JPS5845972A - Themal printer head and manufacture thereof - Google Patents

Abstract

PURPOSE:To manufacture a titled head which prevents the escape o heat to a base plate by forming a vacant space between the bottom surface of a glazed layer and the base plate. CONSTITUTION:After a thick film fusible layer 7 is formed on a ceramic base plate 1, a glazed layer 2 is formed to cross over the layer 7, a pair of conductive layers 3 are formed at both sides of the layer 2, a thick film resistance layer 4 is formed across the surface of the layer 3, and a thick film protective layer 5 is coated on the surface of the layer 4. Then, this is dipped in dissolving solution to dissolve the layer 7, thereby forming a vacant plate 6. In this manner, the dissipation of the heat to the base plate can be prevented in the state that the mechanical strength can be sufficiently maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION Concerning the originator head and the 1) rapid flow.

This kind sir! At the 11th stage, a glaze layer was applied to the surface of the set plate 0, and a pair of O
It is well known that the conductive layer is coated with a resistive layer that serves as a heating element, spanning both conductive layers. The heat escapes to the outside through the Daleze J11 board. O″e%e%
5vtJ is bound to occur and Hiro escapes to the outside.
There is a necessary cost to survive over L), and there is no hair to supply that much energy & ftk 0, to improve the roundness, - heat body? 1 & Stomach and board and O battle! The heat is directed towards the board (t'7).
K (I'm thinking of doing something like that.

As for its rounded configuration, a table made of an arc-shaped plate made of I74 lead glass is placed face down on the surface of the substrate, and both sides of the plate are attached to the surface of the substrate with low melting point lead glass. a resistive layer along the arcuate surface of the
Forming a conductive layer on 1 and 94
There is 0#. According to this, KtO is used so that a cavity is formed between the inner surface of the stand and the substrate surface, and 0IIIk is removed from the resistive layer.
This is convenient because it escapes to the board.

However, with this configuration, there is an inconvenience that the plate made of high-temperature glass must be processed and formed into an arc shape. Moreover, its size #i^sa A5 ~ 1111B, $
5-i Qw, since the horse and -9 are extremely detailed, the O molding process is made even more precise.

One object of the present invention is to provide a thermal printer head and a 7oH high speed flow formed by biasing a simple space below the 1iIIIk body portion of the wire resistor J11.

This OI! A central strip-shaped dalese layer is provided on the surface of the Mei-a Todoro board,
This %O is characterized by having a resistive layer and an O conductive layer for current-carrying on its surface, as well as providing a thin void between the bottom of the DAV and the substrate and 01141.

An embodiment of the present invention will be described in terms of IIIK: 1. A ceramic umbrella board, 4'& 2 II plates, 2. A central strip of glaze on the surface (approximately 50 sections). , this is from aS crystalline botts or crystallized glass), and a thick film (thick S
Approximately S 11) Th), 4 layers, 5 layers, 5 layers, 5 layers, 4 layers, 5 layers, From the mineral cliff tsuss, etc., it is 1 to Iho-II (approximately 10 pieces thick).

From this O ij I Nishi Marugai, t out of 20 bottom boxes of Dalles layer
% R Island body - A void is formed so that the conductive layer O resistance collapse portion 4AO lower Oi cocoon portion does not overlap with the front and back sides of the substrate 10. ! 2! As shown in the space of 1m1k, the cross-section becomes an elongated O rectangular parallelepiped). Simply make it so that the bottom Ij of the lasing layer 20 does not touch the top surface of the I & plate 10 as shown above.
! Since LIIl is O%O, the part line resistive layer part 44 that does not come in contact with the 10th surface of the hawk me board of M#2 is thicker.
t) The glaze layer 2 is operated only from below, and the thickness of the glaze layer 20 is approximately 10 times greater than the glaze layer 20, so the mechanical strength of the glaze layer 2 is maintained sufficiently.

In order to form a void 6 as shown in FIG. Heating the heat-sensitive material in contact with the irises (effective K141 is used).If the space 6 is formed by heating the heat-sensitive material in contact with the irises, the power supply can also be reduced. It's like K.

t-Mulprinter Head OII by RitKen OIi Akira
This will be explained with reference to Fig. 2 from Figure 04).

As shown in FIG. 2, for example, Ax (X-ray SO alloy) paste is printed on the Tzucera ζ ivy substrate 1011& to form a melted layer 7 having a thickness of about 5 s + a e Ay O @ ic. The i1 dissolved layer 7 is dissolved in oil as described later, and its O
After melting, the large cavity 6 described above is formed. Next, K as shown in Kashi S diagram O cross-cut diagram and Iris 4-wa thousand picture diagram.
The doss layer 2 is formed by printing with a thickness of about 505 m and a thickness of about 505 m. Then, a pair of conductive layers 5 made of a thick film such as kmsime*iim on both sides of the dalese layer 20 and JIB are formed.

