JPS58178575A - Photosemiconductor display device - Google Patents
Photosemiconductor display deviceInfo
- Publication number
- JPS58178575A JPS58178575A JP57061958A JP6195882A JPS58178575A JP S58178575 A JPS58178575 A JP S58178575A JP 57061958 A JP57061958 A JP 57061958A JP 6195882 A JP6195882 A JP 6195882A JP S58178575 A JPS58178575 A JP S58178575A
- Authority
- JP
- Japan
- Prior art keywords
- light
- display device
- display
- light emitting
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000010304 firing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000003491 array Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、発光ダイオード（Ｉ、Ｅｌ） ） ｔ−使
用した表示装置に係り、特に複数列のパーグラフ表示を
行なう場合に有効な光半導体表示装置に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a display device using light emitting diodes (I, El), and particularly an optical semiconductor display device that is effective when performing a multi-column pergraph display. Regarding.
従来、ＬＥＤを発光素子として使用した光半導体表示装
置は、縞１図に示すように構成されている。すなわち、
ＬＥＤチツｆｌ ７１．７１ｍ 、・・φｌｒ定Ｏ定置
位置設され九基板１２上に％ＬＥＤチップ１１．．１１
．．・・・に対応した透孔が設けられ反射板として働く
白色樹脂製の反射部材ＩＪが熱カシメによって固着され
、この反射部材１３と反射部材ｌＪの透孔部に対応した
位置にレンチキユラーレンズが形成された導光板１４（
例えばアクリル板）とが熱カシメによって固着されてい
る。Conventionally, an optical semiconductor display device using an LED as a light emitting element is configured as shown in FIG. That is,
LED chip fl 71.71m, . ．． 11
．． ．． A reflective member IJ made of white resin is provided with a corresponding through hole and serves as a reflective plate, and is fixed by thermal caulking, and a lenticular lens is placed at a position corresponding to the through hole of the reflective member 13 and reflective member IJ. The light guide plate 14 (
For example, an acrylic plate) is fixed by heat caulking.
しかし、上記のような構成では、反射部材１３上に導光
板１４を熱カシメによって固着するため、導光板１４の
板厚が薄いとレンズ部にそり中ねじれが発生する。ｔた
、表示装置を薄くした場合、反射板を用いているためＬ
ＥＤの点灯時にハレーションが多（なるとともに、第２
図に示すように、ＬＥＤの光が導光板１４を介して隣豪
するＬＥＤの表示部にもれて、表示が見に（くなる等多
くの欠点を有している。However, in the above configuration, since the light guide plate 14 is fixed onto the reflective member 13 by thermal caulking, if the light guide plate 14 is thin, the lens portion will be twisted during warping. In addition, when the display device is made thinner, the L
There is a lot of halation when the ED is turned on (and the second
As shown in the figure, the light from the LED leaks through the light guide plate 14 to the display section of the adjacent LED, resulting in many drawbacks such as the display becoming difficult to see.
また、反射板を便用ぜず、基板上に直接レン、ｅ（１−
着したものもあるが、このような表示装置においては、
他の装置に組み込んで表示用に用いる場合、例えば組み
込まれ九装置の内部照明等の周辺からの入射光によって
−・レーションを生じ易く、表示が見にくくなる欠点が
ある。Also, without using a reflector, it is possible to directly apply a lens, e(1-
However, in such display devices,
When it is incorporated into another device and used for display purposes, it has the disadvantage that, for example, incident light from the surroundings, such as the internal illumination of the device in which it is incorporated, tends to cause irradiation, making the display difficult to see.
この発明は上記のような事情に麺みてなされたもので、
その目的とするところは、複数の発光素子列が設けられ
た表示装置において、隣接する発光素子列への光のもれ
′ｋｓ断でき、表示の見やすい光半導体表示装置を提供
することである。This invention was made in light of the above circumstances,
The object is to provide an optical semiconductor display device in which a plurality of light emitting element rows are provided, in which leakage of light to adjacent light emitting element rows can be cut off and the display is easy to see.
すなわち、この発明においては、基板上に発光素子列を
配設するとともに、この基板上に上記発光素子列に対応
した透孔を設けた遮光板を固着し、上記遮光板に設は九
透孔に対応した形状の導光部材を嵌め込んで固着して発
光素子の光を導ひき、Ｗ４接する発光素子列間の光を運
へいするように構成し友ものである。That is, in this invention, light emitting element arrays are arranged on a substrate, and a light shielding plate having through holes corresponding to the light emitting element arrays is fixed on the substrate, and the light shielding plate has nine transparent holes. A light guide member having a shape corresponding to the W4 is fitted and fixed to guide light from the light emitting elements, and to transport light between the rows of light emitting elements in contact with W4.
