JPS5742618A - Plaster and its preparation - Google Patents
Plaster and its preparationInfo
- Publication number
- JPS5742618A JPS5742618A JP11957080A JP11957080A JPS5742618A JP S5742618 A JPS5742618 A JP S5742618A JP 11957080 A JP11957080 A JP 11957080A JP 11957080 A JP11957080 A JP 11957080A JP S5742618 A JPS5742618 A JP S5742618A
- Authority
- JP
- Japan
- Prior art keywords
- plaster
- organic solvent
- active constituent
- water
- mixed solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Medicinal Preparation (AREA)
Abstract
PURPOSE: To obtain a plaster having improved feeling of use, adhesiveness to the skin, storage stability and water retaining property, by dissolving a polyamide having a high hydrophilic nature, a high polymer and an active constituent in a mixed solvent of water with a volatile organic solvent, and evaporating the organic solvent.
CONSTITUTION: A plaster is prepared by dissolving (A) a polyamide having the solubility in water, a volatile organic solvent, e.g. ethanol, or a mixed solvent thereof and (B) a high polymer having the similar solubility in the mixed solvent and an active constituent in the mixed solvent of water with the volatile organic solvent, applying the resultant solution to a backing layer, e.g. a high polymeric film or nonwoven fabric, and evaporating the organic solvent to form a plaster layer. The plaster has good compatibility of the active constituent with the component (A) and is capable of increasing the amount (20% or more) of the active constituent even in a thin layer of the plaster. A copolyamide is used as the component (A) and polyvinylpyrrolidone is used as the component (B). The amounts of the components (A) and (B) are 1W30wt% and 5W60wt% in the plaster layer respectively.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11957080A JPS5742618A (en) | 1980-08-29 | 1980-08-29 | Plaster and its preparation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11957080A JPS5742618A (en) | 1980-08-29 | 1980-08-29 | Plaster and its preparation |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5742618A true JPS5742618A (en) | 1982-03-10 |
Family
ID=14764604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11957080A Pending JPS5742618A (en) | 1980-08-29 | 1980-08-29 | Plaster and its preparation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5742618A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6066759A (en) * | 1983-09-21 | 1985-04-16 | 日東電工株式会社 | Pharmaceutical preparation |
JP2006526636A (en) * | 2003-06-05 | 2006-11-24 | スリーエム イノベイティブ プロパティズ カンパニー | Hydrophilic adhesive composition for Chinese medicine delivery |
US9278155B2 (en) | 2003-06-05 | 2016-03-08 | 3M Innovative Properties Company | Adhesive compositions, articles incorporating same and methods of manufacture |
JP2021014565A (en) * | 2019-07-12 | 2021-02-12 | 新日本理化株式会社 | Plasticizer composition for polyamide resin |
-
1980
- 1980-08-29 JP JP11957080A patent/JPS5742618A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6066759A (en) * | 1983-09-21 | 1985-04-16 | 日東電工株式会社 | Pharmaceutical preparation |
JPH046164B2 (en) * | 1983-09-21 | 1992-02-05 | Nitto Denko Corp | |
JP2006526636A (en) * | 2003-06-05 | 2006-11-24 | スリーエム イノベイティブ プロパティズ カンパニー | Hydrophilic adhesive composition for Chinese medicine delivery |
US9278155B2 (en) | 2003-06-05 | 2016-03-08 | 3M Innovative Properties Company | Adhesive compositions, articles incorporating same and methods of manufacture |
JP2021014565A (en) * | 2019-07-12 | 2021-02-12 | 新日本理化株式会社 | Plasticizer composition for polyamide resin |
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