[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS57156166A - Lapping equipment - Google Patents

Lapping equipment

Info

Publication number
JPS57156166A
JPS57156166A JP56039417A JP3941781A JPS57156166A JP S57156166 A JPS57156166 A JP S57156166A JP 56039417 A JP56039417 A JP 56039417A JP 3941781 A JP3941781 A JP 3941781A JP S57156166 A JPS57156166 A JP S57156166A
Authority
JP
Japan
Prior art keywords
grinder
wafer
supported
retension
buff
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56039417A
Other languages
Japanese (ja)
Inventor
Kazuhiko Watanabe
Masaru Tsukahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56039417A priority Critical patent/JPS57156166A/en
Publication of JPS57156166A publication Critical patent/JPS57156166A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To lap wafer with high accuracy and provide automatic regular sizing and removal for wafer by rotating and reciprocating a wafer retension member and a grinder independently. CONSTITUTION:A main surface of a wafer 2 supported with a retension member 1 is arranged to face the surface of buff 4 clossly fitted to a rotary grinder 3. The retension member 1 is supported by a support shaft 5 and receives a rotary force from it. The grinder 3 is supported by an arm member 7 and receives a rotary force. While in closs contact with the retension member 1, the grinder 3 makes a reciprocating operation, applying proper weight. A grinder agent is soaked into the surface of the buff 4 and its inner layer under this condition and lapping is performed.
JP56039417A 1981-03-20 1981-03-20 Lapping equipment Pending JPS57156166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56039417A JPS57156166A (en) 1981-03-20 1981-03-20 Lapping equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56039417A JPS57156166A (en) 1981-03-20 1981-03-20 Lapping equipment

Publications (1)

Publication Number Publication Date
JPS57156166A true JPS57156166A (en) 1982-09-27

Family

ID=12552403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56039417A Pending JPS57156166A (en) 1981-03-20 1981-03-20 Lapping equipment

Country Status (1)

Country Link
JP (1) JPS57156166A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183748U (en) * 1983-05-24 1984-12-07 スピ−ドフアム株式会社 Surface plate for surface grinding
JPH04255218A (en) * 1990-08-06 1992-09-10 Micron Technol Inc Method and apparatus for polishing of flat wafer
JPH05245755A (en) * 1991-04-16 1993-09-24 Fujikoshi Kikai Kogyo Kk Polishing device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5048593A (en) * 1973-08-31 1975-04-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5048593A (en) * 1973-08-31 1975-04-30

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183748U (en) * 1983-05-24 1984-12-07 スピ−ドフアム株式会社 Surface plate for surface grinding
JPH035413Y2 (en) * 1983-05-24 1991-02-12
JPH04255218A (en) * 1990-08-06 1992-09-10 Micron Technol Inc Method and apparatus for polishing of flat wafer
JPH05245755A (en) * 1991-04-16 1993-09-24 Fujikoshi Kikai Kogyo Kk Polishing device

Similar Documents

Publication Publication Date Title
JPS5542752A (en) High speed flexible belt grinder
EP1053828A3 (en) Method and apparatus for dressing polishing cloth
EP0051040A3 (en) Apparatus and method for the grinding of material
JPS57156166A (en) Lapping equipment
ES2127838T3 (en) POLISHING METHOD AND APPARATUS FOR THE SAME AND POLISHING WHEEL.
JPS5423294A (en) Method of finishing machining disc and its device
JPS56150755A (en) Manufacture of substrate for electrophotographic receptor
JPS5796766A (en) Semiconductor wafer edge polishing device
JPS545292A (en) Grinding device
JPS5635423A (en) Method of correcting photomask by polishing
JPS5343295A (en) Internal surface grinder
JPS5518375A (en) Polisher
JPS5768883A (en) Cleaning member
JPS5571026A (en) Method and apparatus for grinding wafer
JPS51140294A (en) Apparatus for compenstating for wearing down in grinding machine
JPS5586120A (en) Grinding method for semiconductor wafer
JPS51117396A (en) Method and apparatus for moistening polished surface of grinding disc of grinding machine
JPS57149154A (en) Method of polishing semiconductor wafer
JPS6478758A (en) Polishing device for printing circuit board
JPS53121105A (en) Polisher for rotary current collector unit of rotary machine
JPS5590261A (en) Method of slightly polishing thin ceramic sheet
JPS5789552A (en) Grinding process
JPS5222189A (en) Polishing method for watch cases
JPS5299494A (en) Apparatus for grinding circular article
JPS54122087A (en) Simultaneous working method for both surfaces of wafer