〔発明の実施例〕
以下、この発明の一実施例について図面を参照して説明
する０ｗＩＪ３図（＆） 、 ｉｂｌ ｔＬｔその構成
を示す４ので、（ａ）図は上方から見た図、ｉｂｌ図は
（ａ）図のムーム′−に沿った断面構成図である。基板
１２上に発光素子（ＩＪＤ）列１１ｍ、１１ｂｔ−配設
し、この基１ｉ １ ｊ Ｋは上１１５ ＬＥＤ列１１
凰、１１．ｂに対応した透孔を設は友黒色樹脂製の遮光
板１５を熱カシメ等によって固着する。上記遮光板１５
の透孔には、この透孔に対応した形状で遮光板ＩＪと一
一棟類のｌＩｔ麿から成る導光部材１６１゜１ｉｂ（レ
ンチキュラーレンズ）を予め賦め込み、超音波溶着によ
ってｌｊｉ１１Ｍシておく、上記遮光板１５とレンチキ
ュラーレンズ１６＊、１６ｂとは同時に形成で禽るので
、基板１２と遮光板１５とを熱カシメするだけで組立て
ることかで龜組立て作ａｔ簡素化で璽る。[Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 is a sectional configuration diagram taken along the Moom'-- of FIG. Light emitting device (IJD) rows 11m and 11bt are arranged on the substrate 12, and this group 1i 1 j K is the upper 115 LED row 11.
凰, 11. A through hole corresponding to b is provided, and a light shielding plate 15 made of black resin is fixed by heat caulking or the like. The light shielding plate 15
A light guide member 161°1ib (lenticular lens) consisting of a light-shielding plate IJ and a 11-piece type LIT frame (lenticular lens) with a shape corresponding to this through-hole was placed in advance, and the LJI11M was attached by ultrasonic welding. Furthermore, since the light shielding plate 15 and the lenticular lenses 16* and 16b are formed at the same time, the assembly can be simplified by simply thermally caulking the substrate 12 and the light shielding plate 15.
このような構成によれば、し／チャエラーレンズ１ｉ＆
、１１−とが分１１Ａされており、その間に１光部１
ｊ’が存在する丸め表示値ｔを薄型形成して一１１１接
するＩＤ列へ光がもれることはなく、表示が蒐やすい、
また、遮光板１ｊとレンチキュラーレンズ１１ｉ＆、１
６ｂとｔ超音波溶着する九め、レンズにはそ９やねじれ
が発生することはな（、ｆｆりがなｉのでＬＥＤの配１
ｉｌＩＫレンズが触れて接続不要となることもない、さ
らには反射板を用いていない丸めＬＥＤの点灯によって
）・レージ目ンが発生することもない。According to such a configuration, the shi/cha error lens 1i&
, 11- are separated by 11A, during which 1 light part 1
By forming the rounded display value t where j' exists in a thin shape, no light leaks to the adjacent ID row, and the display is easy to arrange.
In addition, a light shielding plate 1j and a lenticular lens 11i&, 1
6b and t Ultrasonic welding will not cause bending or twisting of the lens (, ff Rigana i, so the LED arrangement 1
There is no need to connect the ilIK lens by touching it, and furthermore, the lighting of round LEDs that do not use a reflector does not cause glare.
なお、上記実施例では、発光素子列が複数の場合につい
てａ明したが、−列の場合に４適用でき、薄型形成が可
能、ノ・レーションを防止できる等の効果がある。In the above embodiments, the explanation is given for the case where there are a plurality of light emitting element rows, but it can be applied to the case where there are a plurality of light emitting element rows, but this method can be applied to the case where there are a plurality of light emitting element rows, and there are effects such as being able to form a thin structure and preventing nolation.
