JPS5667210A - Mounting structure of die for molding semiconductor device - Google Patents
Mounting structure of die for molding semiconductor deviceInfo
- Publication number
- JPS5667210A JPS5667210A JP14463079A JP14463079A JPS5667210A JP S5667210 A JPS5667210 A JP S5667210A JP 14463079 A JP14463079 A JP 14463079A JP 14463079 A JP14463079 A JP 14463079A JP S5667210 A JPS5667210 A JP S5667210A
- Authority
- JP
- Japan
- Prior art keywords
- molding die
- die
- runner block
- pushed
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To handle a die readily by a method wherein a molding die is pushed on the mounting surface of a surface plate with a wedge-form binding member that advances together with a feed mechanism and fixed tightly to a runner block.
CONSTITUTION: A molding die 2 is placed on the mounting surface 1a of a surface plate, side end surfaces of projections 21, 21 are inserted into quide surfaces 24 of guide members 23, 23 and the point surface 2a of the molding die 2 is brought into contact with the rear end surface 15a of a runner block 15. Then, when feed mechanisms 31, 31 are revolved and advanced toward the runner block 15, wedge- form binding members 27, 27 are advanced, the molding die 2 is pushed on a mounting surface 1a of the surface plate 2 and the point surface 2a of the molding die 2 is pushed on the rear end surface 15a of the runner block. Thus, the molding die is handled readily.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14463079A JPS5667210A (en) | 1979-11-07 | 1979-11-07 | Mounting structure of die for molding semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14463079A JPS5667210A (en) | 1979-11-07 | 1979-11-07 | Mounting structure of die for molding semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5667210A true JPS5667210A (en) | 1981-06-06 |
Family
ID=15366506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14463079A Pending JPS5667210A (en) | 1979-11-07 | 1979-11-07 | Mounting structure of die for molding semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5667210A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63319116A (en) * | 1987-06-24 | 1988-12-27 | Osada Michio | Method for mounting resin mold and mold fixing device |
| JPH0677270A (en) * | 1992-08-24 | 1994-03-18 | Nec Corp | Molding die fixing mechanism |
| WO2020217702A1 (en) * | 2019-04-25 | 2020-10-29 | Ｔｏｗａ株式会社 | Resin molding device and method for manufacturing resin molded article |
| WO2020217703A1 (en) * | 2019-04-25 | 2020-10-29 | Ｔｏｗａ株式会社 | Resin molding device and manufacturing method for resin molded article |
-
1979
- 1979-11-07 JP JP14463079A patent/JPS5667210A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63319116A (en) * | 1987-06-24 | 1988-12-27 | Osada Michio | Method for mounting resin mold and mold fixing device |
| JPH0677270A (en) * | 1992-08-24 | 1994-03-18 | Nec Corp | Molding die fixing mechanism |
| WO2020217702A1 (en) * | 2019-04-25 | 2020-10-29 | Ｔｏｗａ株式会社 | Resin molding device and method for manufacturing resin molded article |
| WO2020217703A1 (en) * | 2019-04-25 | 2020-10-29 | Ｔｏｗａ株式会社 | Resin molding device and manufacturing method for resin molded article |
| JP2020179604A (en) * | 2019-04-25 | 2020-11-05 | Ｔｏｗａ株式会社 | Resin molding device and method for manufacturing resin molding |
| JP2020179603A (en) * | 2019-04-25 | 2020-11-05 | Ｔｏｗａ株式会社 | Resin molding device and method for manufacturing resin molding |
| CN113597365A (en) * | 2019-04-25 | 2021-11-02 | 东和株式会社 | Resin molding device and method for manufacturing resin molded product |
| CN113597365B (en) * | 2019-04-25 | 2023-09-22 | 东和株式会社 | Method for producing resin molded article |
| US11969922B2 (en) | 2019-04-25 | 2024-04-30 | Towa Corporation | Method for manufacturing resin molded product |
| US11992982B2 (en) | 2019-04-25 | 2024-05-28 | Towa Corporation | Method for manufacturing resin molded product |
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