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JPS5715449A - Cooler for electronic circuit components - Google Patents

Cooler for electronic circuit components

Info

Publication number
JPS5715449A
JPS5715449A JP9196280A JP9196280A JPS5715449A JP S5715449 A JPS5715449 A JP S5715449A JP 9196280 A JP9196280 A JP 9196280A JP 9196280 A JP9196280 A JP 9196280A JP S5715449 A JPS5715449 A JP S5715449A
Authority
JP
Japan
Prior art keywords
heat
radiating member
components
heat radiating
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9196280A
Other languages
Japanese (ja)
Inventor
Masao Fujii
Enjiyu Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9196280A priority Critical patent/JPS5715449A/en
Publication of JPS5715449A publication Critical patent/JPS5715449A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To enhance the effect of heat radiation by transmitting heat outside the case by surface contact of a part of an elastically-designed heat radiating member with a hat transmission equipment as constructed integrally with the case of components. CONSTITUTION:In an equipment so designed that heat generated from electronic circuit components 1 housed in a package is cooled with a water-cooled cold plate 3, a heat radiating member 4 is mounted integral to individual parts. The heat radiating member 4 is made elastic by bending a metal plate in a Z shape. For example, components 1 packaged on a printed board 2 or the like individually are so arranged that the top surface of the member 4 adhered to the cold plate 3 by the elasticity of the heat radiating member 4. This permits heat generated from individual components to transmit directly outside the case thereby improving the effect of heat radiation.
JP9196280A 1980-07-02 1980-07-02 Cooler for electronic circuit components Pending JPS5715449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9196280A JPS5715449A (en) 1980-07-02 1980-07-02 Cooler for electronic circuit components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9196280A JPS5715449A (en) 1980-07-02 1980-07-02 Cooler for electronic circuit components

Publications (1)

Publication Number Publication Date
JPS5715449A true JPS5715449A (en) 1982-01-26

Family

ID=14041177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9196280A Pending JPS5715449A (en) 1980-07-02 1980-07-02 Cooler for electronic circuit components

Country Status (1)

Country Link
JP (1) JPS5715449A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6345900A (en) * 1986-08-13 1988-02-26 日本発条株式会社 Board cooler
JPS63233556A (en) * 1987-03-23 1988-09-29 Nec Corp Cooling structure of lsi case
JPH02129793U (en) * 1989-03-31 1990-10-25
US5313097A (en) * 1992-11-16 1994-05-17 International Business Machines, Corp. High density memory module
JPH07147350A (en) * 1993-11-24 1995-06-06 Nec Corp Semiconductor container
EP0792573A1 (en) * 1994-11-18 1997-09-03 Tessera, Inc. Compliant thermal connectors, methods and assemblies
US7933125B2 (en) 2008-03-24 2011-04-26 Fujitsu Limited Board unit and electronic apparatus
EP3151646A1 (en) * 2015-09-29 2017-04-05 TE Connectivity Corporation Conformable thermal bridge

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6345900A (en) * 1986-08-13 1988-02-26 日本発条株式会社 Board cooler
JPS63233556A (en) * 1987-03-23 1988-09-29 Nec Corp Cooling structure of lsi case
JPH02129793U (en) * 1989-03-31 1990-10-25
US5313097A (en) * 1992-11-16 1994-05-17 International Business Machines, Corp. High density memory module
JPH07147350A (en) * 1993-11-24 1995-06-06 Nec Corp Semiconductor container
EP0792573A1 (en) * 1994-11-18 1997-09-03 Tessera, Inc. Compliant thermal connectors, methods and assemblies
EP0792573A4 (en) * 1994-11-18 1998-02-25 Tessera Inc Compliant thermal connectors, methods and assemblies
US7933125B2 (en) 2008-03-24 2011-04-26 Fujitsu Limited Board unit and electronic apparatus
EP3151646A1 (en) * 2015-09-29 2017-04-05 TE Connectivity Corporation Conformable thermal bridge
US9668380B2 (en) 2015-09-29 2017-05-30 Te Connectivity Corporation Conformable thermal bridge

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