JPS57188676A - Forming device for thin film by vacuum - Google Patents
Forming device for thin film by vacuumInfo
- Publication number
- JPS57188676A JPS57188676A JP7134981A JP7134981A JPS57188676A JP S57188676 A JPS57188676 A JP S57188676A JP 7134981 A JP7134981 A JP 7134981A JP 7134981 A JP7134981 A JP 7134981A JP S57188676 A JPS57188676 A JP S57188676A
- Authority
- JP
- Japan
- Prior art keywords
- source
- evaporating
- area
- substrate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title abstract 3
- 238000001704 evaporation Methods 0.000 abstract 6
- 239000000463 material Substances 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 4
- 238000010894 electron beam technology Methods 0.000 abstract 2
- 238000004544 sputter deposition Methods 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000007599 discharging Methods 0.000 abstract 1
- 230000005284 excitation Effects 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000007666 vacuum forming Methods 0.000 abstract 1
- 238000007740 vapor deposition Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To control a sputtering source and an electron beam evaporating source respectively independently and to increase the speed of thin film formation in a device of making combination use of said evaporating source and sputtering source by locating the evaporating source behind the through-hole of a target plate facing a substrate. CONSTITUTION:A vacuum forming device 2 and a gas supplying and regulating device 3 are operated to keep a prescribed gaseous pressure in a vacuum vessel 1. A voltage is applied between a substrate 4 and a target plate 6 having a through-hole 9, and an electric discharging area 11 is formed between the plates 4 and 6. The gaseous ions in the area 11 sputter the surface of the plate 6, and the material of the sputtered surface of the plate 6 is stuck on the surface of the substrate 4. When an electron beam is irradiated to the evaporating material 12 contained in an evaporating source 10, the material 12 scatters radially, and advances into the area 11 by passing mainly through the hole 9 of the plate 6 in front of the source 10 in an arrow A range, and deposits on the substrate 4. Since the material 12 passes through the area 11, various phenomena such as excitation, ionication and the like affected by the area 11 are induced in the evaporating material and therefore, the thin film of the structure and properties differing from those in the case of pure vapor deposition are formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7134981A JPS57188676A (en) | 1981-05-14 | 1981-05-14 | Forming device for thin film by vacuum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7134981A JPS57188676A (en) | 1981-05-14 | 1981-05-14 | Forming device for thin film by vacuum |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57188676A true JPS57188676A (en) | 1982-11-19 |
Family
ID=13457924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7134981A Pending JPS57188676A (en) | 1981-05-14 | 1981-05-14 | Forming device for thin film by vacuum |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57188676A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6017070A (en) * | 1983-07-11 | 1985-01-28 | Nippon Telegr & Teleph Corp <Ntt> | Method and device for forming thin film |
-
1981
- 1981-05-14 JP JP7134981A patent/JPS57188676A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6017070A (en) * | 1983-07-11 | 1985-01-28 | Nippon Telegr & Teleph Corp <Ntt> | Method and device for forming thin film |
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