JPS5821833B2 - Craze substrate for thermal head - Google Patents
Craze substrate for thermal headInfo
- Publication number
- JPS5821833B2 JPS5821833B2 JP54038407A JP3840779A JPS5821833B2 JP S5821833 B2 JPS5821833 B2 JP S5821833B2 JP 54038407 A JP54038407 A JP 54038407A JP 3840779 A JP3840779 A JP 3840779A JP S5821833 B2 JPS5821833 B2 JP S5821833B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- substrate
- thermal head
- thermal
- glaze
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 title claims description 26
- 239000011521 glass Substances 0.000 claims description 29
- 230000007704 transition Effects 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 230000035939 shock Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007651 thermal printing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electronic Switches (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Inorganic Insulating Materials (AREA)
Description
【発明の詳細な説明】
本発明は絶縁基体上にグレーズ層が形成されてなるグレ
ーズ基板の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a glazed substrate in which a glazed layer is formed on an insulating substrate.
電気的の絶縁性を有するセラミック板やガラス板などの
絶縁基体が絶縁性の保持と熱放散の調整の目的のため、
その表面にガラスを被覆しグレーズ層の形成された絶縁
基板として用いられることが多い。Insulating substrates such as ceramic plates and glass plates that have electrical insulation properties are used to maintain insulation properties and adjust heat dissipation.
It is often used as an insulating substrate whose surface is coated with glass and has a glaze layer formed thereon.
たとえばこのような絶縁基板上に抵抗発熱体を配置させ
てサーマルヘッドを形成し、ファクシミリ印字の感熱方
式の感熱素子として用いられている。For example, a thermal head is formed by disposing a resistive heating element on such an insulating substrate, and is used as a thermal element for a thermal type of facsimile printing.
データや図形などの情報を記録することは近年その重要
性が増大してきているが、効率のよい記録方式に対する
要望が強く、そのような記録方式として種々の方式があ
るが、感熱記録方式は特に注目をあび、この方式の場合
には前記したグレーズド絶縁基板上に設けられた主とし
て発熱抵抗体から構成されてなるサーマルヘッドを用い
て記録されている。The importance of recording information such as data and graphics has been increasing in recent years, but there is a strong demand for efficient recording methods, and there are various recording methods, but thermal recording methods are particularly popular. This method has attracted a lot of attention, and in the case of this method, recording is performed using a thermal head mainly composed of a heating resistor provided on the above-mentioned glazed insulating substrate.
すなわちたとえばアルミナ基板などの絶縁基板の表面に
グレーズ層を形成したものを用いてなるサーマルヘッド
を使用し、これらを多数の小さい発熱素子として、これ
にパルス状の電力を印加させて発熱させ、その熱エネル
ギをこれら発熱素子の上を通過する感熱記録紙に供給し
発色をさせ、所定の記録をさせる。That is, for example, a thermal head is used that is made of an insulating substrate such as an alumina substrate with a glaze layer formed on the surface, and these are used as many small heating elements, and pulsed power is applied to them to generate heat. Thermal energy is supplied to the thermal recording paper that passes over these heating elements to cause color development and predetermined recording.
このようなサーマルヘッドに要望される特性は長寿命で
信頼性があり、高速で印字品質のすぐれた印字ができ、
かつ消費電力ができる限り小さいこと等である。The characteristics required for such a thermal head are long life, reliability, high-speed printing with excellent print quality, and
In addition, the power consumption must be as low as possible.
しかしながらこのような特性をもったサーマルヘッドを
用いて感熱記録をするときには、電力印加のくりかえし
をうけるために、グレーズ層上に配設された発熱体が発
熱と冷却とを何回も何回もくりかえすことになり、その
ため発熱体直下のグレーズ層もまた熱ショックをうける
ことになる。However, when performing thermal recording using a thermal head with such characteristics, the heating element disposed on the glaze layer generates heat and cools over and over again in order to receive repeated application of power. As a result, the glaze layer directly under the heating element will also be subjected to thermal shock.
そのためブレース層にふくれが生じたり、破損個所が発
生したりなどして、その結果発熱体が破損したりまた寿
命がみじかくなってしまい長期にわたって感熱記録がで
きなくなってしまうという欠点が生ずる。As a result, the brace layer may bulge or breakage occurs, resulting in damage to the heating element, shortening its lifespan, and making long-term thermal recording impossible.
