JPS57115255U - - Google Patents
Info
- Publication number
- JPS57115255U JPS57115255U JP157981U JP157981U JPS57115255U JP S57115255 U JPS57115255 U JP S57115255U JP 157981 U JP157981 U JP 157981U JP 157981 U JP157981 U JP 157981U JP S57115255 U JPS57115255 U JP S57115255U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP157981U JPS57115255U (ja) | 1981-01-08 | 1981-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP157981U JPS57115255U (ja) | 1981-01-08 | 1981-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57115255U true JPS57115255U (ja) | 1982-07-16 |
Family
ID=29800030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP157981U Pending JPS57115255U (ja) | 1981-01-08 | 1981-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57115255U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007157826A (ja) * | 2005-12-01 | 2007-06-21 | Oki Electric Ind Co Ltd | 半導体装置およびその製造方法、並びにそのリードフレーム |
| JP2008027994A (ja) * | 2006-07-19 | 2008-02-07 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
-
1981
- 1981-01-08 JP JP157981U patent/JPS57115255U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007157826A (ja) * | 2005-12-01 | 2007-06-21 | Oki Electric Ind Co Ltd | 半導体装置およびその製造方法、並びにそのリードフレーム |
| JP2008027994A (ja) * | 2006-07-19 | 2008-02-07 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |