=15446113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14813881A Pending JPS5850457A (en) 1981-09-19 1981-09-19 Detection of crack

Country Status (1)

Country Link
JP (1) JPS5850457A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6189157U (en) * 1984-11-16 1986-06-10
JPS62177440A (en) * 1985-12-19 1987-08-04 ゼネラル・エレクトリツク・カンパニイ Method of measuring growth of crack
JP2011058952A (en) * 2009-09-10 2011-03-24 Toyota Central R&D Labs Inc Cracked area rate calculation method and device
CN105259220A (en) * 2015-10-29 2016-01-20 西安交通大学 Crack conductivity determination method based on four-terminal direct-current potential detection signal

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6189157U (en) * 1984-11-16 1986-06-10
JPS62177440A (en) * 1985-12-19 1987-08-04 ゼネラル・エレクトリツク・カンパニイ Method of measuring growth of crack
JPH0432342B2 (en) * 1985-12-19 1992-05-29
JP2011058952A (en) * 2009-09-10 2011-03-24 Toyota Central R&D Labs Inc Cracked area rate calculation method and device
CN105259220A (en) * 2015-10-29 2016-01-20 西安交通大学 Crack conductivity determination method based on four-terminal direct-current potential detection signal

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