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JPS5750443A - Characteristic discrimination indication of semiconductor chip - Google Patents

Characteristic discrimination indication of semiconductor chip

Info

Publication number
JPS5750443A
JPS5750443A JP12632580A JP12632580A JPS5750443A JP S5750443 A JPS5750443 A JP S5750443A JP 12632580 A JP12632580 A JP 12632580A JP 12632580 A JP12632580 A JP 12632580A JP S5750443 A JPS5750443 A JP S5750443A
Authority
JP
Japan
Prior art keywords
quality
chips
probe
judging device
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12632580A
Other languages
Japanese (ja)
Inventor
Yukikazu Hoashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12632580A priority Critical patent/JPS5750443A/en
Publication of JPS5750443A publication Critical patent/JPS5750443A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To prevent misindication and to increase workability, by a method wherein a defect signal from a probe is received after judging quality by closely attaching the probe of a quality judging device to each of the semiconductor chips and quality indication is printed on defective chips. CONSTITUTION:The probe of a quality judging device is closely attached to each of a plurality of chips 10a formed on a semiconductor wafer 10 for an electrical characteristic test and the quality is jedged. Next, a dot printer 11 electrically connected to the probe of the quality judging device is used to print indication modes 12 for defective chips on defective chips 10a' in accordance with a detection signal for defective chips. This method prevents misindication to good chips and increase the workability.
JP12632580A 1980-09-11 1980-09-11 Characteristic discrimination indication of semiconductor chip Pending JPS5750443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12632580A JPS5750443A (en) 1980-09-11 1980-09-11 Characteristic discrimination indication of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12632580A JPS5750443A (en) 1980-09-11 1980-09-11 Characteristic discrimination indication of semiconductor chip

Publications (1)

Publication Number Publication Date
JPS5750443A true JPS5750443A (en) 1982-03-24

Family

ID=14932384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12632580A Pending JPS5750443A (en) 1980-09-11 1980-09-11 Characteristic discrimination indication of semiconductor chip

Country Status (1)

Country Link
JP (1) JPS5750443A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256578A (en) * 1991-12-23 1993-10-26 Motorola, Inc. Integral semiconductor wafer map recording
CN109277329A (en) * 2018-09-10 2019-01-29 深圳市矽电半导体设备有限公司 A kind of semiconductor test gets method ready

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256578A (en) * 1991-12-23 1993-10-26 Motorola, Inc. Integral semiconductor wafer map recording
CN109277329A (en) * 2018-09-10 2019-01-29 深圳市矽电半导体设备有限公司 A kind of semiconductor test gets method ready

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