従来は絶縁基体などの表面にグレーズする場合には、グ
レーズのし易さのみが検討されて、いかに基体によく付
着するか美的効果を増して形成することができるかとい
うことからグレーズ層を構成するガラスの組成がきめら
れていた。Conventionally, when glazing the surface of an insulating substrate, etc., only the ease of glazing was considered, and the composition of the glaze layer was determined based on how well it would adhere to the substrate and how it could be formed while increasing the aesthetic effect. The composition of the glass to be used was determined.
したがって前記したような熱ショックをうけるとふくれ
など種々の不具合を発生してしまい、特にサーマルヘッ
ドに用いる絶縁基板としては欠点の多いものであった。Therefore, when subjected to the above-mentioned thermal shock, various problems such as blistering occur, and this has many drawbacks, especially as an insulating substrate used in a thermal head.
本発明はこのような欠点を除去するためになされたもの
であって、グレーズ゛された表面に形成された抵抗発熱
体などの発熱のくりかえしなどによる熱ショックを受け
たときグレーズ層に欠陥が生じないように改良されたグ
レーズ基板を提供するものである。The present invention has been made to eliminate such defects, and the glaze layer becomes defective when subjected to thermal shock due to repeated heat generation from a resistance heating element formed on the glazed surface. The present invention provides an improved glaze substrate that is free from glaze.
すなわち基板上に形成されるグレーズ層を構成するガラ
スの転移点、軟化点、熱膨張係数、熱伝導率や組成など
を特定して、熱ショックに対して良好な特性を有するよ
うに形成されるグレーズ基板を得ることを特徴とする。In other words, the transition point, softening point, thermal expansion coefficient, thermal conductivity, composition, etc. of the glass that makes up the glaze layer formed on the substrate are specified, and the glaze layer is formed to have good characteristics against thermal shock. The method is characterized by obtaining a glazed substrate.
以下本発明の実施例についてサーマルヘッドに用いられ
る絶縁基板を例として説明する。Embodiments of the present invention will be described below using an insulating substrate used in a thermal head as an example.
第1図、第2図に示すようにアルミナ基板1上にガラス
を塗布・焼成してグレーズ層2が形成され、この上ニ所
定のパターンに金属ペーストを塗布し焼付けて抵抗発熱
体3ならびに電極リード4を形成する。As shown in FIGS. 1 and 2, a glaze layer 2 is formed by coating and baking glass on an alumina substrate 1. On top of this, a metal paste is coated in a predetermined pattern and baked to form a resistive heating element 3 and electrodes. Lead 4 is formed.
この発熱体全部をおおうように耐摩耗層5を形成してサ
ーマルヘッドを得る。A wear-resistant layer 5 is formed to cover the entire heating element to obtain a thermal head.
サーマルヘッドでは発熱素子に電流を流して発熱させる
ので、本質的には消費電力が大きくなる。Since a thermal head generates heat by passing a current through the heating element, power consumption is essentially high.
しかし素子に注入されるエネルギのうち素子の温度上昇
に利用される分が多いほど効率のよい熱印字ができるの
でそのように構成されていて、温度差の大きい昇温と冷
却とがくりかえされ、グレーズ層が熱ショックをうける
ことになる。However, the more energy that is injected into the element that is used to raise the temperature of the element, the more efficient thermal printing can be achieved, so the printer is configured that way, and heating and cooling with a large temperature difference are repeated. The glaze layer will undergo a thermal shock.
このような熱ショックをうけたときグレーズ層を構成す
るガラスの転移点や軟化点が問題となる。When subjected to such a thermal shock, the transition point or softening point of the glass constituting the glaze layer becomes a problem.
すなわちガラスの転移温度が発熱体の発熱時の最高温度
以上であれば不具合の発生は防止できる。That is, if the transition temperature of the glass is higher than the maximum temperature of the heating element when it generates heat, the occurrence of defects can be prevented.
この温度は550℃以上である。This temperature is 550°C or higher.
550°C未満のときはクラックまたは変形が発生する
。Cracks or deformation occur when the temperature is less than 550°C.
ガラスの転移点として好ましくは600℃であり、最も
好ましくは650℃である。The transition point of the glass is preferably 600°C, most preferably 650°C.
