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JPS58172819A - Electrically insulating member - Google Patents

Electrically insulating member

Info

Publication number
JPS58172819A
JPS58172819A JP5587882A JP5587882A JPS58172819A JP S58172819 A JPS58172819 A JP S58172819A JP 5587882 A JP5587882 A JP 5587882A JP 5587882 A JP5587882 A JP 5587882A JP S58172819 A JPS58172819 A JP S58172819A
Authority
JP
Japan
Prior art keywords
epoxy resin
insert
molecule
epoxy
electrically insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5587882A
Other languages
Japanese (ja)
Other versions
JPS6144370B2 (en
Inventor
新 北村
勝 中西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP5587882A priority Critical patent/JPS58172819A/en
Publication of JPS58172819A publication Critical patent/JPS58172819A/en
Publication of JPS6144370B2 publication Critical patent/JPS6144370B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)
  • Organic Insulating Materials (AREA)
  • Insulators (AREA)
  • Insulating Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は碍子、ブンシングの如き金鵬インサートを、モ
ールド樹脂中に埋め込んでなる一気絶縁用部材に関する
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an insulating member in which a metal insert such as an insulator or bunsing is embedded in a molded resin.

近時エポキシ掴脂注型品中に金属インサートを埋込んで
なる亀気絶縁用S桐が広く用いられている。
Recently, S-taulownia for heat insulation has been widely used, which is made by embedding a metal insert in an epoxy oil-grip cast product.

しかしながら、これら部材は温#L質化のおる場所に置
かれるとエポキシ樹脂注型品と金−、インサートの境界
で界面応力が発生し剥離し易い欠点を有している。
However, these members have the disadvantage that when they are placed in a place where there is a high temperature, interfacial stress is generated at the boundary between the epoxy resin cast product, the gold insert, and the insert, causing them to easily peel off.

これは注型品とインサートの線膨張係数の相違にもとづ
く庵のと考えられる。
This is thought to be due to the difference in linear expansion coefficient between the cast product and the insert.

このためインサート表面にローレット加工を施す等種々
の提案が為されているが未だ満足するものとは言い難い
For this reason, various proposals have been made, such as knurling the insert surface, but these are still far from satisfactory.

本発明はこのような欠点を改良してなるもので、1分子
中に1ヶ以上のヒドロキシル基を有するビスフェノール
截エポキシ樹)1&50〜90電IIl:、部、1分子
中に1〜6ケのメチロール基を有するレゾーキ7樹脂に
てモールドしてなる電気絶縁用部材に閑する。
The present invention has been made to improve such drawbacks, and is made of bisphenol-cut epoxy resin having one or more hydroxyl groups in one molecule. It is applied to an electrically insulating member molded with Rezoki 7 resin having a methylol group.

ブライマーmMト通常金風インサート向に塗布して後、
硬化させて皮膜としてからエポキシ樹脂にてモールドさ
れる。
After applying Brimer MM to the usual Kinpu insert,
After curing to form a film, it is molded with epoxy resin.

このときの皮嗅厚さは、電気絶縁部材の大きさに4よる
が、通常0.05〜0.30mである。
The thickness of the skin at this time depends on the size of the electrical insulation member, but is usually 0.05 to 0.30 m.

本発明において用いるブライマー塗料の構成成分配合比
を上記の如く限定した理由は、上記数値範囲をはずれる
と、得られる電気絶縁用部材のインサートとモールド樹
脂の界面応力の緩和効果がなくなるからである。
The reason why the blending ratio of the constituent components of the brimer paint used in the present invention is limited as described above is that if it deviates from the above numerical range, the effect of alleviating the interfacial stress between the insert of the resulting electrically insulating member and the mold resin will be lost.

