JPS5830196A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention The present invention is a steel through-hole/solder leveler specification--solder plating is applied to the land portion and inside of the through-hole hole, and the hardening resin is applied to the steel in the tumor area without intervening a solder layer. A novel method for manufacturing coated through-hole printed devices is described.

There is a slight difference behind the conventional through-hole printed wiring board, but there is a postscript on how to form copper through-holes using a steel-clad Ji board!
The method of leaving one part is to use a solder through-hole printed wiring board and a steel through-hole printed wiring board. To briefly explain these, the solder through-hole printed wiring IIs board has a through-hole in a double-sided copper-clad laminate, and then the entire surface is plated with electrolytic steel to make the inner wall of the through-hole conductive. (2) Electrolytic steel plating is applied to the inner wall of the through hole to a thickness of 10 to 5 Qs. The trick to screen printing is to apply a negative pattern using a photosensitive dry film ■ Electrolytic steel plating is applied to the 0 pattern area and inside the through hole to increase the thickness by 15 to 20 μ ■ Solder plating is applied on top of olK1 at a thickness of 8 to 15 μm To form. From then on ■
By removing the resist other than the pattern part (2), etching and removing the steel using a peeling technique (2), and performing Ushida S melting treatment and other steps (3) and (3), a solder-plated solder through-hole print pattern * is completed. In the case of this method, when using the solder without removing it, the solder acts as a protective layer, so it is a good method for preservation. It has the disadvantage that defects are likely to occur, and furthermore, in order to obtain a copper plated part by removing the solder of metal II, problems such as process and solder stripping solution occur.

Next, for the copper through-hole printed wiring board, electrolytic steel plating is applied thickly using the primary metallization process described in (1) above, and then etching-resistant organic ink is filled in the through-hole or applied to the inner wall.
Then, the pattern part is covered with an eraking resist, and the steel other than the pattern part is removed by etching ω', and the resist is removed to complete a copper through-hole printed wiring board. In the case of this method, if the finish is good,
A large amount of steel is removed by etching, the process for preserving the steel on the inner wall of the through hole is complicated, the preservation is poor because the steel in the through hole is oozing out, and furthermore, the wiring between the lands is thin. The present invention has the advantages of solder through-holes and copper through-holes without the above-mentioned disadvantages of the conventional method. Through-hole print arrangement! As a result of intensive study on a rational manufacturing method for the II board, we found that the wiring pattern (m), which includes the layout part pattern (m) excluding at least the land part from the wiring pattern, and the wiring pattern (m), which includes the land part removed by the wiring part pattern (m), was In the pattern joining part with the pattern (A), 0.1 to o
It was discovered that a through-hole printed wiring board having the advantages of both solder through-holes and copper through-holes could be manufactured by using the negative pattern of the land pattern (B) made with sm reeds. In other words, the present invention provides a method for through-hole printed wiring using a copper-clad substrate.
After forming the copper through-holes, a wiring pattern excluding at least the land portion is formed using a hardening layer ink, and a wiring pattern including the land portion removed above is formed with the wiring pattern. 0.1 to 0 at the joint part of
．． 55 ■ Form the pattern of the land pattern (B) with solder-resistant water and solvent peeling ink, and be sure to do so! The through-hole pan is attached by electrolytic copper plating according to the requirements, the solder-plated fireflies and solder-resistant resist are peeled off, and the unnecessary parts are removed by gluing using the solder and hardened ink pattern as a resist. This is a printing method for manufacturing a print layout, which is characterized by:

In the present invention, any method may be used to manufacture the 0 pattern using the wiring part pattern (mu) and the land part pattern 1 as the wiring forming pattern, but the land part pattern is It must be formed so that it overlaps the wiring part pattern (M) by 0°1 to 0.55 m at the joining part of 1h. This is the wiring part pattern (A) made of curable resin and the land part pattern made of solder plating. (B) When used as an etching-resistant resist for steel parts, the wiring part pattern (person) and land part pattern ( Examples of methods for manufacturing B) include the method using an automatic drawing machine, which has become easy to obtain due to recent advances in electronics, and the method using NC tape for through-holes created from wiring patterns. A copper-clad board is obtained by drilling through-holes using a machine, a hole pattern film is created from these holes, and the hole pattern of this hole pattern film is adjusted using a shape enlarging machine such as an eccentric machine without changing the center position of the hole. Two types of enlarged films were created in which only the periphery was enlarged, and the film enlarged to the same land diameter and the wiring pattern film were combined to obtain a wiring pattern (A) film with the land area removed. The wiring part pattern (mu) is created by combining the larger enlarged film and the wiring pattern film.
And how to obtain a film with land part men'turn CB) which has some prizes, and how to use the drill of the NO machine with a land diameter, and a one with a diameter larger than the land diameter by 0.1~0.7vn&. Examples include a method of making a through-hole s#f substrate and obtaining a film for synthesis with the above-mentioned wiring pattern from these. Since the manufacturing method does not require new equipment, it is also preferable to use the method of using the film from the substrate for drilling holes as described above.