またグレーズ層に不具合が発生せず、抵抗発熱体に影響
をあたえないためには、グレ〒ズ層を構成するガラスの
軟化点が700℃以上であればよい。Further, in order to prevent any defects from occurring in the glaze layer and not to affect the resistance heating element, the glass constituting the glaze layer may have a softening point of 700° C. or higher.
好ましくは800℃であり、最も好ましくは820℃で
ある。Preferably it is 800°C, most preferably 820°C.
さらにグレーズ層を構成するガラスの熱膨張係数や熱伝
導率についてはそれぞれ45〜70X10−7/C,1
,8〜2.8X10”ca l 7cm、 s 0℃で
あればよい。Furthermore, the thermal expansion coefficient and thermal conductivity of the glass constituting the glaze layer are 45 to 70X10-7/C and 1, respectively.
, 8~2.8X10'' cal 7cm, s 0°C.
熱膨張係数が前記の範囲外のときはガラスにクラックが
はいる。If the coefficient of thermal expansion is outside the above range, cracks will appear in the glass.
また熱伝導率が前記の範囲外のとき、1.8×10−3
cal/crrL、 s 、℃より小さい場合は、発熱
体に一定のパルス電流を加えたときに熱伝導率が小さい
ために発熱抵抗素子の温度上昇がはやく高くなるが、パ
ルス電流が切れても次の印加まで冷却しにくく、印字さ
れることがあり、また2、8×10−” cal 7c
m、 s 、’Cより大きい場合は、小さい場合と反対
に温度上昇がゆるやかで、最高温度が低くなり、印字濃
度が小さくなり、パワーを多く必要とする。In addition, when the thermal conductivity is outside the above range, 1.8×10-3
If it is smaller than cal/crrL, s, °C, when a constant pulse current is applied to the heating element, the temperature of the heating resistor element will rise rapidly due to the small thermal conductivity, but even if the pulse current is cut off, the temperature will rise rapidly. It is difficult to cool down until the application of 2.8 × 10-” cal 7c
When m, s, and 'C are larger, contrary to the case where they are smaller, the temperature rises slowly, the maximum temperature becomes low, the print density becomes low, and more power is required.
またこれらのガラスの組成の代表例を次の表(後記)に
一覧表として示す。Further, representative examples of the compositions of these glasses are listed in the following table (described later).
一方発熱体が配置されるグレーズ層の形成された基板と
してはセラミック板がよく、セラミック板の内では特に
アルミナにて形成されたものを用いたときにすぐれた効
果を示すものであり、アルミナは好ましくは90〜99
.5%アルミナよりなるものがよい。On the other hand, a ceramic plate is suitable as a substrate on which a glaze layer is formed on which a heating element is arranged, and among ceramic plates, those made of alumina exhibit particularly excellent effects. Preferably 90-99
.. A material made of 5% alumina is preferable.
表
クレーズ用ガラス
試料番号 12345
組成(イ)
S 102 50.0 6.5 54.3 46.
0 30.0Ba0 24.4 10 −
20.0 −試料番号 12345
組成(イ)
Ca0 10.3−7.1 8.0 −A
A2036.9 2.0 8.9 6.4 4.
138O5,4−9,66,39,9
3
ゞ°・0 °゛230°35)1.2−0°04に20
0,18 0.11 − 1.24P
bO−12,411,054,3
Mg0 6.5 −− −
Zn0 1・6
−試料番号 12345
特 性5
転移点 668 700 586 627 445軟化
点 840 880 700 780 595熱膨張
係数64.858.063.064.060.0(XI
O()
熱伝導率
(x1o’) 2.4 2.2 2.2 2.2 1
.9転移点と軟化点の単位は℃、熱膨張係数の単位は7
°C1熱伝導率の単位はcal 7cm、 s 、℃で
ある。Glass sample number for table craze 12345 Composition (a) S 102 50.0 6.5 54.3 46.
0 30.0Ba0 24.4 10 -
20.0 - Sample number 12345 Composition (a) Ca0 10.3-7.1 8.0 -A
A2036.9 2.0 8.9 6.4 4.
138O5,4-9,66,39,9 3 ゞ°・0 °゛230°35) 1.2-0°04 to 20
0.18 0.11 - 1.24P
bO-12,411,054,3 Mg0 6.5 ---
Zn0 1・6
-Sample number 12345 Properties 5 Transition point 668 700 586 627 445 Softening point 840 880 700 780 595 Coefficient of thermal expansion 64.858.063.064.060.0 (XI
O() Thermal conductivity (x1o') 2.4 2.2 2.2 2.2 1
.. 9 The units of transition point and softening point are °C, and the unit of thermal expansion coefficient is 7.