本発明に使用するビスフェノール臘エポキシ樹脂ハ、例
、tri’2.2’−ビス(4−ヒドロキシフェニル)
プロパンとエヒクロルヒトリン(!: k NaoHの
存在下に縮合させて得られるものであって、可撓性、密
着性を良好ならしめるため1分子中にヒドロキシル基を
1個以上有するものを用いる。これらのビスフェノール
型エポキシ樹脂としては、シェル石油社から市販されて
いる商品名エピコート1001、エピコート1004、
エビコー) 1007、エピコー)1009、チバ社か
ら市販されている商品名アラルダイト6071、アラル
ダイト6084、アラルダイト6097.アラルダイト
6099などが用いられる。        ′□ またビスフェノール型エポキシ樹脂の分子量は。
Bisphenol epoxy resin used in the present invention, e.g., tri'2,2'-bis(4-hydroxyphenyl)
It is obtained by condensation of propane and echylchlorhythrin (!: k) in the presence of NaoH, and has one or more hydroxyl groups in one molecule to improve flexibility and adhesion. These bisphenol type epoxy resins are commercially available from Shell Oil Company under the trade name Epicote 1001, Epicote 1004,
Epicor) 1007, Epicor) 1009, commercially available from Ciba under the trade name Araldite 6071, Araldite 6084, Araldite 6097. Araldite 6099 or the like is used. '□ Also, what is the molecular weight of bisphenol type epoxy resin?

通常1,000〜3,800であシ、エポキシ当量は通
常500〜3,500である。
The epoxy equivalent is usually 1,000 to 3,800, and the epoxy equivalent is usually 500 to 3,500.

また分子中に含まれるヒドロキシル基の数は、通常12
個以下とされる。
Also, the number of hydroxyl groups contained in the molecule is usually 12
It is considered to be less than 1.

不発明に使用するレゾール型キシレンフェノール樹脂と
はキシレン、フェノールおよびホルムアルデヒドより得
られる共縮合物で分子の末端あるいは中間にメチロール
基を有する1M脂であり、一般ニキシレンとフェノール
のモル比;AE 2/8〜8/2の範囲で平均分子量3
00〜800 を有して2す、1分子中にメチロール基
を好ましくは1〜6個有する樹脂、特に好ましくは幾分
キシレンのモル比が大で平均分子量400〜600 の
ものが有効である。
The resol type xylene phenol resin used in the invention is a co-condensate obtained from xylene, phenol and formaldehyde, and is a 1M resin having a methylol group at the end or middle of the molecule, and the molar ratio of general nixylene to phenol: AE 2/ Average molecular weight 3 in the range of 8 to 8/2
Resins having an average molecular weight of 00 to 800 and preferably 1 to 6 methylol groups in one molecule, particularly preferably those having a somewhat large molar ratio of xylene and an average molecular weight of 400 to 600, are effective.

モールド用*Jli’としてのエポキシw脂としては、
汎用のエポキシm*注型組成智が好適にり用される0 本発明に用いる金属インサートは、その表面をp−レフ
ト加工、サンドブラスト処理等を行なって表向凹凸処理
を行なっておいてもよい。
As epoxy w fat for mold *Jli',
A general-purpose epoxy m*casting composition is preferably used. The metal insert used in the present invention may have its surface roughened by p-left processing, sandblasting, etc. .

サンドブラスト処理するときには、一般的に表面粗さ3
08〜708 4度となるように行なう。
When sandblasting, the surface roughness is generally 3.
08-708 Do this so that the angle is 4 degrees.

以下本発明を実施例により具体的に説明する。The present invention will be specifically explained below using examples.

実施例中の部は重量部である。Parts in the examples are parts by weight.

実施例1 第1図に示す金属インサート(1)のモールド樹脂埋込
表面に、ビスフェノール製エポキシ樹脂(シェル社#!
、エピコー) 11007)144、レゾール型キシレ
ンフェノール樹脂50,9.  セa 7 ルア’アセ
テ−)80,9.  キシレン100,9およびブタノ
ール25gよりなるブライマー塗料を塗布し、140℃
、30 分間の粂件で加熱硬化させて、厚み0.08m
の皮膜(2)を形成させた。上記レゾール型キシレンフ
ェノール樹脂としては、平均分子量500%−分子中の
メチロール基の数が平均4ケのものを用いたO なおインサート&向はサンドブラスト処理を行なって表
面粗さ50s としたものを用いた。
Example 1 A bisphenol epoxy resin (Shell #!) was applied to the molded resin embedded surface of the metal insert (1) shown in FIG.
, Epicor) 11007) 144, resol type xylene phenol resin 50,9. Seaa 7 Lua'acete-)80,9. Apply a brimer paint consisting of 100.9 xylene and 25 g of butanol and heat at 140°C.
, heat cured for 30 minutes to a thickness of 0.08m.
A film (2) was formed. The above-mentioned resol type xylene phenol resin used had an average molecular weight of 500% and an average number of methylol groups in the molecule of 4.The insert and direction were sandblasted to a surface roughness of 50s. there was.