By the way, there are cases where the wiring pattern has a terminal part, an arc, or a necessary part other than the land part. In these cases, this part is used as the wiring part pattern (mu). It may be combined, it may be formed as a land pattern (B), or it may be formed as a third pattern, but it is usually treated as a land pattern (B). However, these may be selected appropriately depending on the rationality of the manufacturing process. Next, the manufacturing process using the above pattern, which is a feature of the present invention, will be explained.

First, based on the above-mentioned wiring pattern (mu) on the board on which copper through holes are formed, the wiring pattern is erased with a hardened base ink using a method such as a silk screen method. It is preferable to use a material that functions as a protective coating during post-processing, storage, and even when used as a circuit board. For example, stone ink whose main component is epoxy resin or other thermosetting resin with excellent heat resistance is preferable. preferable.

Next, the above distribution Ml! A negative pattern based on the land pattern (B) described above is formed on the pattern forming board using a resist, and if necessary, electrolytic copper plating is applied to the ends of the through-holes, and then solder plating is applied and the resist is applied. After peeling off, the unnecessary parts of the steel are removed by etching using the solder layer and the curable resin as a resist.

Here, the resist, solder plating, and etching used for the 1-shade pattern may be carried out by conventionally known methods. In the case of wiring #& with subsequent terminals, the terminal plating, hunter fusing processing, symbol printing, outer shadow processing, front inner II&sealing, inspection, etc. may be the same as the conventional method.

The manufacturing method of the present invention as described above has a wiring part pattern (
A) and land pattern CB) are required, and the alignment of patterns such as the printing stand must be made more precise, but the storage stability of the obtained through-hole printed distribution board is improved. , 41111 improvement of through-hole properties,
This reduces the occurrence of disconnections, eliminates copper exposure due to resist misalignment in narrowly spaced patterns, and also makes pattern inspection much easier, making the manufacturing process even more streamlined. , Execution F @ 1 predetermined pattern film (Through Hall Created from AT is an NC machine tool that has entered NC tape, which is a very high practicality. As a drill, one with the same polarity as the land diameter or 0.6 from the land diameter.
A hole was made in a copper-clad phenolic resin laminate using a hole with a large m@ diameter, and Komei obtained a steel-clad phenolic resin laminate.

This Komei baked a steel G1 phenolic resin laminate in close contact with a film to obtain a positive type film (c) with a pattern of land diameter and R4 diameter, and a negative type film (c) with a pattern of land diameter + 0°6 wI. These films and pattern film (al) are synthesized, and
IS pattern film ■ and a land pattern (B) with 0.3 haze overlap with the wiring part were created, and based on this, a silk screen plate was created. 0 Double-sided copper clad with copper through-hole plating completed 1. First, a wiring pattern (m) was formed on both sides of the substrate using a printing plate based on the above wiring pattern (m) Vr using an epoxy resin ink (trade name: S-222, Taiyo Ink ■) by a silk screen method. Next, a shade pattern based on the land pattern (B) was formed on both sides by a silk screen method using plating-resistant ink (trade name: PR-4001, Warner Ink).

Copper plating was applied to the lands and hole walls up to the specified level by electrolytic plating, electrolytic solder plating was applied to 10-15111, then the plating-resistant ink was peeled off, and the solder plating and epoxy 1IRN were used as etching-resistant resists. Etching was performed, unnecessary steel was removed, and heat treatment such as heating was performed using conventional methods to obtain a printed wiring board with copper through holes and solder leveler specifications.

This printed wiring board had a resist applied only to the pattern area, so pattern inspection was very easy, and the through-hole areas were solder plated, so the shelf life was good. Furthermore, even in a component mounting test using a solder depth, no spherical solder adhesion occurred on the pattern side, and no solder fogging occurred at the narrow spacing am between lands.

Patent applicant: Kyoritsu Kogyo Co., Ltd. Representative: Mitsubishi Gas Chemical Co., Ltd.

Claims (1)

[Claims] In accordance with the manufacturing method of a through-hole printed wiring board using a steel-clad board, a copper through-hole is formed on the board, a wiring part pattern (mu) excluding at least the land part is formed with hardened lid ink, and then Then, the wiring pattern including the land part removed by Soki was made with the shadow pattern of the land part pattern (B) which created a 0.1 to 0,55ws pattern at the junction with the Soki mII pattern (mu). Solder resistant water, solvent #11i! The through-hole steel is formed using Ii ink, and if necessary, the through-hole steel is attached by electrolytic steel plating, the solder-resistant resist is peeled off, and the solder and hardened ink pattern are used as a resist for etching. A method for producing a printed wiring board characterized by removing unnecessary steel by