The unit of °C1 thermal conductivity is cal 7cm, s, °C.
1〜4は本発明のものにして、5は従来例でである。1 to 4 are those of the present invention, and 5 is a conventional example.
この表から分るように本発明のものはサーマルヘッド用
としてきわめてすぐれたものである。As can be seen from this table, the product of the present invention is extremely suitable for use in thermal heads.
なお本発明に使用するガラスは次の系のものが特に好適
する。The following types of glasses are particularly suitable for use in the present invention.
(1) S 102 、A1203BaO系(2)
ZnO−B2O3−8in2系(3) P bo
S i02 B203系(4) S iO□−
BaO−CaO系(5) S r ()2B a O
P b O系(6) PbO−ZnO−B2O3系
(7) 5I02−BaO−CaO−A403−B2
03系(8) 5in2−B203−PbO−Al、
;03−CaO−MgO系
(9)8102 BaOPbOCaOA403−B2
O3系(1) S 102 , A1203BaO system (2)
ZnO-B2O3-8in2 system (3) P bo
S i02 B203 series (4) S iO□-
BaO-CaO system (5) S r ()2B a O
PbO system (6) PbO-ZnO-B2O3 system (7) 5I02-BaO-CaO-A403-B2
03 series (8) 5in2-B203-PbO-Al,
;03-CaO-MgO system (9) 8102 BaOPbOCaOA403-B2
O3 system
第1図はサーマルヘッドの概略の形状の一部を示す平面
図、第2図は第1図をA−Aに沿って切断した断面図で
ある。
1・・・・・・アルミナ基板、2・・・・・・グレーズ
層、3・・・・・・抵抗発熱体、4・・・・・・電極リ
ード、5・・・・・・耐摩耗層。FIG. 1 is a plan view showing a part of the general shape of the thermal head, and FIG. 2 is a cross-sectional view of FIG. 1 taken along the line A-A. DESCRIPTION OF SYMBOLS 1... Alumina substrate, 2... Glaze layer, 3... Resistance heating element, 4... Electrode lead, 5... Wear resistance layer.
Claims (1)
上に、転移点550℃以上で軟化点が700℃以上であ
ってかつ熱膨張係数が45〜70×10 ”−7/Cの
範囲にあり熱伝導率は1.8〜2.8×10−” ca
l /crn、 s 、 cであるガラスを被覆してグ
レーズ層を形成して成るサーマルヘッド用グレーズ基板
。 2 グレーズ層を構成するガラスの転移点が600℃で
ある特許請求の範囲第1項記載のサーマルヘッド用グレ
ーズ基板。 3 グレーズ層を構成するガラスの転移点が650℃で
ある特許請求の範囲第1項記載のサーマルヘッド用グレ
ーズ基板。 4 グレーズ層を構成するガラスの軟化点が800℃で
ある特許請求の範囲第1項記載のサーマルヘッド用グレ
ーズ基板。 5 グレーズ層を構成するガラスの軟化点が820℃で
ある特許請求の範囲第1項記載のサーマルヘッド用グレ
ーズ基板。 6 グレーズ層を構成するガラスが5iO2−BaO−
CaO−A1203−B203系ガラス、S t 02
−AJ!!20a BaO系ガラス、SiO□−B2
03−PbO−A1203−CaO−MgO系ガラス、
5iO2−BaO−PbO−CaO−A1203−B2
03 系ガラス、ZnOB2O38102系ガラス、S
t 02−BaO−CaO系ガラス、PbO−8iO
2−B203系ガラス、P b OZ n OB 20
s系ガラス、SiO□−BaO−PbO系ガラスであ
る特許請求の範囲第1項記載のサーマルヘッド用グレー
ズ基板。[Claims] 1. On a ceramic substrate containing 90 to 99.5% alumina, the material has a transition point of 550°C or higher, a softening point of 700°C or higher, and a thermal expansion coefficient of 45 to 70×10”-7. /C and the thermal conductivity is 1.8 to 2.8×10-”ca
A glaze substrate for a thermal head, which is formed by coating glass with l/crn, s, and c to form a glaze layer. 2. The glaze substrate for a thermal head according to claim 1, wherein the glass constituting the glaze layer has a transition point of 600°C. 3. The glaze substrate for a thermal head according to claim 1, wherein the glass constituting the glaze layer has a transition point of 650°C. 4. The glaze substrate for a thermal head according to claim 1, wherein the glass constituting the glaze layer has a softening point of 800°C. 5. The glaze substrate for a thermal head according to claim 1, wherein the glass constituting the glaze layer has a softening point of 820°C. 6 The glass constituting the glaze layer is 5iO2-BaO-
CaO-A1203-B203 glass, S t 02
-AJ! ! 20a BaO glass, SiO□-B2
03-PbO-A1203-CaO-MgO glass,
5iO2-BaO-PbO-CaO-A1203-B2
03 series glass, ZnOB2O38102 series glass, S
t 02-BaO-CaO glass, PbO-8iO
2-B203 series glass, P b OZ n OB 20
