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JPS58127694U - Cooling structure of electronic device housing - Google Patents

Cooling structure of electronic device housing

Info

Publication number
JPS58127694U
JPS58127694U JP2157682U JP2157682U JPS58127694U JP S58127694 U JPS58127694 U JP S58127694U JP 2157682 U JP2157682 U JP 2157682U JP 2157682 U JP2157682 U JP 2157682U JP S58127694 U JPS58127694 U JP S58127694U
Authority
JP
Japan
Prior art keywords
frame
cooling structure
ventilation fan
exhaust duct
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2157682U
Other languages
Japanese (ja)
Inventor
誠 遠藤
裕 石原
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP2157682U priority Critical patent/JPS58127694U/en
Publication of JPS58127694U publication Critical patent/JPS58127694U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の電子機器筐体の冷却構造を示す横断面図
、第2図は本考案の一実施例を示す電子機器筐体の冷却
構造を示す横断面図である。 1・・・・・・筐体フレーム、2・・・・・・架枠、3
.3’、、3″・・・・・・印刷回路板群、4・・・・
・・換気扇、5・・・・・・エアフィルタ、6・・・・
・・エアダクト・、7・・・・・・換気孔(排気側)、
8・・・・・・連結ダクト、10・・・・・・換気孔(
吸気側)、11・・・・・・排気ダクト、12・・・・
・・外装カバー、13・・・・・・消音器、14・・・
・・・外装カバー、15・・・・・・外装カバー、16
・・・・・・排気ダクト。
FIG. 1 is a cross-sectional view showing a conventional cooling structure for an electronic device case, and FIG. 2 is a cross-sectional view showing a cooling structure for an electronic device case according to an embodiment of the present invention. 1... Housing frame, 2... Frame, 3
.. 3',,3''...Printed circuit board group, 4...
... Ventilation fan, 5... Air filter, 6...
...Air duct...7...Ventilation hole (exhaust side),
8... Connection duct, 10... Ventilation hole (
intake side), 11...exhaust duct, 12...
... Exterior cover, 13 ... Silencer, 14 ...
... Exterior cover, 15 ... Exterior cover, 16
······Exhaust duct.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 換気扇、送風機などにより、冷却を行なう電子機器にお
いて、電子部品を搭載した印刷回路板や電源モジュール
などの発熱体を収容するダクト状の架枠を形成し、換気
扇、送風機などで前記架枠の頂部から底部に向けて強制
通風し、前記架枠の底部排気部と筐体最上部との間に前
記架枠とは別゛の排気ダクトを形成し排気ダクト・に自
然通風力を生じせしめ、通風路の圧力損失を減少し換気
扇、゛ 送風機の小型化と、排気ダクトの消音効果とを
持たせたことを特徴とする電子機器筐体の冷却構造。
In electronic equipment that is cooled using a ventilation fan, blower, etc., a duct-shaped frame is formed to house a heat generating element such as a printed circuit board or power supply module on which electronic components are mounted, and the top of the frame is cooled using a ventilation fan, blower, etc. An exhaust duct separate from the frame is formed between the bottom exhaust part of the frame and the top of the frame to generate natural ventilation force in the exhaust duct. A cooling structure for an electronic equipment case, which is characterized by reducing pressure loss in the airway, reducing the size of a ventilation fan, and having a noise-muffling effect on an exhaust duct.
JP2157682U 1982-02-19 1982-02-19 Cooling structure of electronic device housing Pending JPS58127694U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2157682U JPS58127694U (en) 1982-02-19 1982-02-19 Cooling structure of electronic device housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2157682U JPS58127694U (en) 1982-02-19 1982-02-19 Cooling structure of electronic device housing

Publications (1)

Publication Number Publication Date
JPS58127694U true JPS58127694U (en) 1983-08-30

Family

ID=30033693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2157682U Pending JPS58127694U (en) 1982-02-19 1982-02-19 Cooling structure of electronic device housing

Country Status (1)

Country Link
JP (1) JPS58127694U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61208297A (en) * 1985-03-12 1986-09-16 日本電気株式会社 Frame construction of electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61208297A (en) * 1985-03-12 1986-09-16 日本電気株式会社 Frame construction of electronic equipment

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