JPS58168293A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed wiring board including a metal conductor foil having a thickness suitable for a circuit requiring a large current or a higher performance acoustic circuit board.

Printed wiring boards have been produced using various manufacturing methods in the past, but a typical method is to attach copper foil with a thickness of about 35 microns to a phenol board using an adhesive or the like. There is a method of forming a K-like circuit by applying a chemical treatment such as etching to the circuit.

However, since such a manufacturing method involves chemical treatment such as etching as in the upper layer, it is difficult to increase the thickness of the metal conductor foil, and therefore a printed wiring board with sufficient current capacity cannot be obtained. That is, it has not been possible to obtain a printed wiring board suitable for circuits that require a large current or circuits that require high performance and quality, for example, for blue tatami mats.

The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide a method for manufacturing a printed wiring board that can form a circuit made of metal conductor foil having a thickness of 100 microns or more.

Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

1 to 4 show the manufacturing process of a printed wiring board used as a circuit board for a dividing network of a speaker device according to the method of the present invention.

That is, the method of the present invention begins with K as shown in FIG.

A heat-sensitive adhesive 2 is applied to the upper surface IA, which is one surface of the insulating substrate 1, by printing or the like along the circuit pattern to be constructed.

Next, as shown in FIG. 2, a press consisting of a heating/pressing press part 4 and a half-blanking blade part 5 provided in the shape of a circuit pattern to be formed is placed above the upper surface IA of the insulating substrate l. t
By placing a metal conductor foil 3 having a thickness of about 100 microns between the press die 6 and the insulating substrate 1, and lowering the press tJ6, as shown in Fig. 3. Then, the metal conductor foil 3 is heated and pressurized by the heating and pressure press s4 of the press mold 6, and the upper surface of the insulating substrate l is IAK bonded. That is, half-cutting is performed along the circuit line to be constructed. Therefore, the metal conductor foil 3 has a circuit component portion 3A and an unnecessary portion 3B.
It is separated into

Finally, as shown in FIG. 4, unnecessary portions 3B of the metal conductor foil 3 are removed to obtain a printed wiring board having the desired circuit configuration.

In the above embodiment, the heat-sensitive adhesive 2 is used, but other materials such as a pressure-sensitive adhesive may also be used. In this case, the metal conductor foil 3 may be simply pressurized and half-cut.

Further, in the above embodiment, the pressurization and half-blanking of the metal conductor foil 3 are performed at the same time, but K may be changed to perform the pressurized and half-blanking.

As explained above, according to the present invention, when chemical processing such as etching is performed, an adhesive is applied by a printing method, etc.
Since pressurization and half-blanking are performed, printed wiring boards can be manufactured using relatively thick metal conductor foil, and therefore high-performance, high-quality printed wiring boards with large current capacity can be obtained. Because it only requires applying adhesive, applying pressure, and half-cutting, it is easier to manufacture than conventional chemical processing, and there is no need to introduce expensive specialized equipment like that used in the Guistamp method. Therefore, the equipment cost is low and the manufacturing cost is also low.

[Brief explanation of drawings]

Figure 1 is a diagram showing the process of applying heat-sensitive adhesive, Figure 2 is a diagram showing the process of arranging the press mold and metal conductor foil, Figure 3 is a diagram showing the process of bonding and half-cutting the metal conductor foil, FIG. 4 is a diagram showing the final step of removing unnecessary portions of the metal conductor foil. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Heat-sensitive adhesive, 3... Metal conductor foil, 4... Heating/pressure press part, 5... Blade part,
6...Press mold. In the drawings, the same reference numerals indicate the same or corresponding parts. Agent Makoto Kuzuno - Spear 1 Figure 21I Figure 4

Claims (3)

[Claims] (1) A step of applying adhesive to one surface K of the insulating substrate in a one-way pattern to be configured, and applying pressure to one surface of the insulating substrate coated with the adhesive to form a multi-metallic conductor foil. A method for manufacturing a printed wiring board, which comprises the steps of bonding the metal conductor foil and half-cutting the metal conductor foil into the circuit pattern, and removing unnecessary portions of the metal conductor foil. (2) The method for manufacturing a printed wiring board according to claim 1, wherein the adhesive is a pressure-sensitive adhesive. (3) The method for manufacturing a printed wiring board according to claim 1, wherein the adhesive is a heat-sensitive adhesive, and the metal conductor foil is bonded to the insulating substrate by heating and pressing. .