The glaze substrate for a thermal head according to claim 1, which is s-based glass or SiO□-BaO-PbO-based glass.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54038407A JPS5821833B2 (en) | 1979-04-02 | 1979-04-02 | Craze substrate for thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54038407A JPS5821833B2 (en) | 1979-04-02 | 1979-04-02 | Craze substrate for thermal head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55132094A JPS55132094A (en) | 1980-10-14 |
JPS5821833B2 true JPS5821833B2 (en) | 1983-05-04 |
Family
ID=12524437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54038407A Expired JPS5821833B2 (en) | 1979-04-02 | 1979-04-02 | Craze substrate for thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5821833B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2018190057A1 (en) * | 2017-04-14 | 2020-02-27 | パナソニックIpマネジメント株式会社 | Chip resistor |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59125846U (en) * | 1983-02-14 | 1984-08-24 | スタンレー電気株式会社 | Thick film hybrid integrated circuit |
JPS59156979A (en) * | 1983-02-24 | 1984-09-06 | 日本特殊陶業株式会社 | Partially glazed substrate |
JPS61114861A (en) * | 1984-11-12 | 1986-06-02 | Hitachi Ltd | Thermosensitive head |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4939359A (en) * | 1972-08-12 | 1974-04-12 |
-
1979
- 1979-04-02 JP JP54038407A patent/JPS5821833B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4939359A (en) * | 1972-08-12 | 1974-04-12 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2018190057A1 (en) * | 2017-04-14 | 2020-02-27 | パナソニックIpマネジメント株式会社 | Chip resistor |
Also Published As
Publication number | Publication date |
---|---|
JPS55132094A (en) | 1980-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3978315A (en) | Electrical heating units | |
JPS5821833B2 (en) | Craze substrate for thermal head | |
JPH0696847A (en) | Surface heating unit and manufacture thereof | |
JP2008303077A (en) | Insulating protective coating material | |
CN101563657B (en) | Fixing heater and method for manufacturing the same | |
JPH01188443A (en) | Glaze composition for ceramic substrate | |
JPS6034802B2 (en) | Thermal head for thermal recording device | |
JPS62227657A (en) | Thermal head | |
JP2837963B2 (en) | Thermal head | |
JPS58203070A (en) | Thermal head | |
JP3042180B2 (en) | Thick film resistor and method of manufacturing the same | |
JP2001260402A (en) | Glazed insulating substrate, combined insulating substrate, manufacturing method therefor, chip type fuse and fuse resistor | |
JPS6159557B2 (en) | ||
KR20210153814A (en) | Thermal printer head module and method for manufacturing the same | |
JPS62278058A (en) | Thermal head | |
JPS6034803B2 (en) | Thermal head for thermal recording device | |
JPS62116162A (en) | Thermal head | |
JPH06144964A (en) | Line type glazed substrate and production thereof | |
JPH0585867A (en) | Glaze substrate and its production | |
CN117518759A (en) | Technological method for improving fixing effect of ceramic heating strip | |
JP2731453B2 (en) | Thermal head substrate and method of manufacturing the same | |
JPH11283810A (en) | Chip type thermistor and its manufacture | |
JPS6296344A (en) | Glaze composition for ceramic substrate | |
JPH06157169A (en) | Partially glazed substrate for electronic parts | |
JP2594800B2 (en) | Substrate for thermal head |