JPS57152168A - Manufacture of schottky barrier gate field effect transistor - Google Patents
Manufacture of schottky barrier gate field effect transistorInfo
- Publication number
- JPS57152168A JPS57152168A JP56036986A JP3698681A JPS57152168A JP S57152168 A JPS57152168 A JP S57152168A JP 56036986 A JP56036986 A JP 56036986A JP 3698681 A JP3698681 A JP 3698681A JP S57152168 A JPS57152168 A JP S57152168A
- Authority
- JP
- Japan
- Prior art keywords
- film
- source
- alloys
- metal
- schottky barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/80—FETs having rectifying junction gate electrodes
- H10D30/87—FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
Landscapes
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
PURPOSE:To reduce the gate resistance manufacturing the GaAs Schottky barrier gate FET by a method wherein a gate electrode and an N<+> region of source and drain are subjected implantation making use of self-alignment process. CONSTITUTION:The first metallic film 41 containing a metal such as Nb, Mo, W and the like or the alloys thereof or the other alloys containing 20atm% or less of a metal such as Ti, Cr, Zr and the like in addition to the said metals or alloys is formed on an N type channel layer 12 formed on a high resistant GaAs substrate 11 and the second metallic layer 42 is formed on the said film 41 into the size larger than that of the film 41 while the ion 43 of the donor impurity is implanted in the source and drain regions 44 and 45. Then the surface is annealed through the intermediary of the surface protecting film 46 to activate the implanted ion forming the N<+> regions 13 and 14. Next the surface protecting film 46 is removed and the first metal layer 41 is side etched faster than the second metal layer 42 to form the gate electrode 15 and further the source and drain electrodes 16 and 17.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56036986A JPS57152168A (en) | 1981-03-13 | 1981-03-13 | Manufacture of schottky barrier gate field effect transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56036986A JPS57152168A (en) | 1981-03-13 | 1981-03-13 | Manufacture of schottky barrier gate field effect transistor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57152168A true JPS57152168A (en) | 1982-09-20 |
JPH0212015B2 JPH0212015B2 (en) | 1990-03-16 |
Family
ID=12485066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56036986A Granted JPS57152168A (en) | 1981-03-13 | 1981-03-13 | Manufacture of schottky barrier gate field effect transistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57152168A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6081872A (en) * | 1983-10-11 | 1985-05-09 | Oki Electric Ind Co Ltd | Method for manufacturing semiconductor devices |
JPS60115268A (en) * | 1983-11-28 | 1985-06-21 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS6143481A (en) * | 1984-08-08 | 1986-03-03 | Oki Electric Ind Co Ltd | Manufacturing method of shot-gate field effect transistor |
JPS6155966A (en) * | 1984-08-27 | 1986-03-20 | Oki Electric Ind Co Ltd | Method for manufacturing compound semiconductor devices |
FR2682534A1 (en) * | 1991-10-14 | 1993-04-16 | Mitsubishi Electric Corp | SEMICONDUCTOR DEVICE HAVING A STACK OF GRID ELECTRODE SECTIONS, AND METHOD FOR MANUFACTURING THE DEVICE. |
-
1981
- 1981-03-13 JP JP56036986A patent/JPS57152168A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6081872A (en) * | 1983-10-11 | 1985-05-09 | Oki Electric Ind Co Ltd | Method for manufacturing semiconductor devices |
JPS60115268A (en) * | 1983-11-28 | 1985-06-21 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS6143481A (en) * | 1984-08-08 | 1986-03-03 | Oki Electric Ind Co Ltd | Manufacturing method of shot-gate field effect transistor |
JPS6155966A (en) * | 1984-08-27 | 1986-03-20 | Oki Electric Ind Co Ltd | Method for manufacturing compound semiconductor devices |
FR2682534A1 (en) * | 1991-10-14 | 1993-04-16 | Mitsubishi Electric Corp | SEMICONDUCTOR DEVICE HAVING A STACK OF GRID ELECTRODE SECTIONS, AND METHOD FOR MANUFACTURING THE DEVICE. |
US5384479A (en) * | 1991-10-14 | 1995-01-24 | Mitsubishi Denki Kabushiki Kaisha | Field effect transistor with T-shaped gate electrode |
US5462884A (en) * | 1991-10-14 | 1995-10-31 | Mitsubishi Denki Kabushiki Kaisha | Method of making field effect transistor with T-shaped gate electrode |
Also Published As
Publication number | Publication date |
---|---|
JPH0212015B2 (en) | 1990-03-16 |
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