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JPS5662868A - Radically curable adhesive composition - Google Patents

Radically curable adhesive composition

Info

Publication number
JPS5662868A
JPS5662868A JP14011679A JP14011679A JPS5662868A JP S5662868 A JPS5662868 A JP S5662868A JP 14011679 A JP14011679 A JP 14011679A JP 14011679 A JP14011679 A JP 14011679A JP S5662868 A JPS5662868 A JP S5662868A
Authority
JP
Japan
Prior art keywords
formula
epoxy compound
acrylate
epoxy
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14011679A
Other languages
Japanese (ja)
Other versions
JPS6155555B2 (en
Inventor
Hiroshi Fujimoto
Hideo Miyake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP14011679A priority Critical patent/JPS5662868A/en
Publication of JPS5662868A publication Critical patent/JPS5662868A/en
Publication of JPS6155555B2 publication Critical patent/JPS6155555B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE: The titled composition having improved adhesiveness between metals not sandblasted, etc., prepared by incorporating a specific amount of an epoxy compound into a composition consisting of a urethane-modified acrylate, an epoxy acrylate and a copolymerizable monomer.
CONSTITUTION: A composition prepared by incorporating (B) 5W50wt% epoxy compound of formula III, e.g. hydroquinone glycidyl ether, into (A) a resin composition containing (i) a urethane-modified acrylate of formula I (R1 is bivalent organic residue; R2 is organic diisocyanate; R3 is polyhydric alcohol residue; R4 is H or methyl; m is 0W5; n is 1W3; R1 and R3 contain 11 or more propylene oxide units), (ii) an epoxy acrylate, e.g. the reaction product of acrylic acid with an epoxy compound of formula II (n is 0W4; R is H, lower alkyl. etc.) at a weight ratio between the components (i) and (ii) of 0:100W90:10, and (iii) 5W60wt% monomer copolymerizable with them.
COPYRIGHT: (C)1981,JPO&Japio
JP14011679A 1979-10-29 1979-10-29 Radically curable adhesive composition Granted JPS5662868A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14011679A JPS5662868A (en) 1979-10-29 1979-10-29 Radically curable adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14011679A JPS5662868A (en) 1979-10-29 1979-10-29 Radically curable adhesive composition

Publications (2)

Publication Number Publication Date
JPS5662868A true JPS5662868A (en) 1981-05-29
JPS6155555B2 JPS6155555B2 (en) 1986-11-28

Family

ID=15261280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14011679A Granted JPS5662868A (en) 1979-10-29 1979-10-29 Radically curable adhesive composition

Country Status (1)

Country Link
JP (1) JPS5662868A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01126316A (en) * 1987-11-10 1989-05-18 Dainippon Toryo Co Ltd Composition for coating in mold
CN100392039C (en) * 2006-05-22 2008-06-04 中国科学院广州化学研究所 Modified ethenyl resin grouting material and its preparation method and construction method
JP2011530648A (en) * 2008-08-11 2011-12-22 ダウ グローバル テクノロジーズ エルエルシー One-part structural epoxy resin adhesive containing elastomeric toughener capped with phenol and hydroxy-terminated acrylate or hydroxy-terminated methacrylate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02304277A (en) * 1989-05-17 1990-12-18 Tsumura & Co Sealing mechanism for multipoint line automatic switching device of liquid treating plant

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01126316A (en) * 1987-11-10 1989-05-18 Dainippon Toryo Co Ltd Composition for coating in mold
CN100392039C (en) * 2006-05-22 2008-06-04 中国科学院广州化学研究所 Modified ethenyl resin grouting material and its preparation method and construction method
JP2011530648A (en) * 2008-08-11 2011-12-22 ダウ グローバル テクノロジーズ エルエルシー One-part structural epoxy resin adhesive containing elastomeric toughener capped with phenol and hydroxy-terminated acrylate or hydroxy-terminated methacrylate

Also Published As

Publication number Publication date
JPS6155555B2 (en) 1986-11-28

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