図中(3)はインサートネジである。(3) in the figure is an insert screw.

次いでこのものを2ヶ用いエポキシ樹脂性徴用組成物に
てモールド(140’C,24時間硬化)を行ない第1
図に示す如き碍子を得た。
Next, two of these materials were molded (cured at 140'C, 24 hours) using an epoxy resin composition.
An insulator as shown in the figure was obtained.

図中(4)はエポキシ樹脂硬化物である。In the figure, (4) is a cured epoxy resin.

彦おエポキシ樹脂性態用組成物としては下記配合のもの
を用い九。
The Hikoo epoxy resin composition having the following formulation was used.9.

充填剤(アルミナ)        250部得られた
碍子を用い、アムスラー万能試験機により引張り破壊強
度を測定したところ4,430ゆであった。
Using the obtained insulator with 250 parts of filler (alumina), the tensile breaking strength was measured using an Amsler universal testing machine and found to be 4,430 yen.

一方、ブライマー塗料としてビスフェノール型エポキシ
樹脂とアミン系硬化剤よりなるエポキシw脂塗料を用い
るほかは、すべて本実施例と同様の要憤により得られた
碍子の引張り破壊強度は3691kliJであった。
On the other hand, the tensile strength at break of an insulator obtained in the same manner as in this example was 3691 kliJ, except that an epoxy resin paint consisting of a bisphenol type epoxy resin and an amine hardener was used as the brimer paint.

実施例2 第2図に示すインサート(1)のモールド樹脂埋込表面
に、ビスフェノール型エポキシmM’flc7エル社製
、エピコート1004)160II、レゾール型キシレ
ンフェノール樹月旨160,9.セロソルブアセテート
1009、キシレン120gおよびブタノール60gよ
りなるブライマー塗料を塗布して140℃30分間の乗
件で加熱硬化させて、厚み0.30mの皮膜(2)全形
成させた。レゾール型キシレンフェノール樹脂としては
、平均分子1soo、−分子中のメチロール基の数が平
均2ケのものを用いた。
Example 2 Bisphenol type epoxy mM'flc7 L Co., Ltd., Epicoat 1004) 160II, resol type xylene phenol Jugetsuji 160,9. A brimer paint consisting of Cellosolve Acetate 1009, 120 g of xylene, and 60 g of butanol was applied and cured by heating at 140° C. for 30 minutes to completely form a film (2) with a thickness of 0.30 m. The resol type xylene phenol resin used had an average molecule of 1 soo and an average number of methylol groups in the molecule of 2.

なおインサート表面へのサンドブラスト処理は実施例1
記載と同様の要領により行なった。
The sandblasting treatment on the insert surface was performed in Example 1.
It was carried out in the same manner as described.

次いでこのもの2ケを用い、エポキシ倒脂注温用組成物
にてモールド(140℃、24時間硬化)を行ない第2
図に示す如自碍子を得た。
Next, two of these were molded (cured at 140°C for 24 hours) with an epoxy lubricating composition to form a second mold.
The insulator shown in the figure was obtained.

図中(31)(31’)はインサートネジ、(4)はエ
ポキシ樹脂硬化−である。
In the figure, (31) and (31') are insert screws, and (4) is an epoxy resin cured.

なおエポキシm脂汗型用組成物としては、実施例1で用
いたと同様のもの1−使用した。
As the epoxy m-sweat type composition, the same composition 1 as used in Example 1 was used.

得られ九碍子を水平に置いて&42図のインサートのm
−のネジ部(31)をささえ、点(P)よシ圧力をかけ
て曲は破Jk強震を画定したところ、  1270に9
であった。
Place the obtained nine insulators horizontally & m of the insert shown in Figure 42.
- When I supported the screw part (31) and applied pressure from point (P), I defined a strong earthquake of Jk at 1270.9
Met.

