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JPS57134284A - Diffusion bonding method - Google Patents

Diffusion bonding method

Info

Publication number
JPS57134284A
JPS57134284A JP1757281A JP1757281A JPS57134284A JP S57134284 A JPS57134284 A JP S57134284A JP 1757281 A JP1757281 A JP 1757281A JP 1757281 A JP1757281 A JP 1757281A JP S57134284 A JPS57134284 A JP S57134284A
Authority
JP
Japan
Prior art keywords
stopper
metallic parts
bonding
bonded
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1757281A
Other languages
Japanese (ja)
Inventor
Shinichi Tanioka
Sachio Seto
Masaichi Akane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IHI Corp
Original Assignee
IHI Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IHI Corp filed Critical IHI Corp
Priority to JP1757281A priority Critical patent/JPS57134284A/en
Publication of JPS57134284A publication Critical patent/JPS57134284A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE:To perform uniform bonding easily by restricting deformation of metals to be bonded by inerting a gauge between the pressure stands together with the metals to be bonded as a stopper and thereby controlling the thickness of the metals after bonding. CONSTITUTION:Metallic parts 1, 2 to be bonded are brought into contact with each other at the contact face 3 and inserted between pressure stands 5, 6. The thickness of superposed metallic parts 1, 2 is (ho), and the thickness after bonding is (h). A stopper 7 for controlling deformation is inserted around the metallic parts 1, 2. The stopper 7 is made of the same material with the metallic parts 1, 2 or of materials harder than the metallic parts. A bonding preventive agent is inserted between the metallic parts 1, 2 and pressure stands 5, 6 or the stopper 7, and the sectional area of the stopper 7 is made large enough to prevent deformation by pressure. Bonding is made by applying pressure at a high temperature in vacuum or inert gas atmosphere and cooled to room temperature. Thus, a metallic part bonded to desired thickness (h) is obtained.
JP1757281A 1981-02-10 1981-02-10 Diffusion bonding method Pending JPS57134284A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1757281A JPS57134284A (en) 1981-02-10 1981-02-10 Diffusion bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1757281A JPS57134284A (en) 1981-02-10 1981-02-10 Diffusion bonding method

Publications (1)

Publication Number Publication Date
JPS57134284A true JPS57134284A (en) 1982-08-19

Family

ID=11947621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1757281A Pending JPS57134284A (en) 1981-02-10 1981-02-10 Diffusion bonding method

Country Status (1)

Country Link
JP (1) JPS57134284A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184769A (en) * 1989-07-26 1993-02-09 Avco Corporation Tooling and method for consolidating a filamentary reinforced metal matrix composite
JP2004001054A (en) * 2002-06-03 2004-01-08 New Industry Research Organization Butt-joining method
JP2010094712A (en) * 2008-10-16 2010-04-30 Sekisou Kanagata Co Ltd Diffusion bonding method
CN103624393A (en) * 2013-11-21 2014-03-12 中国航空工业集团公司北京航空制造工程研究所 Rigidity restraint hot self-extruding connection method
WO2023248817A1 (en) * 2022-06-22 2023-12-28 株式会社Mole′S Act Method for manufacturing metal bonded body, and method for bonding diecast member

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184769A (en) * 1989-07-26 1993-02-09 Avco Corporation Tooling and method for consolidating a filamentary reinforced metal matrix composite
JP2004001054A (en) * 2002-06-03 2004-01-08 New Industry Research Organization Butt-joining method
JP2010094712A (en) * 2008-10-16 2010-04-30 Sekisou Kanagata Co Ltd Diffusion bonding method
CN103624393A (en) * 2013-11-21 2014-03-12 中国航空工业集团公司北京航空制造工程研究所 Rigidity restraint hot self-extruding connection method
WO2023248817A1 (en) * 2022-06-22 2023-12-28 株式会社Mole′S Act Method for manufacturing metal bonded body, and method for bonding diecast member

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