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JPS5661152A - Integrated circuit cooler - Google Patents

Integrated circuit cooler

Info

Publication number
JPS5661152A
JPS5661152A JP13639879A JP13639879A JPS5661152A JP S5661152 A JPS5661152 A JP S5661152A JP 13639879 A JP13639879 A JP 13639879A JP 13639879 A JP13639879 A JP 13639879A JP S5661152 A JPS5661152 A JP S5661152A
Authority
JP
Japan
Prior art keywords
pins
heatsink
board
holes
heat exchanging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13639879A
Other languages
Japanese (ja)
Inventor
Noriyuki Ashiwake
Takahiro Oguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13639879A priority Critical patent/JPS5661152A/en
Publication of JPS5661152A publication Critical patent/JPS5661152A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a high cooling effect by a constitution wherein holes are made in a heatsink in such a way that they correspond to the plural number of connecting pins provided on the back of a ceramic board to which the plural number of IC chips have been attached, while a heat exchanging liquid is circulated in the heatsink after the pins are inserted into the holes to combine the board with the heatsink. CONSTITUTION:A number of IC chips 2 are attached to the upper surface of a ceramic board 1 where a number of connecting pins 10 are provided so that they point downward, and signal connecting pins 3 prepared at both the end of the board on its upper side are connected to a multilayer printed circuit board 4. Next, the connecting pins 10 are allowed to touch the heatsink 5, when the pins 10 are inserted into the holes or grooves 11 made in such a way that they correspond to the pins 10. A heat exchanging liquid 6 is made to flow from an inlet 7 into a hollow portion of the sink 5 which functions as a heat exchanging chamber and to flow out from an outlet 8. The circulation of the liquid in that way is used to fully cool the pins 10 inserted in the grooves 11.
JP13639879A 1979-10-24 1979-10-24 Integrated circuit cooler Pending JPS5661152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13639879A JPS5661152A (en) 1979-10-24 1979-10-24 Integrated circuit cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13639879A JPS5661152A (en) 1979-10-24 1979-10-24 Integrated circuit cooler

Publications (1)

Publication Number Publication Date
JPS5661152A true JPS5661152A (en) 1981-05-26

Family

ID=15174224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13639879A Pending JPS5661152A (en) 1979-10-24 1979-10-24 Integrated circuit cooler

Country Status (1)

Country Link
JP (1) JPS5661152A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02192149A (en) * 1989-01-19 1990-07-27 Nec Corp Cooling structure of lsi package
EP1734577A1 (en) * 2005-06-16 2006-12-20 ABB Research Ltd Cooling device and semiconductor module with such a cooling device
EP3459324A4 (en) * 2016-08-08 2019-06-12 Samsung Electronics Co., Ltd. Printed circuit board assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02192149A (en) * 1989-01-19 1990-07-27 Nec Corp Cooling structure of lsi package
EP1734577A1 (en) * 2005-06-16 2006-12-20 ABB Research Ltd Cooling device and semiconductor module with such a cooling device
EP3459324A4 (en) * 2016-08-08 2019-06-12 Samsung Electronics Co., Ltd. Printed circuit board assembly
US10925148B2 (en) 2016-08-08 2021-02-16 Samsung Electronics Co., Ltd. Printed circuit board assembly

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