JPS5664624A - Enclosing device for measuring element - Google Patents
Enclosing device for measuring elementInfo
- Publication number
- JPS5664624A JPS5664624A JP13986079A JP13986079A JPS5664624A JP S5664624 A JPS5664624 A JP S5664624A JP 13986079 A JP13986079 A JP 13986079A JP 13986079 A JP13986079 A JP 13986079A JP S5664624 A JPS5664624 A JP S5664624A
- Authority
- JP
- Japan
- Prior art keywords
- measuring element
- flange
- contact
- responsiveness
- bellows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Measurement Of Radiation (AREA)
Abstract
PURPOSE: To enhance the responsiveness and to facilitate the maintenance, inspection, and replacement by using freely expandable bellows.
CONSTITUTION: In an outer tube 1 provided with an opening flange 1a' is inserted the measuring element 2. A flange shaped projection 5 is provided at the appropriate position on the outer periphery of the measuring element 2. Then, freely expandable bellows 6 is positioned between the projection 5 and a holding flange 3 which is attached on the top of the opening flange 1a. Thus, the bellows 6 compresses a temperature sensing contact 2b of a sheath shaped thermocouple 2a of the measuring element 2 to the inner surface of a blocking wall 1b. Therefore, the sheath shaped thermocouple 2a is always kept at the constant position. Even though the temperature sensing contact 2b of the sheath shaped thermocouple 2a is vibrated, it is always compressed to the inner surface of the blocking wall 1b, the thermal resistance at the contact point is small, the reduction in the responsiveness which may occur easily when the measurement is performed without contact can be prevented, and the inspection, maintenance, and replacement of the measuring element can be readily performed when the holding flange 3 is removed.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13986079A JPS5664624A (en) | 1979-10-31 | 1979-10-31 | Enclosing device for measuring element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13986079A JPS5664624A (en) | 1979-10-31 | 1979-10-31 | Enclosing device for measuring element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5664624A true JPS5664624A (en) | 1981-06-01 |
Family
ID=15255217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13986079A Pending JPS5664624A (en) | 1979-10-31 | 1979-10-31 | Enclosing device for measuring element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5664624A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01171333U (en) * | 1988-05-23 | 1989-12-05 | ||
JP2009042070A (en) * | 2007-08-09 | 2009-02-26 | Sei Hybrid Kk | Temperature measuring device for semiconductor manufacturing device, and semiconductor manufacturing device loaded therewith |
JP2011153831A (en) * | 2010-01-26 | 2011-08-11 | Hitachi-Ge Nuclear Energy Ltd | Device for monitoring radiation in discharge canal of nuclear power plant |
JP2016001136A (en) * | 2014-06-12 | 2016-01-07 | 日立Geニュークリア・エナジー株式会社 | Nuclear power plant inspection device attachment method and nuclear power plant inspection device attachment structure |
-
1979
- 1979-10-31 JP JP13986079A patent/JPS5664624A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01171333U (en) * | 1988-05-23 | 1989-12-05 | ||
JP2009042070A (en) * | 2007-08-09 | 2009-02-26 | Sei Hybrid Kk | Temperature measuring device for semiconductor manufacturing device, and semiconductor manufacturing device loaded therewith |
JP2011153831A (en) * | 2010-01-26 | 2011-08-11 | Hitachi-Ge Nuclear Energy Ltd | Device for monitoring radiation in discharge canal of nuclear power plant |
JP2016001136A (en) * | 2014-06-12 | 2016-01-07 | 日立Geニュークリア・エナジー株式会社 | Nuclear power plant inspection device attachment method and nuclear power plant inspection device attachment structure |
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