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JPS5778447A - Phenolic resin molding material - Google Patents

Phenolic resin molding material

Info

Publication number
JPS5778447A
JPS5778447A JP15491380A JP15491380A JPS5778447A JP S5778447 A JPS5778447 A JP S5778447A JP 15491380 A JP15491380 A JP 15491380A JP 15491380 A JP15491380 A JP 15491380A JP S5778447 A JPS5778447 A JP S5778447A
Authority
JP
Japan
Prior art keywords
phenolic resin
resin
molding material
molding
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15491380A
Other languages
Japanese (ja)
Inventor
Kinya Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15491380A priority Critical patent/JPS5778447A/en
Publication of JPS5778447A publication Critical patent/JPS5778447A/en
Pending legal-status Critical Current

Links

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To obtain a molding material capable of suppressing heating in moldings during extrusion and having an improved fluidity during molding and also suitable for the molding of electrical appliances, household goods, etc., by adding cetyl palmitate and xylene resin to a phenolic resin.
CONSTITUTION: A phenolic resin (A) is mixed with cetyl palmitate (B) and xylene resin (C), together with, as needed, a filler (D) and a colorant (E), and they are well mixed and ground to obtain a phenol resin molding material. Preferred amounts of components (B) and (C) to be added are 0.5W2wt% and 10W30wt%, respectively, on the basis of total weight of all the components. Phenolic resin (A) used includes a mixture of novolak or resol type phenol resin and a curing agent preferably.
COPYRIGHT: (C)1982,JPO&Japio
JP15491380A 1980-11-04 1980-11-04 Phenolic resin molding material Pending JPS5778447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15491380A JPS5778447A (en) 1980-11-04 1980-11-04 Phenolic resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15491380A JPS5778447A (en) 1980-11-04 1980-11-04 Phenolic resin molding material

Publications (1)

Publication Number Publication Date
JPS5778447A true JPS5778447A (en) 1982-05-17

Family

ID=15594690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15491380A Pending JPS5778447A (en) 1980-11-04 1980-11-04 Phenolic resin molding material

Country Status (1)

Country Link
JP (1) JPS5778447A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155151A (en) * 1984-08-27 1986-03-19 Mitsui Toatsu Chem Inc Thermosetting resin molding material
JPS6155154A (en) * 1984-08-27 1986-03-19 Mitsui Toatsu Chem Inc Thermosetting resin molding material for extrusion
JPS6155152A (en) * 1984-08-27 1986-03-19 Mitsui Toatsu Chem Inc Thermosetting resin molding material
JPS6155153A (en) * 1984-08-27 1986-03-19 Mitsui Toatsu Chem Inc Thermosetting resin molding material
US6462464B2 (en) 2000-11-06 2002-10-08 Denso Corporation Stacked piezoelectric device and method of fabrication thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155151A (en) * 1984-08-27 1986-03-19 Mitsui Toatsu Chem Inc Thermosetting resin molding material
JPS6155154A (en) * 1984-08-27 1986-03-19 Mitsui Toatsu Chem Inc Thermosetting resin molding material for extrusion
JPS6155152A (en) * 1984-08-27 1986-03-19 Mitsui Toatsu Chem Inc Thermosetting resin molding material
JPS6155153A (en) * 1984-08-27 1986-03-19 Mitsui Toatsu Chem Inc Thermosetting resin molding material
US6462464B2 (en) 2000-11-06 2002-10-08 Denso Corporation Stacked piezoelectric device and method of fabrication thereof

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