一方フライマー塗料として、ビスフェノールA型エポキ
シ樹脂と酸無水物系硬化剤よりなるエポキシ樹脂塗料を
用いるかは、すべて本実施例と同様の要領により得られ
た碍子の曲げ破壊強度は805ゆであった。
On the other hand, whether or not an epoxy resin paint made of a bisphenol A type epoxy resin and an acid anhydride curing agent was used as the flamer paint, the bending fracture strength of the insulators obtained in the same manner as in this example was 805 yen.

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図は本発明の電気絶縁用部側の実例を
示す縦断面図である。 1・・・・ 金属インサート 2・・・・・・ プライマー塗料の皮膜3・・・・・ 
インサートネジ 4・・・・・ エポキシ樹脂硬化物 特許出願人 日東電気工業株式会社 代表者土方三部
FIGS. 1 and 2 are longitudinal sectional views showing an example of the electrically insulating part of the present invention. 1... Metal insert 2... Primer paint film 3...
Insert screw 4... Epoxy resin cured product patent applicant Nitto Electric Industry Co., Ltd. Representative Hijikata Sanbe

Claims (1)

【特許請求の範囲】[Claims] 1分子中に1り以上のヒドロキシル基を有するビスフェ
ノール型エポキシ樹脂50〜90重童部、1分子中に1
〜6ケのメチロール基を有するレゾール型キシレンフェ
ノ・−ル[110〜50XItPAt含むブライマー塗
料を金属インサート面に蓋布し、次いでエポキシ樹脂に
てモールドしてなる一気絶縁用部材。
Bisphenol type epoxy resin having one or more hydroxyl groups in one molecule 50 to 90 parts, 1 part in one molecule
A resol-type xylene phenol having ~6 methylol groups [110 to 50 XItPAt-containing brimer paint is applied to the surface of a metal insert, and then molded with epoxy resin.
JP5587882A 1982-04-02 1982-04-02 Electrically insulating member Granted JPS58172819A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5587882A JPS58172819A (en) 1982-04-02 1982-04-02 Electrically insulating member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5587882A JPS58172819A (en) 1982-04-02 1982-04-02 Electrically insulating member

Publications (2)

Publication Number Publication Date
JPS58172819A true JPS58172819A (en) 1983-10-11
JPS6144370B2 JPS6144370B2 (en) 1986-10-02

Family

ID=13011350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5587882A Granted JPS58172819A (en) 1982-04-02 1982-04-02 Electrically insulating member

Country Status (1)

Country Link
JP (1) JPS58172819A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040097110A (en) * 2004-10-30 2004-11-17 주식회사 제일화성 An epoxy-insulator for indoor
WO2005007756A1 (en) * 2003-05-21 2005-01-27 Hitachi Chemical Co., Ltd. Primer, conductor foil with resin, laminate and process for producing the laminate
JP2007280712A (en) * 2006-04-05 2007-10-25 En Liang Enterprise Co Ltd Supporting insulator
JP6960705B1 (en) * 2019-12-10 2021-11-05 ユニチカ株式会社 Electrically insulating epoxy resin cured product and electrically insulating material using it

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005007756A1 (en) * 2003-05-21 2005-01-27 Hitachi Chemical Co., Ltd. Primer, conductor foil with resin, laminate and process for producing the laminate
US7648770B2 (en) 2003-05-21 2010-01-19 Hitachi Chemical Company, Ltd. Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet
US8507100B2 (en) 2003-05-21 2013-08-13 Hitachi Chemical Company, Ltd. Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet
KR20040097110A (en) * 2004-10-30 2004-11-17 주식회사 제일화성 An epoxy-insulator for indoor
JP2007280712A (en) * 2006-04-05 2007-10-25 En Liang Enterprise Co Ltd Supporting insulator
JP6960705B1 (en) * 2019-12-10 2021-11-05 ユニチカ株式会社 Electrically insulating epoxy resin cured product and electrically insulating material using it
KR20220114525A (en) * 2019-12-10 2022-08-17 유니티카 가부시끼가이샤 An imide group-containing compound, an imide group-containing curing agent, and a cured epoxy resin product and an electrically insulating material using the same

Also Published As

Publication number Publication date
JPS6144370B2 (en) 1986-10-02

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