以上１１１したようＫこの発明によれば、複数の発光素
子列が設けられ喪表示装置において、１ｉＩｌ接する発
光素子列への光のもれｔ−通断でき、表示の見やすい光
半導体表示装置が得られる６As described above, according to the present invention, in a display device in which a plurality of light emitting element rows are provided, it is possible to obtain an optical semiconductor display device in which leakage of light to the adjacent light emitting element rows can be conducted and the display is easy to see. 6
第１ｇ１Ｆｉ従来の光半導体表示Ｉｌ＆直を示す断面構
成図、第２図は上記纂１図の光半導体表示装置を薄型形
成し九場合における発ｆＴ：、Ｗ、子の発する光の光路
を説明する丸めの図、蹴３図（ａｔ 、 ｔｂｌは七わ
ぞれこの発明の一実施例に係る元半導体表示饅置會示す
図でおる。
ＪＪ＆、ＪＪｂ・・・発光素子、夕ｕ、１２・・・基板
、１ト・・層党叡、Ｊ＃ａ、ＪＪｂ・・・導光部材（レ
ンチｄＰ：Ｌラーレンズ）。1.g1Fi A cross-sectional configuration diagram showing a conventional optical semiconductor display Il&direction, and FIG. 2 illustrates the optical path of light emitted by fT:, W, and 9 when the optical semiconductor display device shown in FIG. 1 is formed thin. The round figures and the three figures (at and tbl are the figures showing the original semiconductor display box according to one embodiment of this invention, respectively. JJ&, JJb... light emitting element, u, 12...・Substrate, 1st layer, J#a, JJb... Light guiding member (wrench dP: L lens).
Claims (1)
応した透孔が設けられ上記基板に固着される遮光板と、
上記遮光板Ｋｅけられた透孔に対応し丸形状でとの透孔
に祇め込まれて固着され発光素子の光を導く導光部材と
ｔ−具備することを特徴とする光半導体表示装置。a light emitting element array disposed on a substrate; a light shielding plate having through holes corresponding to the light emitting element array and fixed to the substrate;
An optical semiconductor display device comprising: a light guide member having a round shape that corresponds to the through hole formed in the light shielding plate, and is embedded and fixed in the through hole to guide light from the light emitting element; .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57061958A JPS58178575A (en) | 1982-04-14 | 1982-04-14 | Photosemiconductor display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57061958A JPS58178575A (en) | 1982-04-14 | 1982-04-14 | Photosemiconductor display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58178575A true JPS58178575A (en) | 1983-10-19 |
Family
ID=13186202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57061958A Pending JPS58178575A (en) | 1982-04-14 | 1982-04-14 | Photosemiconductor display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58178575A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255973A (en) * | 1985-09-05 | 1987-03-11 | Copal Co Ltd | Led light source |
| JPH07335099A (en) * | 1994-06-13 | 1995-12-22 | Sunx Ltd | Photoelectric switch |
| JP2011077263A (en) * | 2009-09-30 | 2011-04-14 | Stanley Electric Co Ltd | Optical semiconductor device module |
| EP2851971A1 (en) * | 2013-09-23 | 2015-03-25 | Brightek Optoelectronic (Shenzhen) Co., Ltd. | LED package structures for preventing lateral light leakage and method of manufacturing the same |
| CN106703821A (en) * | 2017-02-15 | 2017-05-24 | 河海大学 | Underground tunneling device and tunneling method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4846288A (en) * | 1971-10-13 | 1973-07-02 | ||
| JPS5613281B2 (en) * | 1973-10-25 | 1981-03-27 |
-
1982
- 1982-04-14 JP JP57061958A patent/JPS58178575A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4846288A (en) * | 1971-10-13 | 1973-07-02 | ||
| JPS5613281B2 (en) * | 1973-10-25 | 1981-03-27 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255973A (en) * | 1985-09-05 | 1987-03-11 | Copal Co Ltd | Led light source |
| JPH07335099A (en) * | 1994-06-13 | 1995-12-22 | Sunx Ltd | Photoelectric switch |
| JP2011077263A (en) * | 2009-09-30 | 2011-04-14 | Stanley Electric Co Ltd | Optical semiconductor device module |
| EP2851971A1 (en) * | 2013-09-23 | 2015-03-25 | Brightek Optoelectronic (Shenzhen) Co., Ltd. | LED package structures for preventing lateral light leakage and method of manufacturing the same |
| US9236541B2 (en) | 2013-09-23 | 2016-01-12 | Brightek Optoelectronic (Shenzhen) Co., Ltd. | LED package structures for preventing lateral light leakage and method of manufacturing the same |
| CN106703821A (en) * | 2017-02-15 | 2017-05-24 | 河海大学 | Underground tunneling device and tunneling method thereof |
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