JPS58123862A - Method for manufacturing copper alloy for lead material of semiconductor equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a steel alloy to be heated at 500 to 600°C for 1 to 2
0 hour heat treatment and 1 strength, especially tensile strength.

The present invention relates to a manufacturing method that simultaneously improves elongation.

Hitherto, high nickel alloys such as copper alloy and 42 alloy have been favorably used as lead materials for semiconductor devices because of their low coefficient of thermal expansion and good adhesion and sealing properties with elements and 72ζ.

However, as the degree of integration of semiconductor circuits has improved in recent years, the number of high-power consumption xOs has increased, and the lead material used is now copper-based alloy, which has good heat dissipation and thermal conductivity. Therefore, the present applicant first developed nine alloys that were inexpensive and had excellent mechanical properties. (4I Gansho 55-185
967°56-1630) The present invention also relates to a manufacturing method for maximizing the excellent properties of the alloy.

It has been found that only the heat treatment conditions KsP defined in the present invention make it possible to exhibit the four most excellent properties.

And the present invention provides nickel 14 to 40 weight - 1 silicon α
1~to weight-1! ! An alloy consisting of one part of steel and unavoidable impurities is heat treated at SO0 to 600°C for 1 to 20 hours.
A method for producing a steel alloy for lead material of semiconductor devices that simultaneously improves strength, especially tensile strength and elongation, and an alloy in which the oxygen content of the alloy is 10 ppm or less! Son~600℃
A method for manufacturing a steel alloy for lead material of semiconductor devices that improves tensile strength and elongation by heating for 1 to 20 hours and developing the tensile strength and elongation to 41 and the Km component of the alloy; α0
01~(11wt-2 arsenic; α001~21wt.

Antimony; α001~(11wt-2iron:
cLol ~1.0 wt.

Cobalt: α01~1.0 weight S.

Chrome; α01~1.0 Weight smooth.

Tin: 101 to weight.

Aluminum; α01~1.0 weight-.

Titanium; α01~1.0 weight cake.

Zirconium; α01~ to type weight.

Magnesium; α01-10 weight-.

Beryllium; α01~to weight bun.

Zinc; α01~to weight-9 In-gun: 101~to weight-2) One or more selected species in total amount α001~
2.0 wt-added nine alloys, 1 at 300-400℃
A method for producing a steel alloy for lead material of semiconductor devices which simultaneously improves strength, particularly tensile strength and elongation by heat treatment for ~20 hours, and adding the above-mentioned subcomponents to the alloy to reduce the oxygen content to 1.
9 alloys to 0 ppm or less, 300 to 6 oat: 1
- Tensile strength to 1 strength 41 after heat treatment for 20 hours.

The present invention relates to a method for manufacturing a steel alloy for lead material of semiconductor devices that simultaneously improves elongation.

As a result, when 9 was manufactured using the method of the present invention, as shown in FIG. 1, it was possible to significantly improve tensile strength and elongation at the same time.

Next, the reason for limiting the alloy components will be explained. The reason why the nickel content is set to 0.4 to LO weight is.

If the nickel content is less than α4% by weight, an alloy with high strength and high conductivity cannot be obtained even if silicon is added by more than α1% by weight.On the other hand, if the nickel content exceeds 4.0% by weight, processing will be difficult. This is because the soldering properties also decrease.

The reason for setting the silicon content to α1 to weight is that if the silicon content is less than α1 weight, even if nickel is added in an amount of A4% or more by weight, an alloy exhibiting high strength and high conductivity cannot be obtained. First, if the silicon content exceeds 10% by weight, the workability and conductivity will be significantly reduced, and the soldering properties will also be reduced.

Sub-components include shochu, arsenic, antimony, and iron.

The total amount of one or more selected from the group consisting of cobalt, chromium, tin, aluminum, titanium, zirconium, magnesium, beryllium, zinc, and manganese is lllL
If the weight is less than ool, a high-strength and corrosion-resistant alloy cannot be obtained, and if it exceeds 2.0 weight%, the conductivity and soldering properties will be significantly reduced.

Also, the reason why the oxygen content was set to be less than fOppm is as follows.

This is because if it exceeds 10 ppm, the plating adhesion will decrease. In addition, the addition of the above-mentioned subcomponents and the oxygen content of 10
The limit of ppm or less is used when improvement in properties by K is particularly required.

The heat treatment temperature was limited to 300 to 600 degrees Celsius, which is 300 degrees Celsius.
This is because if the temperature is lower than 600° C., the heat treatment effect will not be obtained, and if the temperature exceeds 600° C., it will soften in a short time. The most preferable heat treatment temperature is 400 to 550°C.