After that, the surface of the conductive layer 300 is etched into the resistive layer 4.
30m++aIimOjlliE! 2? Form power! (1
1711° No. 8-Reference. ), and slIIms was coated with a thick film to cover the ζ01h and IIk pile layer 40 surfaces.
It is formed as shown in FIG. 119, No. 10-.

In the above manner, after purifying the Rei layer and the a change, after nine steps, the Futsuba layer 7
dissolve. 10 and the turn of the mining port opening as an auto-O dissolution wave i
ls and sea: 1% is required to dissolve the x-ray layer. Since the dales 04111 is formed on the surface of the dissolving layer 70 by printing, it is required that the coating be coated on the dissolving layer with good layer resistance. So0 meaning is lysis 1117 Ay
The committee formed by the
Since I'm in a good mood, I often have meetings with the subcommittee, and when I get into trouble with OIl, I'm very happy with dHNO3. This solution is convenient because it dissolves the conductive layer 1@02 which is the js resistance layer.

As shown in each plan view, it is necessary that the molten layer 0IiIl1 portion 7 is formed so as to come out from both sides of the Dalese 1m. This is because if the temperature is not exceeded, the dissolved layer will not be dissolved into a round shape that does not interfere with the solution even if the solution is immersed at 11 kK.

It is not necessary to form the melting layer 111w1.5 of the melting layer 7 after fc, but it can be done at any time after forming the glaze layer 2 at least.

By dissolving the dissolving layer 7, a void 6 as shown in FIG. 1 is formed at the position of the dissolving layer 7 on the bottom surface of the glaze layer 2.

Although the above embodiments have a structure in which the conductive layer and the resistive layer are made of thick films, this principle can also be applied even if these are made into thin films. An example of this is shown in Fig. 11, in which a thick film <*-S approximately 50e proverb) is formed on the surface of the substrate 10, and a thin film of approximately α1-S is spread over the surface. A resistor Jm14 with a thickness of m1 is formed on both sides thereof, and a pair of conductive layers 15 with a thickness of about 1 m1 and a conductive layer 15 with a thickness of about 1 m1 are formed on both sides thereof. And protection by these 0 table 1iiK thickness approximately 5-111011-
Test (etoed TmzQ5.5402 etc.) 1st form is used. These 04) Thin 11 [vapor deposition and sputtering process are well known as O and S? It is a fairy tale. In this example as well, 20 units of Dale's 1 if! Forms N4.

12th and onwards O by each Il 11th garden O structure O good O
When the manufacturing method is WR-, a dissolving layer 7 with a thickness of approximately 55w5OAy@ is formed on the Ryu 2D Tsuta board 10 (121st
1)) As shown in Figure 15, a thick glaze layer 2 is formed in front of the dissolving layer 7. Then, apply a conductive layer 13 on each side of the craze m2o*, and then heat both surfaces at 1111115 (see 1611), and iI solution layer 7ti11 [-ejllllllk*Sure Hiroyo.

＆More than 04, in the example, the dissolution layer 7 is used as 110 substitute II, CIIX Hiro, its base metal is for 4Il, and as a dissolution wave in the case of turtle and jin, the cane Fac15 is used as the dissolution wave. Since this 0-shot L11 type has a round hole on the bottom, the mechanical strength is sufficiently maintained, which is different from the existing proposals, and it is possible to prevent O20 from being applied to the board. In addition, the production method for O-Eme also involves forming a dissolved layer in advance, and melting the glaze layer (t)l/II by 4kK, which makes it extremely easy to form voids. It has the effect of being able to.

[Brief explanation of the drawing]

Figure 1 is a kT view showing an embodiment of the invention #40, Figures 2 to 10 are cross sections showing the steps of an embodiment of the invention.
Figure i and plan view, No. 11 wJ41 Cross-sectional views showing embodiments of this invention O and others, Figures 12 to 16 HiroζO@0@
A self-diagram showing the process of the 0-examination example. 1,,,substrate%2,a#@glaze layer,5
．． 13. conductive layer, 4. 14,,,,resistance layer% 6 m@@@
Blank space, 7. Dissolution and collapse Fig. 13 λ Previous Fig. 15

Claims (1)

[Claims] -(1) II of the substrate! In this example, a glazed MO surface made of a Daito strip-shaped O4 film is provided with a resistance layer serving as a heating element and a pair of conductive layers for overcurrent, and a portion where the glaze layer is placed and a pair of conductive layers for overcurrent.
A thin void is provided at the threshold between the plate OII image and the substrate OII! End I
The dissolving layer is covered with a protruding stripe shape so that I is exposed.
IEWI! Next, a glaze layer is formed, and a resistive layer and a conductive layer, which will become a heating element, are further formed to form the glaze layer, and a conductive layer is formed, and the glaze layer is formed, and the dissolving layer is Dissolve it with a dissolving solution and 9 places after 7 O! A method for manufacturing a natural printer head characterized by engraving a resistive layer and a conductive layer by engraving and engraving them.
in law. (Patent M made by applying 4 resistive layers and a conductive layer to a thin film)
Request 011&f1m
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