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JPS57206049A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57206049A
JPS57206049A JP8946181A JP8946181A JPS57206049A JP S57206049 A JPS57206049 A JP S57206049A JP 8946181 A JP8946181 A JP 8946181A JP 8946181 A JP8946181 A JP 8946181A JP S57206049 A JPS57206049 A JP S57206049A
Authority
JP
Japan
Prior art keywords
window part
conducting material
conducting
wirings
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8946181A
Other languages
Japanese (ja)
Inventor
Yoshihiro Takemae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8946181A priority Critical patent/JPS57206049A/en
Publication of JPS57206049A publication Critical patent/JPS57206049A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To enhance manufacturing efficiency and to improve economy by concurrently performing the processes for decreasing the resistance values of two wirings of a power source line, a signal lines, and the like. CONSTITUTION:A first window part 14 is formed in an insulating layer 12 which is formed on a substrate 11. A second window part 24 is also provided in a resist 41. Then a conducting material 14 is coated over the substrate 11. The conducting material constitutes a conducting layer 21 in the window part 14. Then the conducting material is also embedded in the second window part 42, and it is made to be the wiring 13. Then the resist 41 is removed and the conducting material 43 is removed at the same time. Thereafter, a conducting layer is formed by using a specified mask, and the wiring 13' and wirings 13 and 31 are completed.
JP8946181A 1981-06-12 1981-06-12 Manufacture of semiconductor device Pending JPS57206049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8946181A JPS57206049A (en) 1981-06-12 1981-06-12 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8946181A JPS57206049A (en) 1981-06-12 1981-06-12 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57206049A true JPS57206049A (en) 1982-12-17

Family

ID=13971340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8946181A Pending JPS57206049A (en) 1981-06-12 1981-06-12 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57206049A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064449A (en) * 1983-09-19 1985-04-13 Hitachi Ltd Semiconductor integrated circuit device
JPH01234137A (en) * 1988-03-10 1989-09-19 Sumitomo Electric Ind Ltd Method and apparatus for detecting life of cutting tool

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064449A (en) * 1983-09-19 1985-04-13 Hitachi Ltd Semiconductor integrated circuit device
JPH01234137A (en) * 1988-03-10 1989-09-19 Sumitomo Electric Ind Ltd Method and apparatus for detecting life of cutting tool

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