The reason why the heat treatment time is limited to 1 to 20 hours is because if it is less than 1 hour, the material time i will not be stable, and if it exceeds 20 hours, it will lose its economic value.

In addition, for rounding to maximize the effect of heat treatment, it is preferable that the crystal grain size before heat treatment is 10 μm or less.

The wE1 diagram shows the relationship between tensile strength and elongation before and after heat treatment, and both tensile strength and elongation are significantly improved after the heat treatment of the present invention.

Next, the present invention will be explained in detail.

EXAMPLE An alloy having the composition shown in Table 1 was melted to obtain an ingot with a thickness of 100 cm. Next, the ingot was hot rolled at about soo℃ to a thickness of 25
After mK, 9 surfaces are face-milled. and cold rolled to a thickness of 2
．． After 5 to 5 mK, annealing is performed to reduce the grain size to 10 μm or less.

In the final rolling, heat treatment is performed for 6 hours to a thickness of α8×4CL420C. This sample was pickled with 5 weight of sulfuric acid for about 10 seconds,
Tensile strength, elongation, and hardness were measured.

Table 1 shows that after papermaking heat treatment, tensile strength and elongation simultaneously improved.

Above 1! From the examples and FIG. 1, the strength is improved by the manufacturing method of the present invention, and the alloy becomes excellent as an electronic component material and a semiconductor device lead material.

[Brief explanation of the drawing]

FIG. 1 shows a graph showing the relationship between tensile strength and elongation of Alloy 10 before and after heat treatment. Patent applicant: Japan Mining Co., Ltd. Attorney ±0569) Keiji Namikawa

Claims (1)

[Claims] ■ Nickel; α4-40 weight*. Keishumu 1~to heavy arrogance. A method for producing a steel alloy for a lead material of a semiconductor device, in which an alloy consisting of copper and unavoidable impurities and residue is heat-sensitized at 300 to 600°C for 1 to 20 hours to simultaneously improve the tensile strength and elongation of a two-strength bone. (2) Nickel; α4~4.0 weight-1 Silicon; α1~
1.0 weight -9 Copper and unavoidable impurities; remaining alloy with an oxygen content of 10 ppm or less, 300~
Heat cured at 600℃ for 1 to 20 hours to achieve tensile strength of 1 strength bone.
A method for developing steel alloys for lead materials in semiconductor devices that simultaneously improves elongation. (2) Nickel: [L4~10 weight-1 element: [
11-1.0 weight rice cake. Copper and unavoidable impurities; added as a subcomponent to the alloy consisting of the remainder; α001~11wt-1-arsenic;
α101・〜α1weight−. Anti-film; α001~ (11 weight - 1 iron:
αo1~to weight bun. Cobalt: (LOl ~to weight-. Chromium: CLol ~to weight-1 Tin
: CLol-to type weight. Aluminum: aOl ~LO weight-. Titanium: αo1~to weight-2, 'Zirconium: (LOI~to weight-2i Gnesicum: (LOI ~to weight-2) Beryllium: αo1 ~to weight-2 Zinc;
aol ~to weight-. Manganese: α01-10 weight cake. A total of 91 or more species selected from the group consisting of α001 ~
2-o weight-added nine alloys, 1 at 300-600℃
A method for producing a copper alloy for lead material of semiconductor devices, which simultaneously improves two strengths, particularly tensile strength and elongation, by heating and returning for ~20 hours. (6) Nickel: (L4~40wt-1 silicon; Q,
1 to weight-2 copper and unavoidable impurities; as a subcomponent to the alloy consisting of the remainder] N: α001 to 21 weight-1 arsenic;
α mouth 01-11 weight-. Antimony; ctoo1-11 weight-2・iron
;α01~to weight-. Cobalt; α01~to weight-. Chromium; α01~1.0wt-2 Tin; α0
1 to weight-. Aluminum; α01 to weight. Titanium; α01~to weight-19x=r=9A
: (L°゛ ~,, L,, o weight "・Magnesium: CLOl ~to weight-. Beryllium: 1101 ~to weight S. Zinc: (LOl ~1.0 weight-. Manganese; α01 ~ LO weight -1 selected from the group consisting of 91s or more with a total amount of 1001~
Copper alloy for lead materials of semiconductor devices is heat-treated at 300 to 400°C for 1 to 20 hours to improve the tensile strength and elongation at the same time. Production method.