JPS58100383A - Socket for semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention particularly relates to a semiconductor device socket y)K for accommodating a DIP type semiconductor device.

Technical background of the invention Generally, DIP (dual in 1ine pac
When mounting a semiconductor device on a circuit board such as ceramic IC, a semiconductor device socket (hereinafter simply referred to as a socket) is often used. By using such a socket, it is easy to replace the semiconductor device], and there is no need to directly solder the lead pins of the semiconductor device to attach it to the circuit board, so there is no need to directly solder the lead pins of the semiconductor device, so there is no need to directly solder the lead pins of the semiconductor device to attach it to the circuit board. It also has the advantage of being able to prevent adverse effects.O Such a socket F usually includes a socket body 11 made of resin or the like, as shown in FIG. 1 (4), and this body 11) I
C is provided with a plurality of lead pins 12 arranged in two rows. Further, a contact portion IS is provided continuously with the lead pin 12 to contact a lead pin (not shown) of a semiconductor device. In such a socket, the lengths of the lead pins 12 in the row direction are all the same], and as shown in FIG. are the same.

Problems with the Background Art When mounting a semiconductor device on a circuit board, etc. using the socket as described above, first insert one lead pin 12 of the socket into the nine pin hole provided on the circuit board, and insert this lead pin 12 into the appropriate position. (usually the thickness of the board)
Cut it into pieces that are slightly longer. Then, the lead pins 12 of the socket are fixed to the circuit board by Misaki Ushida. In this way, the semiconductor device can be mounted on the circuit board, set in the nine sockets, and assembled in one line on the circuit board. However, in the conventional socket as mentioned above, if the lead bins 120 are deviated due to bending or other reasons, or if the position of the pinhole on the circuit board is slightly deviated, it may be difficult to attach the socket to the circuit board. This has the drawback that it is extremely difficult to insert all the lead pins 11 into the pinholes of the circuit board, which significantly reduces work efficiency.

Purpose of the Invention This invention was made in view of the above circumstances, and
When mounting a socket for storing a W semiconductor device onto a circuit board, etc. that has pinholes corresponding to the lead pins of the socket, the position of the pinholes can be adjusted to ensure that the circuit can be connected reliably and easily even if the spacing between the lead pins is somewhat irregular. An object of the present invention is to provide a socket for a semiconductor device that can be attached to a board and can greatly improve work efficiency.

Summary of the Invention In order to achieve the above purpose, Jin's invention consists of two
The length of each lead pin in the row direction is changed for a plurality of glue dobbins consisting of rows, and the length of each lead pin that is symmetrical between two rows is made the same. When mounting on a circuit board, the longest pair of lead pins are inserted into the pinholes of the circuit board, and each pair of lead pins is subsequently inserted into the pinholes in the same order.

Embodiment of the Invention An embodiment of the invention will be described below with reference to the drawings. Figures 2 (■) and (B) show the structure of a socket for a semiconductor device according to an embodiment of the present invention. As shown in Figure (2), a plurality of lead pins 21 in two rows are attached to a socket body 11 made of resin or the like. Providing the lead pins 21, for example, are set in a step-like manner with varying lengths in the row direction from one end of the main body 11. Also, as shown in Figure 2) (front view), the lead pins 21&, 21b are symmetrical between the two rows.
The lengths of should be the same. Then, as shown in Figure (4),
A contact portion 1 that corresponds to and contacts a DIP type semiconductor device glued pin (not shown) and is continuous with each lead pin 21.
3 will be provided.

When such a socket is attached to a circuit board made of ceramic or the like that constitutes an electronic circuit board, the socket is inserted into a pinhole provided in the circuit board.

Insert the lead pin 21. The pinholes are provided on the circuit board in correspondence with the spacing between the lead pins of the socket. In this case, soke.

The longest lead pin 21 of the circuit board, that is, a pair of glued pins xis and Ilb in two rows, is inserted into a predetermined pinhole of the circuit board. Similarly, each pair of glue-F pins is inserted into the pinhole in order from the one with the longest thickness. Further, 1. The lead pin 21 is cut to an appropriate length, that is, usually slightly longer than the thickness of the circuit board, and soldered or the like is performed to fix the lead pin 21 to the circuit board. Then, the semiconductor device is housed in a socket mounted on this circuit board, and the semiconductor device can be incorporated into a predetermined electronic circuit or the like.

In this way, it is difficult to attach the semiconductor device socket to the circuit board. Moreover, in the case of a mulch, lead pin 21 of the socket
For example, lead pin 2 changes in length in the column direction.
Even if the spacing between the lead pins 21 varies slightly due to bending or other reasons, the lead pins 21 can be inserted into the pin holes of the circuit board in order starting from the longest lead pin J1, making it easy and secure to insert the socket into the circuit board. Can be installed. Also, even if the position of the pinhole on the circuit board is slightly misaligned, the socket glue
The pin 21 can be surely and easily inserted into the pinhole of the circuit board, and the socket can be attached.

Further, in the above embodiment, the column direction glue dobbin 21
Although the case where the length of the lead pins is changed stepwise from the end of the main body 11 has been described, for example, as shown in FIG.
) is the longest and the lengths of the lead bins 21 in the other column directions are all different, the same effect as in the above embodiment can be obtained.

Effects of the Invention As detailed above, according to the present invention, in a socket for accommodating a DIP type semiconductor device, the length of the lead bin in the column direction is changed with respect to the lead pin of the socket, and 2
By making the lengths of the symmetrical lead bins the same between rows, mounting the socket on a circuit board with pinholes can be done reliably and easily, even if the pinhole position or lead bin spacing is somewhat indeterminate. can be done. Therefore, it is possible to greatly improve the efficiency of mounting the semiconductor device on the circuit board by accommodating it in the socket. In addition, since the length of the lead pin of the socket 1) can be changed, the material required for the lead pin can be reduced and the length of the lead pin can be reduced.

It also has the effect of reducing the cost of the engine itself.

[Brief explanation of the drawing]

1), (B) is a diagram showing the configuration of a conventional semiconductor device socket, 2nd doctor, (B) is a diagram showing the configuration of a semiconductor device socket according to an embodiment of the present invention, and 3rd is a diagram showing the configuration of a semiconductor device socket according to an embodiment of the invention. The figure is a diagram showing the structure of a socket for a semiconductor device according to another embodiment of the present invention. 11...Socket body, llmllml1m. 11b, 11e...Lead pin, 1j...Contact part.

Claims (2)

[Claims] (1) A socket for accommodating a DIP type semiconductor device has a plurality of lead pins arranged in two rows, each lead pin having a different length in the row direction, and the length of each lead pin being symmetrical between the two rows. A socket for a semiconductor device characterized by having the same socket. (2) The socket for a semiconductor device according to claim 1, wherein the lengths of the lead pins in the column direction are step-shaped.