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JPS5666374A - Soldering method - Google Patents

Soldering method

Info

Publication number
JPS5666374A
JPS5666374A JP14177179A JP14177179A JPS5666374A JP S5666374 A JPS5666374 A JP S5666374A JP 14177179 A JP14177179 A JP 14177179A JP 14177179 A JP14177179 A JP 14177179A JP S5666374 A JPS5666374 A JP S5666374A
Authority
JP
Japan
Prior art keywords
inert gas
soldering
heated
solder
easy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14177179A
Other languages
Japanese (ja)
Inventor
Yuji Sogabe
Noboru Koizumi
Kazuro Okuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14177179A priority Critical patent/JPS5666374A/en
Publication of JPS5666374A publication Critical patent/JPS5666374A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To peform soldering to a metal which is easy-to-oxidize and is easy to corrode with good workability without oxidizing by blowing a heated inert gas to the soldered part.
CONSTITUTION: In soldering an insulation substrate 1 by applying a solder 2 on the Al 2 provided onto said substrate, a nichrome wire 6 is provided in a hot wind generator 5 comprising heat-resistant glass having a lead-in port 4 feeding an inert gas such as nitrogen or argon, and this nichrome wire 6 is regulated by a temp. regulator 7, thence the inert gas heated to 500W550°C is injected to the soldering part from the nozzle 8 of the hot wind generator 5. Since the soldered part is heated by the inert gas in this way, the oxidation of the surface of the Al 2 and the solder 3 owing to the oxygen in the air does not occur.
COPYRIGHT: (C)1981,JPO&Japio
JP14177179A 1979-10-31 1979-10-31 Soldering method Pending JPS5666374A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14177179A JPS5666374A (en) 1979-10-31 1979-10-31 Soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14177179A JPS5666374A (en) 1979-10-31 1979-10-31 Soldering method

Publications (1)

Publication Number Publication Date
JPS5666374A true JPS5666374A (en) 1981-06-04

Family

ID=15299787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14177179A Pending JPS5666374A (en) 1979-10-31 1979-10-31 Soldering method

Country Status (1)

Country Link
JP (1) JPS5666374A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994568A (en) * 1982-11-19 1984-05-31 エツセジ−エツセ−アテイイ−エツセ・コンポネンテイ・エレツトロニ−チ・ソチエタ・ペル・アノニマ Method of welding and fitting semiconductor chip onto non-precious metal substrate
JPH06315766A (en) * 1993-04-30 1994-11-15 Kuroda Denki Kk Method and device for soldering for oxidation inhibition
US8740040B2 (en) * 2012-07-31 2014-06-03 Samsung Electro-Mechanics Co., Ltd. Solder injection head

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994568A (en) * 1982-11-19 1984-05-31 エツセジ−エツセ−アテイイ−エツセ・コンポネンテイ・エレツトロニ−チ・ソチエタ・ペル・アノニマ Method of welding and fitting semiconductor chip onto non-precious metal substrate
JPH06315766A (en) * 1993-04-30 1994-11-15 Kuroda Denki Kk Method and device for soldering for oxidation inhibition
US8740040B2 (en) * 2012-07-31 2014-06-03 Samsung Electro-Mechanics Co., Ltd. Solder injection head

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