JPS58116269U - flexible circuit board - Google Patents
flexible circuit boardInfo
- Publication number
- JPS58116269U JPS58116269U JP1226682U JP1226682U JPS58116269U JP S58116269 U JPS58116269 U JP S58116269U JP 1226682 U JP1226682 U JP 1226682U JP 1226682 U JP1226682 U JP 1226682U JP S58116269 U JPS58116269 U JP S58116269U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- cover film
- connection portion
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
−第１図は従来構造によるカバーフィルム付可撓性回路
基板の概念的な部分平面構成図、第２図および第３図は
未考案の好ましい実施例によるカバーフィルム付可撓性
回路基板の概念的な要部断面２構成図である。
１・・・・・・ベースフィルム、２・・・・・・回路パ
ターン、２Ａ・・・・・・接続部分、３．・・・・・・
カバーフィルム、５゜６・・・・・・漸減部。- Fig. 1 is a conceptual partial plan configuration diagram of a flexible circuit board with a cover film according to a conventional structure, and Figs. 2 and 3 are conceptual diagrams of a flexible circuit board with a cover film according to a yet-to-be-devised preferred embodiment. FIG. 2 is a sectional view of two main parts. 1...Base film, 2...Circuit pattern, 2A...Connection part, 3.・・・・・・
Cover film, 5°6... Gradual decreasing part.
Claims (1)
撓性回路基板においｔ１回路パターンの露出接続部分と
接する上記カバーフィルム繊縁の厚さを下記接続部分方
向に漸減すべく構成してなる可撓性回路基板。
−′A flexible circuit board in which a cover film is provided on the circuit pattern, and the thickness of the cover film fiber edge in contact with the exposed connection portion of the t1 circuit pattern is gradually reduced in the direction of the connection portion as described below. circuit board.
−′
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1226682U JPS58116269U (en) | 1982-01-30 | 1982-01-30 | flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1226682U JPS58116269U (en) | 1982-01-30 | 1982-01-30 | flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58116269U true JPS58116269U (en) | 1983-08-08 |
Family
ID=30024851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1226682U Pending JPS58116269U (en) | 1982-01-30 | 1982-01-30 | flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58116269U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6336075U (en) * | 1986-08-25 | 1988-03-08 | ||
| JPS6336074U (en) * | 1986-08-23 | 1988-03-08 | ||
| JP2005183740A (en) * | 2003-12-19 | 2005-07-07 | Mitsui Mining & Smelting Co Ltd | Printed wiring board and semiconductor device |
| JP2006126367A (en) * | 2004-10-27 | 2006-05-18 | Mitsui Mining & Smelting Co Ltd | Display apparatus and method for manufacturing same |
| JP2010199540A (en) * | 2009-02-02 | 2010-09-09 | Fujitsu Ltd | Circuit board, method of manufacturing same, and resistance element |
| JP2010278294A (en) * | 2009-05-29 | 2010-12-09 | Fujikura Ltd | Flexible printed circuit board and method of manufacturing the same |
| WO2022102164A1 (en) * | 2020-11-12 | 2022-05-19 | 株式会社フジクラ | Wiring board |
-
1982
- 1982-01-30 JP JP1226682U patent/JPS58116269U/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6336074U (en) * | 1986-08-23 | 1988-03-08 | ||
| JPS6336075U (en) * | 1986-08-25 | 1988-03-08 | ||
| JP2005183740A (en) * | 2003-12-19 | 2005-07-07 | Mitsui Mining & Smelting Co Ltd | Printed wiring board and semiconductor device |
| JP2006126367A (en) * | 2004-10-27 | 2006-05-18 | Mitsui Mining & Smelting Co Ltd | Display apparatus and method for manufacturing same |
| JP4641783B2 (en) * | 2004-10-27 | 2011-03-02 | 三井金属鉱業株式会社 | Display device |
| JP2010199540A (en) * | 2009-02-02 | 2010-09-09 | Fujitsu Ltd | Circuit board, method of manufacturing same, and resistance element |
| JP2010278294A (en) * | 2009-05-29 | 2010-12-09 | Fujikura Ltd | Flexible printed circuit board and method of manufacturing the same |
| WO2022102164A1 (en) * | 2020-11-12 | 2022-05-19 | 株式会社フジクラ | Wiring board |
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